Patents by Inventor Akihiro Hisai
Akihiro Hisai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9581907Abstract: A method for developing a substrate includes spinning the substrate with a spin holder and discharging a developer to the substrate from a plurality of exhaust ports arranged in a row on a developer feeder. The method also includes causing a moving mechanism to move said developer feeder in one direction extending to a center of the substrate in plan view while maintaining a direction of arrangement of said exhaust ports in said one direction, thereby to move said developer feeder between substantially the center and an edge of the substrate. The method further includes causing the developer discharged from said exhaust ports to impinge in separate streams on the substrate, and causing each of the separate streams to impinge spirally on the substrate, thereby to develop the substrate. At least two of loci of positions of impingement of the developer corresponding to said exhaust ports overlap each other.Type: GrantFiled: December 16, 2014Date of Patent: February 28, 2017Assignee: SCREEN Semiconductor Solutions Co., Ltd.Inventors: Masahiko Harumoto, Akira Yamaguchi, Akihiro Hisai, Minoru Sugiyama, Takuya Kuroda
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Publication number: 20150104747Abstract: A method for developing a substrate includes spinning the substrate with a spin holder and discharging a developer to the substrate from a plurality of exhaust ports arranged in a row on a developer feeder. The method also includes causing a moving mechanism to move said developer feeder in one direction extending to a center of the substrate in plan view while maintaining a direction of arrangement of said exhaust ports in said one direction, thereby to move said developer feeder between substantially the center and an edge of the substrate. The method further includes causing the developer discharged from said exhaust ports to impinge in separate streams on the substrate, and causing each of the separate streams to impinge spirally on the substrate, thereby to develop the substrate. At least two of loci of positions of impingement of the developer corresponding to said exhaust ports overlap each other.Type: ApplicationFiled: December 16, 2014Publication date: April 16, 2015Inventors: Masahiko Harumoto, Akira Yamaguchi, Akihiro Hisai, Minoru Sugiyama, Takuya Kuroda
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Patent number: 8956695Abstract: A method for developing a substrate includes spinning the substrate with a spin holder and discharging a developer to the substrate from a plurality of exhaust ports arranged in a row on a developer feeder. The method also includes causing a moving mechanism to move said developer feeder in one direction extending to a center of the substrate in plan view while maintaining a direction of arrangement of said exhaust ports in said one direction, thereby to move said developer feeder between substantially the center and an edge of the substrate. The method further includes causing the developer discharged from said exhaust ports to impinge in separate streams on the substrate, and causing each of the separate streams to impinge spirally on the substrate, thereby to develop the substrate. At least two of loci of positions of impingement of the developer corresponding to said exhaust ports overlap each other.Type: GrantFiled: January 26, 2012Date of Patent: February 17, 2015Assignee: SCREEN Semiconductor Solutions Co., Ltd.Inventors: Masahiko Harumoto, Akira Yamaguchi, Akihiro Hisai, Minoru Sugiyama, Takuya Kuroda
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Patent number: 8580340Abstract: After a solvent is discharged onto a substrate in a period from a time point t0 to a time point t1, rotation of the substrate is started at a time point t2. A resist liquid is discharged onto a center portion of a target surface of the substrate at a time point t3. A rotation speed of the substrate starts to decrease at a time point t4, and attains a first speed after a certain period of time. The discharge of the resist liquid is stopped at a time point t5. The rotation of the substrate is accelerated in a period from a time point t6 to a time point t7, and the rotation speed of the substrate attains a second speed at the time point t7. The rotation of the substrate is decelerated in a period from the time point t7 to a time point t8, and the rotation speed of the substrate attains a third speed at the time point t8.Type: GrantFiled: October 6, 2010Date of Patent: November 12, 2013Assignee: Sokudo Co., Ltd.Inventors: Masanori Imamura, Akihiro Hisai, Hidetoshi Sagawa
