Patents by Inventor Akihiro EHARA

Akihiro EHARA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10256037
    Abstract: A multilayer ceramic electronic component includes an electronic component element including a ceramic layer and an inner conductor, and outer electrodes disposed on the surface of the electronic component element. The outer electrodes include a first layer disposed on the surface of the electronic component element, and a second layer disposed on the first layer. The first layer includes an oxide of at least one of elements of the ceramic layer. The second layer does not include oxides of elements of the ceramic layer.
    Type: Grant
    Filed: November 30, 2017
    Date of Patent: April 9, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Ai Sasaki, Hiroyuki Asano, Motoyuki Komatsubara, Akihiro Ehara
  • Patent number: 10210993
    Abstract: A multilayer ceramic electronic component includes an electronic component element including a ceramic layer and an inner conductor, and outer electrodes disposed on the surface of the electronic component element. The outer electrodes include a first layer disposed on the surface of the electronic component element, and a second layer disposed on the first layer. The first layer includes an oxide of at least one of elements of the ceramic layer. The second layer does not include oxides of elements of the ceramic layer.
    Type: Grant
    Filed: November 30, 2017
    Date of Patent: February 19, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Ai Sasaki, Hiroyuki Asano, Motoyuki Komatsubara, Akihiro Ehara
  • Publication number: 20180082780
    Abstract: A multilayer ceramic electronic component includes an electronic component element including a ceramic layer and an inner conductor, and outer electrodes disposed on the surface of the electronic component element. The outer electrodes include a first layer disposed on the surface of the electronic component element, and a second layer disposed on the first layer. The first layer includes an oxide of at least one of elements of the ceramic layer. The second layer does not include oxides of elements of the ceramic layer.
    Type: Application
    Filed: November 30, 2017
    Publication date: March 22, 2018
    Inventors: Ai SASAKI, Hiroyuki ASANO, Motoyuki KOMATSUBARA, Akihiro EHARA
  • Patent number: 9236845
    Abstract: A ceramic multilayer component includes a ceramic body including a plurality of ceramic layers stacked on top of one another, internal electrodes located inside the ceramic multilayer body, terminal electrodes located on a mounting surface of the ceramic multilayer body, and via hole conductors that are arranged inside the ceramic multilayer body so as to connect the internal electrodes and the terminal electrodes to each other. An insulating portion is arranged to extend as a single body across a surface of the ceramic multilayer body and across the terminal electrodes. The insulating portion covers at least a portion of each of the via conductors and covers a portion of each of the terminal electrodes when viewed from the mounting surface side.
    Type: Grant
    Filed: November 19, 2013
    Date of Patent: January 12, 2016
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Akihiro Ehara
  • Publication number: 20140203892
    Abstract: A ceramic multilayer component includes a ceramic body including a plurality of ceramic layers stacked on top of one another, internal electrodes located inside the ceramic multilayer body, terminal electrodes located on a mounting surface of the ceramic multilayer body, and via hole conductors that are arranged inside the ceramic multilayer body so as to connect the internal electrodes and the terminal electrodes to each other. An insulating portion is arranged to extend as a single body across a surface of the ceramic multilayer body and across the terminal electrodes. The insulating portion covers at least a portion of each of the via conductors and covers a portion of each of the terminal electrodes when viewed from the mounting surface side.
    Type: Application
    Filed: November 19, 2013
    Publication date: July 24, 2014
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventor: Akihiro EHARA