Patents by Inventor Akihiko Tadaoka

Akihiko Tadaoka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor Device
    Publication number: 20110309483
    Abstract: A semiconductor device that can cope with larger numbers of pins and finer pitches while suppressing lowering of the manufacturing yield and reliability includes: a semiconductor chip having a plurality of electrodes provided on an upper surface thereof; a plurality of lead terminals including inner lead portions disposed toward the semiconductor chip; a sheet-form wiring member having a plurality of conductors insulated from one another on one main surface thereof; and a sealing-resin layer for sealing at least the semiconductor chip, the inner lead portions and the wiring member. The electrodes of the semiconductor device and the inner lead portions of the lead terminals are electrically connected respectively to each other via the conductors of the wiring member.
    Type: Application
    Filed: August 26, 2011
    Publication date: December 22, 2011
    Applicant: Rohm Co., Ltd.
    Inventor: Akihiko Tadaoka
  • Semiconductor device
    Patent number: 8030766
    Abstract: A semiconductor device that can cope with larger numbers of pins and finer pitches while suppressing lowering of the manufacturing yield and reliability includes: a semiconductor chip having a plurality of electrodes provided on an upper surface thereof; a plurality of lead terminals including inner lead portions disposed toward the semiconductor chip; a sheet-form wiring member having a plurality of conductors insulated from one another on one main surface thereof; and a sealing-resin layer for sealing at least the semiconductor chip, the inner lead portions and the wiring member. The electrodes of the semiconductor device and the inner lead portions of the lead terminals are electrically connected respectively to each other via the conductors of the wiring member.
    Type: Grant
    Filed: October 17, 2008
    Date of Patent: October 4, 2011
    Assignee: Rohm Co., Ltd.
    Inventor: Akihiko Tadaoka
  • Semiconductor Device
    Publication number: 20090102029
    Abstract: A semiconductor device that can cope with larger numbers of pins and finer pitches while suppressing lowering of the manufacturing yield and reliability includes: a semiconductor chip having a plurality of electrodes provided on an upper surface thereof; a plurality of lead terminals including inner lead portions disposed toward the semiconductor chip; a sheet-form wiring member having a plurality of conductors insulated from one another on one main surface thereof; and a sealing-resin layer for sealing at least the semiconductor chip, the inner lead portions and the wiring member. The electrodes of the semiconductor device and the inner lead portions of the lead terminals are electrically connected respectively to each other via the conductors of the wiring member.
    Type: Application
    Filed: October 17, 2008
    Publication date: April 23, 2009
    Applicant: Rohm Co., Ltd.
    Inventor: Akihiko Tadaoka