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Patent number: 8496761Abstract: A substrate processing apparatus comprises an indexer block, an anti-reflection film processing block, a resist film processing block, a development processing block, and an interface block. An exposure device is arranged adjacent to an interface block. The interface block comprises a drying processing group including two drying processing units and an interface transport mechanism. After a substrate is subjected to exposure processing by the exposure device, the substrate is transported to the drying processing units in the drying processing group by the interface transport mechanism, where the substrate is subjected to cleaning and drying processings.Type: GrantFiled: April 6, 2010Date of Patent: July 30, 2013Assignee: Sokudo Co., Ltd.Inventors: Koji Kaneyama, Akihiro Hisai, Toru Asano, Hiroshi Kobayashi, Tsuyoshi Okumura, Shuichi Yasuda, Masashi Kanaoka, Tadashi Miyagi, Kazuhito Shigemori
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Publication number: 20120122038Abstract: A method for developing a substrate includes spinning the substrate with a spin holder and discharging a developer to the substrate from a plurality of exhaust ports arranged in a row on a developer feeder. The method also includes causing a moving mechanism to move said developer feeder in one direction extending to a center of the substrate in plan view while maintaining a direction of arrangement of said exhaust ports in said one direction, thereby to move said developer feeder between substantially the center and an edge of the substrate. The method further includes causing the developer discharged from said exhaust ports to impinge in separate streams on the substrate, and causing each of the separate streams to impinge spirally on the substrate, thereby to develop the substrate. At least two of loci of positions of impingement of the developer corresponding to said exhaust ports overlap each other.Type: ApplicationFiled: January 26, 2012Publication date: May 17, 2012Applicant: Sokudo Co., Ltd.Inventors: Masahiko Harumoto, Akira Yamaguchi, Akihiro Hisai, Minoru Sugiyama, Takuya Kuroda
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Patent number: 8137576Abstract: A method for developing a substrate includes a developing step for supplying a developer to the substrate, and a neutralizing and removing step for supplying a treating solution containing a neutralizing material to the substrate to neutralize the developer, and neutralizing the developer and removing the developer from the substrate. In the neutralizing and removing step, the developer is neutralized by the treating solution. This neutralization reaction forms a product (salt) which easily melts into the treating solution and does not precipitate. Thus, the product is removable from the substrate along with the treating solution. Therefore, the developer is inhibited from remaining on the substrate. As a result, it is possible to prevent post-develop defects due to “residues of the developer” or the developer remaining on the substrate.Type: GrantFiled: February 15, 2008Date of Patent: March 20, 2012Assignee: Sokudo Co., Ltd.Inventors: Masahiko Harumoto, Akira Yamaguchi, Akihiro Hisai
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Patent number: 8034190Abstract: A substrate processing apparatus comprises an indexer block, an anti-reflection film processing block, a resist film processing block, a development processing block, and an interface block. An exposure device is arranged adjacent to the interface block. The interface block comprises washing processing units and an interface transport mechanism. Before a substrate is subjected to exposure processing by the exposure device, the substrate is transported to a washing processing unit by the interface transport mechanism. The substrate is washed and dried by the washing processing unit.Type: GrantFiled: March 8, 2010Date of Patent: October 11, 2011Assignee: Sokudo Co., Ltd.Inventors: Shuichi Yasuda, Masashi Kanaoka, Koji Kaneyama, Tadashi Miyagi, Kasuhito Shigemori, Toru Asano, Akihiro Hisai, Hiroshi Kobayashi, Tsuyoshi Okumura
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Publication number: 20110135820Abstract: After a solvent is discharged onto a substrate in a period from a time point t0 to a time point t1, rotation of the substrate is started at a time point t2. A resist liquid is discharged onto a center portion of a target surface of the substrate at a time point t3. A rotation speed of the substrate starts to decrease at a time point t4, and attains a first speed after a certain period of time. The discharge of the resist liquid is stopped at a time point t5. The rotation of the substrate is accelerated in a period from a time point t6 to a time point t7, and the rotation speed of the substrate attains a second speed at the time point t7. The rotation of the substrate is decelerated in a period from the time point t7 to a time point t8, and the rotation speed of the substrate attains a third speed at the time point t8.Type: ApplicationFiled: October 6, 2010Publication date: June 9, 2011Inventors: Masanori IMAMURA, Akihiro HISAI, Hidetoshi SAGAWA
