Abstract: A test circuit for testing a semiconductor device including semiconductor chips, includes: a test input terminal configured to receive data for testing the semiconductor device; signal paths provided between one semiconductor chip in the semiconductor chips and another semiconductor chip in the semiconductor chips, data supplied to the test input terminal being transmitted through the signal paths; a select signal generator, provided in the one semiconductor chip and coupled to the another semiconductor chip via the signal paths, configured to generate, when receiving data indicating expected values via one or more signal paths in the signal paths, a select signal indicating the one or more signal paths; and a path selector, provided in the at least one semiconductor chip and coupled to the signal paths, configured to select, based on the select signal, signal paths to be used at the time of testing the semiconductor device.

Abstract: A test circuit, provided to a semiconductor device including a plurality of semiconductor chips, includes: a test clock terminal provided to a first chip; a plurality of clock paths disposed between the first chip and a second chip through which the test clock is transmitted from the first chip to the second chip; a test unit provided to the second chip for testing the second chip by using the test clock transmitted to the second chip; a clock detection unit provided to the second chip, and detects the test clock that is received through each of the plurality of clock paths; and a clock path selection unit which is provided to the second chip, selects a first clock path among the plurality of clock paths as a test clock path, and supplies the test clock transmitted through the test clock path to the test unit.

Abstract: A semiconductor device includes: a plurality of semiconductor chips which are stacked; a plurality of circuit blocks respectively included in the plurality of semiconductor chips; a first power supply domain that supplies power and stops the supply of the power to one of the plurality of circuit blocks independently of the other circuit blocks; and a second power supply domain that supplies power and stops the supply of the power to at least two of the plurality of circuit blocks in common and supplies the power and stops the supply of the power independently of the other circuit blocks.

Abstract: A semiconductor device includes: a plurality of semiconductor chips which are stacked; a plurality of circuit blocks respectively included in the plurality of semiconductor chips; a first power supply domain that supplies power and stops the supply of the power to one of the plurality of circuit blocks independently of the other circuit blocks; and a second power supply domain that supplies power and stops the supply of the power to at least two of the plurality of circuit blocks in common and supplies the power and stops the supply of the power independently of the other circuit blocks.

Abstract: A test circuit, provided to a semiconductor device including a plurality of semiconductor chips, includes: a test clock terminal provided to a first chip; a plurality of clock paths disposed between the first chip and a second chip through which the test clock is transmitted from the first chip to the second chip; a test unit provided to the second chip for testing the second chip by using the test clock transmitted to the second chip; a clock detection unit provided to the second chip, and detects the test clock that is received through each of the plurality of clock paths; and a clock path selection unit which is provided to the second chip, selects a first clock path among the plurality of clock paths as a test clock path, and supplies the test clock transmitted through the test clock path to the test unit.

Abstract: A test circuit for testing a semiconductor device including semiconductor chips, includes: a test input terminal configured to receive data for testing the semiconductor device; signal paths provided between one semiconductor chip in the semiconductor chips and another semiconductor chip in the semiconductor chips, data supplied to the test input terminal being transmitted through the signal paths; a select signal generator, provided in the one semiconductor chip and coupled to the another semiconductor chip via the signal paths, configured to generate, when receiving data indicating expected values via one or more signal paths in the signal paths, a select signal indicating the one or more signal paths; and a path selector, provided in the at least one semiconductor chip and coupled to the signal paths, configured to select, based on the select signal, signal paths to be used at the time of testing the semiconductor device.