Abstract: An optical sensor has: a sensing portion having an optical fiber to be disposed at a measurement point of temperature, distortion, pressure etc.; a light source to output a light to the sensing portion; and a photodetector to detect a backscattered light from the sensing portion. The sensing portion has a tape sheet and the optical fiber shaped into a corrugated form with a predetermined curvature. Alternatively, the sensing portion has a polymer optical waveguide with a core shaped into a corrugated form with a predetermined curvature.

Abstract: A photoelectric conversion module with a cooling function has a semiconductor element to transmit/receive an optical signal, a stem to fix the semiconductor element, a cap to cover the semiconductor element, and a lead to apply an electrical signal to the semiconductor element or to transmit an electrical signal from the semiconductor element, wherein on the stem, there is provided a heat releasing device formed of a peltiert element, and a thermal conduction member for heat absorption and a thermal conduction member for heat release provided respectively on both sides of the peltiert element, and the semiconductor element is directly disposed on the thermal conduction member for heat absorption.

Abstract: A communication module mounted on a communication apparatus which includes plural communication modules, plural apparatus side signal processing circuits for processing a communication signal which is transmitted to and received from the communication modules by a predetermined communication speed, and a switch LSI for changing a destination of the communication signal, includes a switching portion for at least one of dividing the communication signal transmitted and received in a communication speed of the communication modules and combining the communication signals transmitted and received in a communication speed of an external apparatus, and a connector comprising a plurality of ports, the connector being connected to the switching portion.

Abstract: A photoelectric composite interconnection assembly having: a flexible substrate having an electric interconnection; and an electrical interface provided at both ends of the electric interconnection. A part of the electric interconnection is replaced by an optical transmission line.

Abstract: An optical fiber temperature sensing device has a sensor body; a light source housed in the sensor body; a temperature measuring optical fiber disposed outside the sensor body and extended to a temperature measurement site, wherein, when a light is emitted from the light source into the temperature measuring optical fiber, Stokes light intensity and anti-Stokes light intensity of backscattered light generated in the temperature measuring optical fiber are detected to determine a temperature at the temperature measurement site; a reference temperature optical fiber disposed inside the sensor body; and a controller that is operable to control an output of the light source by monitoring Stokes light intensity and anti-Stokes light intensity of backscattered light generated in the reference temperature optical fiber.

Abstract: A board assembly, an optical transceiver using same, and a method for mounting a board assembly that can relax a stress occurred at a flexible board. A board assembly 1 comprises a flexible board 2, a first rigid board 3, and a second rigid board 4. The first rigid board 3 and the second rigid board 4 are connected with each other by means of the flexible board 2. Since the flexible board 2 is preformed before the attachment, the stress occurred at the flexible board 2 can be relaxed.

Abstract: An optical sensor has: a sensing portion having an optical fiber to be disposed at a measurement point of temperature, distortion, pressure etc.; a light source to output a light to the sensing portion; and a photodetector to detect a backscattered light from the sensing portion. The sensing portion has a tape sheet and the optical fiber shaped into a corrugated form with a predetermined curvature. Alternatively, the sensing portion has a polymer optical waveguide with a core shaped into a corrugated form with a predetermined curvature.

Abstract: A board assembly, an optical transceiver using same, and a method for mounting a board assembly that can relax a stress occurred at a flexible board. A board assembly 1 comprises a flexible board 2, a first rigid board 3, and a second rigid board 4. The first rigid board 3 and the second rigid board 4 are connected with each other by means of the flexible board 2. Since the flexible board 2 is preformed before the attachment, the stress occurred at the flexible board 2 can be relaxed.

Abstract: An optical transmitter for coupling and wavelength-multiplexing optical signals with a different wavelength has 3 or more light sources for emitting parallel optical signals with a different wavelength, and 2 kinds of optical components with a different optical signal reflectance arranged in an optical path of each light source for coupling into one the optical signals emitted from the light sources respectively. The reflectance or transmittance of each of the 2 kinds of optical components is set so that each optical signal has the same optical signal power when reflected off or transmitted through the optical components for being coupled together and output from the optical transmitter.

Abstract: A photoelectric composite interconnection assembly having: a flexible substrate having an electric interconnection; and an electrical interface provided at both ends of the electric interconnection. A part of the electric interconnection is replaced by an optical transmission line.

Abstract: A photoelectric conversion module with a cooling function has a semiconductor element to transmit/receive an optical signal, a stem to fix the semiconductor element, a cap to cover the semiconductor element, and a lead to apply an electrical signal to the semiconductor element or to transmit an electrical signal from the semiconductor element, wherein on the stem, there is provided a heat releasing device formed of a peltiert element, and a thermal conduction member for heat absorption and a thermal conduction member for heat release provided respectively on both sides of the peltiert element, and the semiconductor element is directly disposed on the thermal conduction member for heat absorption.

Abstract: A transmission/reception optical module has an optical transmission subassembly 182, an optical reception subassembly 183, and a circuit board 1 wherein the circuit board 1 is formed into one member by a rigid/flexible substrate. Circuit board main bodies 2a, 2b, and an optical reception subassembly fixation region 4 are formed by rigid regions 5A, 5b, and 5P. An area provided between the circuit board main body 2a and the optical reception subassembly 4 is composed of a flexible region 6P. A part of the circuit board main body 2 is composed of a flexible region 6.