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Publication number: 20100190116Abstract: A substrate processing apparatus comprises an indexer block, an anti-reflection film processing block, a resist film processing block, a development processing block, and an interface block. An exposure device is arranged adjacent to an interface block. The interface block comprises a drying processing group including two drying processing units and an interface transport mechanism. After a substrate is subjected to exposure processing by the exposure device, the substrate is transported to the drying processing units in the drying processing group by the interface transport mechanism, where the substrate is subjected to cleaning and drying processings.Type: ApplicationFiled: April 6, 2010Publication date: July 29, 2010Applicant: Sokudo Co., Ltd.Inventors: Koji Kaneyama, Akihiro Hisai, Toru Asano, Hiroshi Kobayashi, Tsuyoshi Okumura, Shuichi Yasuda, Masashi Kanaoka, Tadashi Miyagi, Kazuhito Shigemori
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Publication number: 20100159142Abstract: A substrate processing apparatus comprises an indexer block, an anti-reflection film processing block, a resist film processing block, a development processing block, and an interface block. An exposure device is arranged adjacent to the interface block. The interface block comprises washing processing units and an interface transport mechanism. Before a substrate is subjected to exposure processing by the exposure device, the substrate is transported to a washing processing unit by the interface transport mechanism. The substrate is washed and dried by the washing processing unit.Type: ApplicationFiled: March 8, 2010Publication date: June 24, 2010Applicant: Sokudo Co., Ltd.Inventors: Shuichi Yasuda, Masashi Kanaoka, Koji Kaneyama, Tadashi Miyagi, Kazuhito Shigemori, Toru Asano, Akihiro Hisai, Hiroshi Kobayashi, Tsuyoshi Okumura
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Patent number: 7726891Abstract: A substrate processing apparatus comprises an indexer block, an anti-reflection film processing block, a resist film processing block, a development processing block, a resist cover film processing block, a resist cover film removal block, and an interface block. An exposure device is arranged adjacent to the interface block. A resist film is formed on a substrate in the resist film processing block. A resist cover film is formed on the resist film in the resist cover film processing block before the substrate is subjected to exposure processing by the exposure device.Type: GrantFiled: November 10, 2005Date of Patent: June 1, 2010Assignee: Sokudo Co., Ltd.Inventors: Koji Kaneyama, Akihiro Hisai, Toru Asano, Hiroshi Kobayashi
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Publication number: 20090103960Abstract: A developing apparatus disclosed includes a spin chuck for spinnably holding a substrate, a developer nozzle having a plurality of exhaust ports arranged in a row for discharging a developer, the developer nozzle causing the developer discharged from the exhaust ports to impinge in separate streams on the substrate, a horizontal movement mechanism for moving the developer nozzle in one direction extending to the center of the substrate in plan view while maintaining a direction of arrangement of the exhaust ports in the one direction, thereby to move the developer nozzle between substantially the center and an edge of the substrate in plan view, and a controller for controlling the spin chuck and horizontal movement mechanism to cause the separate streams of the developer discharged from the exhaust ports to impinge spirally on the substrate, thereby to develop the substrate.Type: ApplicationFiled: October 15, 2008Publication date: April 23, 2009Applicant: Sokudo Co., Ltd.Inventors: Masahiko Harumoto, Akira Yamaguchi, Akihiro Hisai, Minoru Sugiyama, Takuya Kuroda
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Publication number: 20080203058Abstract: A method for developing a substrate includes a developing step for supplying a developer to the substrate, and a neutralizing and removing step for supplying a treating solution containing a neutralizing material to the substrate to neutralize the developer, and neutralizing the developer and removing the developer from the substrate. In the neutralizing and removing step, the developer is neutralized by the treating solution. This neutralization reaction forms a product (salt) which easily melts into the treating solution and does not precipitate. Thus, the product is removable from the substrate along with the treating solution. Therefore, the developer is inhibited from remaining on the substrate. As a result, it is possible to prevent post-develop defects due to “residues of the developer” or the developer remaining on the substrate.Type: ApplicationFiled: February 15, 2008Publication date: August 28, 2008Applicant: Sokudo Co., Ltd.Inventors: Masahiko Harumoto, Akira Yamaguchi, Akihiro Hisai
