Patents by Inventor Akihiko Uzawa

Akihiko Uzawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Holder for polished work and manufacturing method thereof
    Patent number: 6579160
    Abstract: The inner circumferential surface of through holes in a metal plate is chamfered or put to anchor fabrication and a thermoplastic resin is injection molding to the inner circumferential surface of the through hole thereby forming a resin portion over the entire surface of the through hole and the resin portion is removed by grinding while leaving the peripheral portion of the resin portion thereby forming a polished work holding hole. Thus, when a resin portion is formed to the inner circumference of the holding hole in a polished work holder comprising a metal plate, the production is high and the cost is reduced, and the resin portion is not detached from the bonding portion with no use of the adhesive.
    Type: Grant
    Filed: July 9, 2001
    Date of Patent: June 17, 2003
    Assignees: Sumitomo Bakelite Company Limited, Artlite Kogyo Co., Ltd., UTK System Co., Ltd., C.R.T. Co., Ltd.
    Inventors: Motoyuki Nanjo, Kouji Uchihata, Akihiko Uzawa, Kuniyuki Kanai
  • Holder for polished work and manufacturing method thereof
    Publication number: 20020077046
    Abstract: The inner circumferential surface of through holes in a metal plate is chamfered or put to anchor fabrication and a thermoplastic resin is injection molding to the inner circumferential surface of the through hole thereby forming a resin portion over the entire surface of the through hole and the resin portion is removed by grinding while leaving the peripheral portion of the resin portion thereby forming a polished work holding hole. Thus, when a resin portion is formed to the inner circumference of the holding hole in a polished work holder comprising a metal plate, the production is high and the cost is reduced, and the resin portion is not detached from the bonding portion with no use of the adhesive.
    Type: Application
    Filed: July 9, 2001
    Publication date: June 20, 2002
    Applicant: SUMITOMO BAKELITE COMPANY LIMITED
    Inventors: Motoyuki Nanjo, Kouji Uchihata, Akihiko Uzawa, Kuniyuki Kanai
  • Glass substrate chamfering method and apparatus
    Patent number: 6341999
    Abstract: A method for glass substrate chamfering using a metal-bonded outer-surface grindstone 12 for simultaneously processing the end surface and the oblique surfaces of the outer periphery of a doughnut-like glass substrate 1 with a circular hole 1a at the center thereof, and a metal-bonded inner-surface grindstone 14 for simultaneously processing the end surface and the oblique surfaces of the inner periphery are provided; the outer-surface grindstone and the inner-surface grindstone simultaneously grind end surfaces and oblique surfaces of the outer and inner peripheries of the glass substrate, and during grinding, the outer-surface grindstone is sharpened by dressing it electrolytically, and the inner-surface grindstone is sharpened by an electrolytic dressing when not processing as the glass substrate is being replaced.
    Type: Grant
    Filed: September 26, 2000
    Date of Patent: January 29, 2002
    Assignees: Riken, Utksystem Corporation, The Nexsys Corporation
    Inventors: Hitoshi Ohmori, Muneaki Asami, Akihiko Uzawa, Sadamasa Shigitani