Abstract: A solution containing polymer-bound metal nanoparticles is deposited onto a substrate, at least the surface of which is insulating, to form a pattern, the substrate is dried, and then the pattern is subjected to plasma exposure.

Abstract: A wiring board provided with a line 1, a shield pattern 2 formed in parallel with the line 1, a conductor layer 4 formed so as to face the line 1 and the shield pattern 2 through an insulating layer 3, a conductor layer 6 formed so as to face the line 1 and the shield pattern 2 through an insulating layer 5, and conductive pillars 7a, 7b for connecting the conductor layer 4 to the conductor layer 6. The conductive pillars 7a, 7b are connected to each other through the shield pattern 2. In the above structure, by supplying the ground potential to the shield pattern 2, conductor layers 4, 6, and conductive pillars 7a, 7b, an electromagnetic field is blocked in the direction where the line 1 extends over 360° about the line 1.