Patents by Inventor Akihiro Egami
Akihiro Egami has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250045483Abstract: This information processing apparatus comprises a simulation circuit that sets the operation of a device included in a network, and that simulates the operation of the network; and a display circuit that displays the result of the simulation and setting information indicating setting contents of the device on a display apparatus.Type: ApplicationFiled: June 10, 2022Publication date: February 6, 2025Inventors: Akihiro EGAMI, Takenori SAKAMOTO, Hiroshi TAKAHASHI, Naganori SHIRAKATA, Koji TAKINAMI
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Patent number: 12203062Abstract: The present invention is to provide a cell chip and a three-dimensional tissue chip and a production method therefor such that even when a highly viscous cell-containing solution is a material, the highly safe and reproducible cell chip or three-dimensional tissue chip with a desired application volume can be produced within a short time and in a large quantity so as to have a desired cell density and exhibit high cell viability.Type: GrantFiled: November 1, 2018Date of Patent: January 21, 2025Assignees: OSAKA UNIVERSITY, NTN CORPORATIONInventors: Mitsuru Akashi, Takami Akagi, Masaki Egami, Akihiro Yamanaka, Haruka Nakamura, Toukokuryuu Ai
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Patent number: 12148297Abstract: An in-vehicle apparatus to be mounted in a vehicle includes receiving circuitry, which, in operation, receives, from a roadside apparatus providing a distribution service of a road video, an advertisement message indicating that the distribution service is provided; control circuitry, which, in operation, generates, based on reception of the advertisement message, a message regarding transmission of the road video to the roadside apparatus; and transmitting circuitry, which, in operation, transmits the message to the roadside apparatus.Type: GrantFiled: January 17, 2023Date of Patent: November 19, 2024Assignee: Panasonic Intellectual Property Management CO., Ltd.Inventors: Takenori Sakamoto, Hiroyuki Motozuka, Kosei Nakano, Akihiro Egami, Masataka Irie
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Publication number: 20230171834Abstract: A radio communication apparatus includes: processing circuitry, which, in operation, scans a radio connection destination candidate; and control circuitry, which, in operation, determines, when first initial-connection processing to the connection destination target fails, a start timing of second-initial connection processing based on a cause of the failure. The processing circuitry scans the connection destination candidate based on the start timing of the second initial-connection processing.Type: ApplicationFiled: January 25, 2023Publication date: June 1, 2023Inventors: Kosei NAKANO, Hiroyuki MOTOZUKA, Takenori SAKAMOTO, Akihiro EGAMI, Masataka IRIE, Yao Huang Gaius WEE
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Publication number: 20230141726Abstract: A communication apparatus mounted on a vehicle includes: a first communication circuit that operates as an access point of an infrastructure mode and transmits and receives a radio wave toward and from a front side of the vehicle; and a second communication circuit that operates as a station of an infrastructure mode and transmits and receives a radio wave toward and from the front side of the vehicle.Type: ApplicationFiled: January 11, 2023Publication date: May 11, 2023Inventors: Hiroyuki MOTOZUKA, Kosei NAKANO, Takenori SAKAMOTO, Akihiro EGAMI, Masataka IRIE
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Publication number: 20230005303Abstract: Provided is a roadside unit including: communication circuitry, which, in operation, receives data transmitted from an on-board unit and transfers the data to a server; and control circuitry, which, in operation, suspends, in a case where the communication circuitry has received an upload resume request for the data from the on-board unit while the data is being transferred to the server, transfer of the upload resume request to the server.Type: ApplicationFiled: September 7, 2022Publication date: January 5, 2023Inventors: Akihiro EGAMI, Hiroyuki MOTOZUKA, Takenori SAKAMOTO
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Patent number: 9194038Abstract: The inventors of this invention conducted a test and found out that to prevent peel-off of an adherent film, it is not of essential importance to set the radius of curvature equal to or larger than a predetermined threshold. The inventors of the present invention also found out that peel-off of an adherent film occurs in the region in which the curvature of a shield changes and is less likely to occur when the change in curvature of the shield is small. Accordingly, the key to the problem is the magnitude of a change in curvature of the shield, so changing the curvature stepwise makes it possible to suppress a large change in curvature, and thus to prevent peel-off of an adherent film free from any disadvantages such as deterioration in film thickness distribution, which may occur due to an increase in size of the shield.Type: GrantFiled: December 21, 2010Date of Patent: November 24, 2015Assignee: CANON ANELVA CORPORATIONInventors: Akihiro Egami, Toshikazu Nakazawa, Katsuhiro Suzuki, Shinya Hasegawa
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Patent number: 8198182Abstract: In an atmosphere in which a silicon carbide (SiC) substrate implanted with impurities is annealed to activate the impurities, by setting a partial pressure of H2O to be not larger than 10?2 Pa, preferably not larger than 10?3 Pa, surface irregularity of the silicon carbide (SiC) substrate is controlled to be not greater than 2 nm, more preferably not greater than 1 nm in RMS value.Type: GrantFiled: January 19, 2011Date of Patent: June 12, 2012Assignee: Canon Anelva CorporationInventors: Masami Shibagaki, Akihiro Egami
