Abstract: A method for producing a glass substrate that has a desired shape and is obtained from a glass plate, the method includes: emitting a first laser beam to the glass plate to form a scribe line over an entire thickness of the glass plate, the scribe line defining a contour line of the glass substrate having the desired shape; and performing a fusion-cutting at a position away from the scribe line on a side opposite to the desired shape and removing an unnecessary region of the glass plate along the scribe line to obtain the glass substrate having the desired shape along the contour line.

Abstract: A memory card socket includes a first pad provided in a first face of a first substrate; a first terminal having a first end portion that contacts a terminal of a memory card and a second end portion electrically connected to the first pad; a holder provided on the first face and fixing the first terminal to the first substrate; and a protrusion provided on the first face, having a second face that contacts a portion of the memory card that excludes the terminal, and including a metal material or an insulating material.

Abstract: An imaging-lens manufacturing apparatus manufactures an imaging lens provided with a plurality of lenses including an adjusted lens. The imaging-lens manufacturing apparatus includes a stage configured to hold at least the plurality of lenses excluding the adjusted lens; a lens adjusting mechanism configured to hold the adjusted lens, and capable of adjusting a position of the adjusted lens with respect to the plurality of lenses excluding the adjusted lens; a light source; a reticle disposed between the imaging lens and the light source, and having three or more slits that allow light from the light source to pass; and a light detecting unit having a plurality of sensors each configured to detect, via the imaging lens, a corresponding one of a plurality of light-ray bundles composed of the light from the light source passed through the three or more slits.

Abstract: An optical system includes: a first lens group; a second lens group disposed behind the first lens group; and a third lens group disposed behind the second lens group. The optical system satisfies: ?6.0<f/f2<?2.0; ih/f<0.4; 0.7<TTL/f<1.0; 1.6<Fno/7.0; and Ims/d?OIS>1.5 where ih: a maximum image height of the first lens group, TTL: a distance from a surface of a lens to an image forming surface, Fno: an F number of the first lens group, d?OIS: an absolute value of a distance for which the second lens group is driven in the direction perpendicular to the optical axis, and Ims: an absolute value of a distance for which the image moves in the direction perpendicular to the optical axis on the image plane.

Abstract: A camera module comprises a first lens barrel holding a first lens group configured to receive object light; a second lens barrel holding a second lens group disposed in a traveling direction of the object light with respect to the first lens group; a lens driving unit configured to drive the second lens barrel in a first direction along a first optical axis of the second lens group; and a guide for guiding a direction in which the second lens barrel is driven, wherein the first lens barrel has a first guide recess fitted in the guide, the second lens barrel has a second guide recess fitted in the guide, one of the first guide recess and the second guide recess fixes the guide in the first direction, and the guide slides in the first direction with respect to another of the first guide recess and the second guide recess.

Abstract: A semiconductor device includes a printed circuit board having a plurality of first electrode pads on a first main surface and a plurality of second electrode pads electrically connected to at least one of the plurality of first electrode pads on a second main surface, a first chip disposed on the first main surface and having a non-volatile memory; a second chip having a third electrode pad and a control circuit configured to control an operation of the non-volatile memory, a dummy chip having a component that has a higher thermal conductivity than a substrate of the second chip, and a sealing member sealing the first, second, and dummy chips. The third electrode pad is connected to the component of the dummy chip via a first wiring, and the component of the dummy chip is connected to one of the plurality of first electrode pads via a second wiring.

Abstract: An imaging-lens manufacturing apparatus includes the following: a lens stage configured to hold at least a fixed lens; a lens adjusting mechanism configured to hold an adjusted lens, and capable of adjusting, in a plane perpendicular to the optical axis of an imaging lens, the position of the adjusted lens with respect to the fixed lens; a light source; a reticle having three or more slits that allow light from the light source to pass; and a light detecting unit having a plurality of sensors each configured to detect, via the imaging lens, a corresponding one of a plurality of light-ray bundles passed through the slits. The lens adjusting mechanism is further capable of driving the adjusted lens in the direction of the optical axis.

Abstract: A camera module includes a first lens barrel holding a first lens group, a second lens barrel holding a second lens group, and a lens driver holding the perimeter of the second lens barrel to move the second lens group in a direction along a first optical axis of the second lens group. The size of the lens driver in a direction intersecting with the first optical axis (302) is smaller than the size of the first lens barrel in the direction intersecting with the first optical axis.

Abstract: A camera module includes the following: an image sensor configured to perform photoelectric conversion on incident light; a lens system configured to concentrate the incident light that travels toward the image sensor; an aperture diaphragm having an opening that allows the incident light that travels toward the lens system to pass; and a shield device capable of shielding at least a part of the opening, wherein the shield device changes into at least each of a first shield state where only a first light beam bundle asymmetric with respect to a main light beam of an entire light beam bundle that passes through the entire opening is allowed to pass, and a second shield state where only a second light beam bundle different from the first light beam bundle and asymmetric with respect to the main light beam is allowed to pass.

Abstract: An optical system includes the following: a first lens group including two or more lenses, having a positive power as a whole, and configured to pass object light; and a variable-focal-length lens configured to receive the object light that has passed through the first lens group, and capable of changing a focal length. An object that emits the object light undergoes focusing based on a power change in the variable-focal-length lens.

