Abstract: An object of the present invention is to provide an adhesive tape for processing semiconductor wafers and the like that is able to adequately reduce the amount of adhesive remaining on the surface of an adherend after peeling off the tape. The adhesive tape for semiconductor wafer processing (100) according to the present invention comprises a base material layer (200) and an adhesive layer (300). The adhesive layer (300) is formed on at least one side of the base material layer (200). In addition, the adhesive layer (300) is mainly composed of a carboxyl group-containing polymer. The carboxyl group-containing polymer contains a radiation-polymerizable compound (and particularly, urethane acrylate).

Abstract: An object of the present invention is to provide an adhesive tape for processing a semiconductor wafer or the like, which is capable of inhibiting electrical charging in a stable manner. The adhesive tape (dicing tape) (100) for processing a semiconductor wafer or the like includes a base layer (200) and an adhesive layer (300). The adhesive layer (300) is formed on the base layer (200). The adhesive layer (300) contains a curing component that cures the adhesive layer (300). The base layer (200) is composed mainly of a resin. A polymer-type antistatic agent is kneaded into the resin. The polymer-type antistatic agent has an MFR, measured under measurement conditions of 190° C. and 21.18 N in accordance with JIS K7210, of at least 10.0 g/10 min and not more than 15.0 g/10 min.