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Patent number: 8150243Abstract: A heating process apparatus includes a process chamber, a heat-processed object support member provided in the process chamber for heating a substrate disposed thereon, a cap for covering the substrate disposed on the heat-processed object support member, a heater for heating the heat-processed object support member, a temperature measuring unit for measuring the temperature of the heat-processed object support member, and a controller for controlling the heater. A first measuring unit measures a temperature of the cap, and the controller controls the heater so as to set the cap temperature to a predetermined temperature. A second measuring unit measures a temperature of the heat-processed object support member, and the controller turns off the heater when the temperature of the heat-processed object support member exceeds an over-heat critical temperature.Type: GrantFiled: November 5, 2009Date of Patent: April 3, 2012Assignee: Canon Anelva CorporationInventors: Akira Kumagai, Masami Shibagaki, Kenji Numajiri, Akihiro Egami
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Patent number: 8007633Abstract: This surface processing apparatus has a reactor in which plasma is generated and a substrate whose surface is to be processed by the plasma is arranged, and a magnet plate for creating a point-cusp magnetic field distributed in an inner space of the reactor, in which the plasma is generated. The magnet plate has a plurality of magnets. These magnets are arranged by a honeycomb lattice structure in a circular plane facing in parallel a surface of the substrate. One magnetic pole end face of each of magnets is arranged at a position of each of the lattice points forming hexagonal shapes on the circular plane. The polarities of the magnetic pole end faces of two adjoining magnets are arranged to become opposite alternately. The magnet plate may be provided with a plurality of magnets arranged by a lattice structure forming a square and the magnetic force (coercive force) of some of the magnets arranged at the outermost region is reduced.Type: GrantFiled: March 28, 2011Date of Patent: August 30, 2011Assignee: Canon Anelva CorporationInventors: Akihiro Egami, Masayoshi Ikeda, Yasumi Sago, Yukito Nakagawa
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Publication number: 20110174221Abstract: This surface processing apparatus has a reactor in which plasma is generated and a substrate whose surface is to be processed by the plasma is arranged, and a magnet plate for creating a point-cusp magnetic field distributed in an inner space of the reactor, in which the plasma is generated. The magnet plate has a plurality of magnets. These magnets are arranged by a honeycomb lattice structure in a circular plane facing in parallel a surface of the substrate. One magnetic pole end face of each of magnets is arranged at a position of each of the lattice points forming hexagonal shapes on the circular plane. The polarities of the magnetic pole end faces of two adjoining magnets are arranged to become opposite alternately. The magnet plate may be provided with a plurality of magnets arranged by a lattice structure forming a square and the magnetic force (coercive force) of some of the magnets arranged at the outermost region is reduced.Type: ApplicationFiled: March 28, 2011Publication date: July 21, 2011Applicant: CANON ANELVA CORPORATIONInventors: Akihiro Egami, Masayoshi Ikeda, Yasumi Sago, Yukito Nakagawa
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Publication number: 20110155059Abstract: The inventors of this invention conducted a test and found out that to prevent peel-off of an adherent film, it is not of essential importance to set the radius of curvature equal to or larger than a predetermined threshold. The inventors of the present invention also found out that peel-off of an adherent film occurs in the region in which the curvature of a shield changes and is less likely to occur when the change in curvature of the shield is small. Accordingly, the key to the problem is the magnitude of a change in curvature of the shield, so changing the curvature stepwise makes it possible to suppress a large change in curvature, and thus to prevent peel-off of an adherent film free from any disadvantages such as deterioration in film thickness distribution, which may occur due to an increase in size of the shield.Type: ApplicationFiled: December 21, 2010Publication date: June 30, 2011Applicant: CANON ANELVA CORPORATIONInventors: Akihiro Egami, Toshikazu Nakazawa, Katsuhiro Suzuki, Shinya Hasegawa
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Publication number: 20110121317Abstract: In an atmosphere in which a silicon carbide (SiC) substrate implanted with impurities is annealed to activate the impurities, by setting a partial pressure of H2O to be not larger than 10?2 Pa, preferably not larger than 10?3 Pa, surface irregularity of the silicon carbide (SiC) substrate is controlled to be not greater than 2 nm, more preferably not greater than 1 nm in RMS value.Type: ApplicationFiled: January 19, 2011Publication date: May 26, 2011Applicant: CANON ANELVA CORPORATIONInventors: Masami Shibagaki, Akihiro Egami