Abstract: An optical system includes a first lens group, a second lens group, and a lens drive device. The first lens group and the second lens group satisfy conditional expressions (1) to (5) below: -6.0<f/f2<?2.0??(1) ih/f<0.4??(2) 0.7<TTL/f<1.0??(3) 1.6<Fno<7.0??(4) De2<De1.

Abstract: An optical system includes a first lens group, a second lens group, and a lens drive device. The first lens group and the second lens group satisfy conditional expressions (1) to (5) below: ? 6 .0 ? ? ? ? < ? ? ? ? f ? / ? f2 ? ? ? ? < ? ? ? ? ? 2 .0 ih ? / ? f ? ? ? < ? ? ? 0 .4 0.7 ? ? < ? ? TTL/f ? ? ? < ? ? ? 1 .0 1 ? ? . ? ? 6 ? ? ? < ? ? ? Fno ? ? ? < ? ? ? 7 ? ? . ? ? 0 De2 ? ? ? < ? ? ? De1 ? .

Abstract: A semiconductor device includes a printed circuit board having a plurality of first electrode pads on a first main surface and a plurality of second electrode pads electrically connected to at least one of the plurality of first electrode pads on a second main surface, a first chip disposed on the first main surface and having a non-volatile memory; a second chip having a third electrode pad and a control circuit configured to control an operation of the non-volatile memory, a dummy chip having a component that has a higher thermal conductivity than a substrate of the second chip, and a sealing member sealing the first, second, and dummy chips. The third electrode pad is connected to the component of the dummy chip via a first wiring, and the component of the dummy chip is connected to one of the plurality of first electrode pads via a second wiring.

Abstract: The present invention provides methods for improving the efficiency of inducing pluripotent stem cells, as well as vectors and compositions for use therein. In the induction of pluripotent stem cells which contains the step of introducing a vector that contains the KLF gene, OCT gene, and SOX gene in this order, the efficiency of pluripotent stem cell induction was successfully increased significantly by further introducing a vector that contains the KLF gene but not the OCT gene and the SOX gene. The methods of the present invention have an excellent feature in that they allow efficient induction of pluripotent stem cells under a temperature condition closer to the physiological environment, and prompt vector removal after the pluripotent stem cell induction. The present invention enables more efficient induction of pluripotent stem cells.

Abstract: A semiconductor storage device of the present embodiments includes a substrate, a first semiconductor chip and a sealer. The substrate has wirings. The first semiconductor chip is connected to the wirings on the substrate. The sealer has a first surface, which does not face a top surface of the first semiconductor chip and is provided with a mark, and seals the first semiconductor chip.

Abstract: A semiconductor storage device of the present embodiments includes a substrate, a first semiconductor chip and a sealer. The substrate has wirings. The first semiconductor chip is connected to the wirings on the substrate. The sealer has a first surface, which does not face a top surface of the first semiconductor chip and is provided with a mark, and seals the first semiconductor chip.

Abstract: The present invention provides methods for improving the efficiency of inducing pluripotent stem cells, as well as vectors and compositions for use therein. In the induction of pluripotent stem cells which contains the step of introducing a vector that contains the KLF gene, OCT gene, and SOX gene in this order, the efficiency of pluripotent stem cell induction was successfully increased significantly by further introducing a vector that contains the KLF gene but not the OCT gene and the SOX gene. The methods of the present invention have an excellent feature in that they allow efficient induction of pluripotent stem cells under a temperature condition closer to the physiological environment, and prompt vector removal after the pluripotent stem cell induction. The present invention enables more efficient induction of pluripotent stem cells.

Abstract: According to one embodiment, a memory card is disclosed. The memory card includes a substrate, a memory provided on the substrate, a controller provided on the substrate, and a first interconnect provided on the substrate. A distance between an edge of the substrate and the first interconnect is greater than or equal to 0.4 mm. The memory card further includes a resin covering the memory, the controller and the interconnect. The resin includes a first region and a second region, the amount of carbide in the first region is larger than the amount of carbide in the second region.

Abstract: A compact water cooled internal combustion engine for a vehicle wherein a water pump operated by a pump driving shaft is arranged on a crankcase cover for covering a lateral side of a crankcase, such that an axis of rotation of the water pump is coaxial with the pump driving shaft. A case member that forms a pump case of a water pump, together with a crankcase cover, and that rotatably supports a pump shaft of the water pump, is attached on an inner surface side of the crankcase cover.

Abstract: A semiconductor device includes a substrate having a first surface, a height adjuster mounted on the first surface of the substrate via a first adhesive layer, a semiconductor chip mounted on the height adjuster via a second adhesive layer, an electronic component mounted on the first surface of the substrate via a third adhesive layer, a bonding wire, and a sealing member. The length of the electronic component in a first direction corresponding to the thickness direction of the substrate is larger than the length of the semiconductor chip in the first direction, and the sum of the lengths of the height adjuster, the second adhesive layer, and the semiconductor chip in the first direction is larger than the length of the electronic component in the first direction.