Abstract: A sewing mechanism is provided with: a post bed and sewing needles, wherein an article to be sewn is interposed between the post bed and the sewing needles. When the post bed comes closer to the article to be sewn than that in the previous sewing by at least a predetermined distance, in other words, when a separation distance between the article to be sewn and the post bed becomes less than that in the previous sewing by at least a predetermined distance, a thread pulling mechanism pulls threads hooked in needle holes of the sewing needles in a direction away from the post bed.

Abstract: To provide a coating device which can precisely adjust a discharge amount of high-viscosity material. The coating device coats a high-viscosity material onto a workpiece, and includes a coating gun (2) which discharges the high-viscosity material having flowed in from an inlet port (211) from a discharge port (251); a supply mechanism which pushes out the high-viscosity material to supply from an injection nozzle; and a supply tube which connects the inlet port (211) and supply port. The coating gun (2) includes, at a gun flow channel (3a) from the inlet port (211) until the discharge port (251), a gear pump (31) and needle valve (26) as a discharge amount adjustment mechanism which adjusts the discharge amount of the high-viscosity material from the discharge port (251).

Abstract: To improve light emission efficiency and reliability. A transparent conductive film 10 is formed on an entire top surface of a second semiconductor layer 108, and a photo-resist is applied thereon. When removing the photo-resist on the upper surface corresponding to an electrode forming part 16 of a first semiconductor layer 104, the photo-resist is removed to be gradually thinned at a boundary of a portion to be removed. The transparent conductive film is wet etched using the remaining photo-resist as a mask to expose a part of the second semiconductor layer. Dry etching is performed using the remaining photo-resist and the transparent conductive film as a mask to expose the electrode forming part of the first semiconductor layer. A portion of the transparent conductive film exposed in the dry etching using the remaining photo-resist as a mask is wet etched. The remaining photo-resist is eliminated.

Abstract: A multi-axis injection molding apparatus is provided with a fixed platen, a movable platen, a plurality of injection devices, and an intermediate platen disposed between a fixed mold and the fixed platen. The intermediate platen includes a runner adapted to supply a molten resin from a single in-line injection apparatus to the plurality of injection devices.

Abstract: To improve light emission efficiency and reliability. A transparent conductive film 10 is formed on an entire top surface of a second semiconductor layer 108, and a photo-resist is applied thereon. When removing the photo-resist on the upper surface corresponding to an electrode forming part 16 of a first semiconductor layer 104, the photo-resist is removed to be gradually thinned at a boundary of a portion to be removed. The transparent conductive film is wet etched using the remaining photo-resist as a mask to expose a part of the second semiconductor layer. Dry etching is performed using the remaining photo-resist and the transparent conductive film as a mask to expose the electrode forming part of the first semiconductor layer. A portion of the transparent conductive film exposed in the dry etching using the remaining photo-resist as a mask is wet etched. The remaining photo-resist is eliminated.

Abstract: A multi-axis injection molding apparatus is provided with a fixed platen, a movable platen, a plurality of injection devices, and an intermediate platen disposed between a fixed mold and the fixed platen. The intermediate platen includes a runner adapted to supply a molten resin from a single in-line injection apparatus to the plurality of injection devices.

Abstract: An injection rate (cm3/sec) of a screw feeder at the time of starting an injection is the largest and the injection rate (cm3/sec) thereof gradually or sequentially decreases until an end of injection so that a temperature of a melted resin reaching the end portion of a cavity decreases within a range where the melted resin is not solidified.

Abstract: The monomer of the present invention is represented by the following Formula 1: 1

Abstract: A lamp unit provided with an LED light source is attached to the back surface of an inside handle vessel, and the position of the light source is fixed. Then, the inside handle vessel together with the lamp unit is installed in a door trim.

Abstract: The monomer of the present invention is represented by the following Formula 1: 1

Abstract: A lamp unit provided with an LED light source is attached to the back surface of an inside handle vessel, and the position of the light source is fixed. Then, the inside handle vessel together with the lamp unit is installed in a door trim.

Abstract: There is disclosed a process for producing a glycidyl ester of acrylic acid or methacrylic acid which comprises the steps of neutralizing acrylic acid or methacrylic acid with a carbonate or a bicarbonate of an alkali metal in an excess amount of epichlorohydrin while an oxygen-containing gas is blown into the liquid reaction system; subjecting water formed by the neutralization and epichlorohydrin to azeotropic distillation to discharge them outside the reaction system and to form an alkali metal salt of acrylic acid or methacrylic acid; adding a quaternary ammonium salt as a catalyst to the reaction system to react the alkali metal salt of the acid with the epichlorohydrin and thus synthesize the glycidyl ester of the acid; cooling the liquid reaction product while recovering part of the excess epichlorohydrin under reduced pressure; adding aqueous solution of an alkali hydroxide to the liquid reaction product to separate into aqueous layer and organic layer; adding a catalyst deactivator to the organic pha

Abstract: There are disclosed a process for producing glycidyl acrylate or glycidyl methacrylate by the transesterification of glycidol and methyl methacrylate, etc. which process comprises carrying out the transesterification in the presence of a polymerization inhibitor by using, as a catalyst, a quaternary ammonium salt represented by the general formula (I) or a quaternary phosphonium salt represented by the general formula (II)(R.sup.1 R.sup.2 R.sup.3 R.sup.4)NX (I)(R.sup.1 R.sup.2 R.sup.3 R.sup.4)PX (II)wherein R.sup.1, R.sup.2, R.sup.3 and R.sup.4 are each an alkyl group having 1 to 20 carbon atoms, or the like, and X is a cyanide ion, cyanate ion or the like to complete the reaction; thereafter arresting the reaction by adding a catalyst deactivator represented by the general formula (III)SB (iii)wherein S is a sulfonic acid or a heteropolyacid and B is an alkali metal excluding potassium or an alkaline earth metal; and distilling away unreacted methyl methacrylate, etc.

Abstract: A method of purifying a crude glycidyl (meth)acrylate, by (1) subjecting a crude glycidyl (meth)acrylate containing epichlorohydrin and other chlorine compounds as impurities to a stripping treatment with a mixed gas containing oxygen gas in the presence of a quaternary ammonium salt, and then (2) distilling the treated product to obtain a purified glycidyl (meth)acrylate.