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Publication number: 20060292515Abstract: A heat treatment apparatus has a heat pipe structure, and includes a hollow heat-treating plate, and a temperature sensor for measuring temperatures of the heat-treating plate. A pair of operating fluid storage portions are formed below a hollow portion of the heat-treating plate. An operating fluid is stored in these operating fluid storage portions, and heaters are provided for heating the operating fluid. This heat treatment apparatus further includes a pair of operating fluid passages extending between the hollow portion and operating fluid storage portions of the heat-treating plate. At least a portion of each operating fluid passage lying above the surface of the operating fluid stored in the operating fluid storage portions are shaped to have an angle of inclination with respect to the horizontal.Type: ApplicationFiled: May 16, 2006Publication date: December 28, 2006Inventors: Akihiro Hisai, Shigehiro Goto
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Publication number: 20060104635Abstract: A substrate processing apparatus comprises an indexer block, an anti-reflection film processing block, a resist film processing block, a development processing block, a resist cover film processing block, a resist cover film removal block, and an interface block. An exposure device is arranged adjacent to the interface block. A resist film is formed on a substrate in the resist film processing block. A resist cover film is formed on the resist film in the resist cover film processing block before the substrate is subjected to exposure processing by the exposure device.Type: ApplicationFiled: November 10, 2005Publication date: May 18, 2006Inventors: Koji Kaneyama, Akihiro Hisai, Toru Asano, Hiroshi Kobayashi
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Publication number: 20060098979Abstract: A substrate processing apparatus comprises an indexer block, an anti-reflection film processing block, a resist film processing block, a development processing block, and an interface block. An exposure device is arranged adjacent to an interface block. The interface block comprises a drying processing group including two drying processing units and an interface transport mechanism. After a substrate is subjected to exposure processing by the exposure device, the substrate is transported to the drying processing units in the drying processing group by the interface transport mechanism, where the substrate is subjected to cleaning and drying processings.Type: ApplicationFiled: November 10, 2005Publication date: May 11, 2006Inventors: Koji Kaneyama, Akihiro Hisai, Toru Asano, Hiroshi Kobayashi, Tsuyoshi Okumura, Shuichi Yasuda, Masashi Kanaoka, Tadashi Miyagi, Kazuhito Shigemori
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Publication number: 20060098978Abstract: A substrate processing apparatus comprises an indexer block, an anti-reflection film processing block, a resist film processing block, a development processing block, and an interface block. An exposure device is arranged adjacent to the interface block. The interface block comprises washing processing units and an interface transport mechanism. Before a substrate is subjected to exposure processing by the exposure device, the substrate is transported to a washing processing unit by the interface transport mechanism. The substrate is washed and dried by the washing processing unit.Type: ApplicationFiled: November 10, 2005Publication date: May 11, 2006Inventors: Schuichi Yasuda, Masashi Kanaoka, Koji Kaneyama, Tadashi Miyagi, Kazuhito Shigemori, Toru Asano, Akihiro Hisai, Hiroshi Kobayashi, Tsuyoshi Okumura
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Patent number: 7017658Abstract: A heating unit having a heat pipe structure includes a heater and a cooling pipe disposed in an inner space of a holding table. The holding table and the cooling pipe are thermally insulated by a heat-insulating member, so that it is possible to prevent direct heat transfer from the cooling pipe to the holding table. Therefore, it is possible to rapidly perform a cooling processing while keeping the evenness of the temperature distribution of the mounting face and the temperature distribution of the substrate mounted on the mounting face, and consequently to appropriately keep the evenness of the film thickness and the line width of a wiring layer formed on the substrate upon heat processing.Type: GrantFiled: January 27, 2003Date of Patent: March 28, 2006Assignee: Dainippon Screen Mfg. Co., Ltd.Inventors: Akihiro Hisai, Junichi Yoshida
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Publication number: 20050220985Abstract: A substrate processing apparatus is provided with a film quality measuring device that measures the density of a resist film on a substrate as the film quality. Measurement of the density of the resist film is performed after resist-coating or during or after heat-treatment followed by the resist-coating. The film quality measuring device also measures the thickness of the resist film on the substrate before exposure after the heat-treatment followed by the resist-coating. A controller controls a processing condition in a coater or a heating device so that each of the density and thickness of the resist film on the substrate falls within an acceptable range.Type: ApplicationFiled: May 16, 2005Publication date: October 6, 2005Inventors: Koji Kaneyama, Akihiro Hisai