Patents by Inventor Akihiro Horimoto

Akihiro Horimoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • INSULATING PASTE
    Publication number: 20210269618
    Abstract: An insulating paste of the present invention contains an elastomer composition containing silica particles (C) and a solvent.
    Type: Application
    Filed: September 26, 2018
    Publication date: September 2, 2021
    Inventors: Akihiro Horimoto, Mayo Miyachi
  • Conductive paste
    Patent number: 11021626
    Abstract: A conductive paste of the present invention includes an elastomer composition containing silica particles (C), a conductive filler, and a solvent.
    Type: Grant
    Filed: September 26, 2018
    Date of Patent: June 1, 2021
    Assignee: SUMITOMO BAKELITE CO., LTD.
    Inventors: Mariko Otani, Shun Hayakawa, Akihiro Horimoto, Mayo Miyachi
  • CONDUCTIVE PASTE
    Publication number: 20200377749
    Abstract: A conductive paste of the present invention includes an elastomer composition containing silica particles (C), a conductive filler, and a solvent.
    Type: Application
    Filed: September 26, 2018
    Publication date: December 3, 2020
    Inventors: Mariko Otani, Shun Hayakawa, Akihiro Horimoto, Mayo Miyachi
  • Latent catalyst for epoxy resin, epoxy resin composition, and semiconductor device
    Patent number: 8148831
    Abstract: The present invention provides a latent catalyst for epoxy resin, comprising: a cation moiety having an activity of accelerating curing reaction of epoxy resin; and a silicate anion moiety of suppressing the curing reaction-accelerating activity. Also disclosed are an epoxy resin composition comprising the latent catalyst and a semiconductor device using the epoxy resin composition.
    Type: Grant
    Filed: September 3, 2008
    Date of Patent: April 3, 2012
    Assignee: Sumitomo Bakelite Company, Ltd.
    Inventors: Akihiro Horimoto, Yoshiyuki Goh
  • LATENT CATALYST FOR EPOXY RESIN, EPOXY RESIN COMPOSITION, AND SEMICONDUCTOR DEVICE
    Publication number: 20090023840
    Abstract: The present invention provides a latent catalyst for epoxy resin, comprising: a cation moiety having an activity of accelerating curing reaction of epoxy resin; and a silicate anion moiety of suppressing the curing reaction-accelerating activity. Also disclosed are an epoxy resin composition comprising the latent catalyst and a semiconductor device using the epoxy resin composition.
    Type: Application
    Filed: September 3, 2008
    Publication date: January 22, 2009
    Inventors: Akihiro Horimoto, Yoshiyuki Goh
  • Latent catalyst for epoxy resin, epoxy resin composition, and semiconductor device
    Publication number: 20070010601
    Abstract: The present invention provides a latent catalyst for epoxy resin, comprising: a cation moiety having an activity of accelerating curing reaction of epoxy resin; and a silicate anion moiety of suppressing the curing reaction-accelerating activity. Also disclosed are an epoxy resin composition comprising the latent catalyst and a semiconductor device using the epoxy resin composition.
    Type: Application
    Filed: February 24, 2006
    Publication date: January 11, 2007
    Inventors: Akihiro Horimoto, Yoshiyuki Goh
  • Latent catalyst for epoxy resin, epoxy resin composition, and semiconductor device
    Publication number: 20050075474
    Abstract: The present invention provides a latent catalyst for epoxy resin, comprising: a cation moiety having an activity of accelerating curing reaction of epoxy resin; and a silicate anion moiety of suppressing the curing reaction-accelerating activity. Also disclosed are an epoxy resin composition comprising the latent catalyst and a semiconductor device using the epoxy resin composition.
    Type: Application
    Filed: August 27, 2004
    Publication date: April 7, 2005
    Inventors: Akihiro Horimoto, Yoshiyuki Goh