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Patent number: 7897523Abstract: A substrate heating apparatus having a conductive heater which heats a substrate includes a filament arranged in the conductive heater and connected to a filament power supply to generate thermoelectrons, and an acceleration power supply which accelerates the thermoelectrons between the filament and conductive heater. The filament has inner peripheral portions formed at a predetermined interval along an inner circle concentric with the substrate, outer peripheral portions formed at a predetermined interval on an outer circle concentric with the inner circle and having a diameter larger than that of the inner circle, and a region formed by connecting the end point of each inner peripheral portions and the end point of a corresponding one of the outer peripheral portions.Type: GrantFiled: January 27, 2009Date of Patent: March 1, 2011Assignees: Canon Anelva Engineering Corporation, Canon Anelva CorporationInventors: Masami Shibagaki, Hiroshi Doi, Akihiro Egami, Toshiaki Sasaki, Shinya Hasegawa
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Patent number: 7807553Abstract: A substrate heating apparatus having a heating unit for heating a substrate placed in a process chamber which can be evacuated includes a suscepter which is installed between the heating unit and a substrate, and on which the substrate is mounted, and a heat receiving member which is installed to oppose the suscepter with the substrate being sandwiched between them, and receives heat from the heating unit via the suscepter. A ventilating portion which allows a space formed between the heat receiving member and substrate to communicate with a space in the process chamber is formed.Type: GrantFiled: December 6, 2007Date of Patent: October 5, 2010Assignee: Canon Anelva CorporationInventors: Masami Shibagaki, Kenji Numajiri, Akihiro Egami, Akira Kumagai, Susumu Akiyama
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Publication number: 20100111512Abstract: An object of the present invention is to provide a heating process apparatus capable of being controlled to a constant temperature and to temperatures in a high-temperature range higher than or equal to a 1850 degrees.Type: ApplicationFiled: November 5, 2009Publication date: May 6, 2010Applicant: CANON ANELVA CORPORATIONInventors: Akira Kumagai, Masami Shibagaki, Kenji Numajiri, Akihiro Egami
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Publication number: 20100025695Abstract: In an atmosphere in which a silicon carbide (SiC) substrate implanted with impurities is annealed to activate the impurities, by setting a partial pressure of H2O to be not larger than 10?2 Pa, preferably not larger than 10?3 Pa, surface irregularity of the silicon carbide (SiC) substrate is controlled to be not greater than 2 nm, more preferably not greater than 1 nm in RMS value.Type: ApplicationFiled: April 20, 2007Publication date: February 4, 2010Applicant: CANON ANELVA CORPORATIONInventors: Masami Shibagaki, Akihiro Egami
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Publication number: 20100006560Abstract: In a substrate heating apparatus including a vacuum vessel with an interior separated by a wall body into a first space and a second space, the first space being evacuated to a vacuum by a first exhaust means and accommodating a substrate to be heated, and the second space being evacuated to a vacuum by a second exhaust means and including a heating means for heating the substrate accommodated in the substrate, the time required to evacuate the first space to a vacuum by the first exhaust means is shortened, thus improving the throughput. The wall body has a non-coating surface, which is not coated, on part of a wall body surface which faces the second space. A coating is formed on the remaining portion of the wall body surface.Type: ApplicationFiled: September 18, 2009Publication date: January 14, 2010Applicant: CANON ANELVA CORPORATIONInventors: Akihiro EGAMI, Akira Kumagai, Kenji Numajiri, Mamami Shibagaki, Seiji Furuya
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Publication number: 20090191724Abstract: A substrate heating apparatus having a conductive heater which heats a substrate includes a filament arranged in the conductive heater and connected to a filament power supply to generate thermoelectrons, and an acceleration power supply which accelerates the thermoelectrons between the filament and conductive heater. The filament has inner peripheral portions formed at a predetermined interval along an inner circle concentric with the substrate, outer peripheral portions formed at a predetermined interval on an outer circle concentric with the inner circle and having a diameter larger than that of the inner circle, and a region formed by connecting the end point of each inner peripheral portions and the end point of a corresponding one of the outer peripheral portions.Type: ApplicationFiled: January 27, 2009Publication date: July 30, 2009Applicants: CANON ANELVA ENGINEERING CORPORATION, CANON ANELVA CORPORATIONInventors: Masami Shibagaki, Hiroshi Doi, Akihiro Egami, Toshiaki Sasaki, Shinya Hasegawa
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Publication number: 20080213988Abstract: A substrate heating apparatus having a heating unit for heating a substrate placed in a process chamber which can be evacuated includes a suscepter which is installed between the heating unit and a substrate, and on which the substrate is mounted, and a heat receiving member which is installed to oppose the suscepter with the substrate being sandwiched between them, and receives heat from the heating unit via the suscepter. A ventilating portion which allows a space formed between the heat receiving member and substrate to communicate with a space in the process chamber is formed.Type: ApplicationFiled: December 6, 2007Publication date: September 4, 2008Applicant: CANON ANELVA CORPORATIONInventors: Masami Shibagaki, Kenji Numajiri, Akihiro Egami, Akira Kumagai, Susumu Akiyama