Abstract: A solid electrolytic capacitor capable of improving manufacturing yield is provided. A solid electrolytic capacitor according to one aspect of the present disclosure includes an anode lead-out wire and a capacitor element in which the anode lead-out wire is embedded. The cross section of at least a part of the anode lead-out wire in a direction in which the anode lead-out wire is extended has a flat shape, and a recess provided in a central part, a first linear part that is extended outward from one side of the recess, and a second linear part that is extended outward from another side of the recess are formed in at least one of an upper surface and a lower surface of the anode lead-out wire having the flat shape.

Abstract: Provided is a solid electrolytic capacitor that is excellent in productivity, has improved volumetric efficiency aiming for capacity increase, a stable fillet shape when mounted, and has excellent ESL characteristics. Included is a capacitor stack element composed of a stack of capacitor elements. The capacitor element includes one anode part of an anode body made of linear, foil-like, or plate-like valve metal and a cathode part composed of dielectric, solid electrolyte, graphite, and silver paste layers, which are sequentially formed to another surface of the anode body separated by insulating resin. A fillet formation part with a recessed part is provided to an end surface of anode and cathode terminals of a mounting electrode side of a first direction end surface of the electrode substrate to which the capacitor stack element is mounted. Further, the anode and cathode terminals for element connection reach the end surface of the first direction.

Abstract: The invention is directed to an unfailing pickup operation of an electronic component from a component storage portion at a seam of storage tapes connected even using a connection tape and prevention of reduction in a pickup rate of an electronic component. A CPU sends a feeding command to a component feeding unit to perform a component feeding operation or the like. Then, when the CPU judges that a connection tape reaches a pickup position, the CPU drives an X axis drive motor and a Y axis drive motor to move a board recognition camera to the pickup position of the feeding unit, the camera takes an image of a storage portion of a storage tape, and a recognition processing device performs recognition processing. A correction value based on a result of this recognition processing is stored in a RAM, and a suction nozzle is moved taking this correction value into account and lowers to pick up an electronic component.

Abstract: In a lower-face electrode type solid electrolytic multilayer capacitor and a mounting member having the same according to the present invention, fillet forming portions are formed by forming an electrode substrate cutting portion at a predetermined portion of an edge face in longer direction or in shorter direction of an electrode substrate, and a covering resin cutting portion on an edge face of a covering resin in a staircase pattern so that the electrode substrate cutting portion is surrounded by the covering resin cutting portion. According to the present invention, it is possible to provide the lower-face electrode type solid electrolytic multilayer capacitor and the mounting member having the same, in which the productivity is excellent, the volume efficiency can be improved to achieve the high capacitance, and the stable fillet can be formed on mounting.

Abstract: Provided is a solid electrolytic capacitor that is excellent in productivity, has improved volumetric efficiency aiming for capacity increase, a stable fillet shape when mounted, and has excellent ESL characteristics. Included is a capacitor stack element composed of a stack of capacitor elements. The capacitor element includes one anode part of an anode body made of linear, foil-like, or plate-like valve metal and a cathode part composed of dielectric, solid electrolyte, graphite, and silver paste layers, which are sequentially formed to another surface of the anode body separated by insulating resin. A fillet formation part with a recessed part is provided to an end surface of anode and cathode terminals of a mounting electrode side of a first direction end surface of the electrode substrate to which the capacitor stack element is mounted. Further, the anode and cathode terminals for element connection reach the end surface of the first direction.

Abstract: A method of mounting electronic components on a printed board includes providing a storage tape including a first portion and a second portion that are connected by a connection tape and containing electronic components stored therein, advancing the storage tape so that an electronic component is advanced to a component pickup position where electronic components are picked up by a suction nozzle, picking up the advanced electronic component at the component pickup position by the suction nozzle, and mounting the picked up electronic component on a printed board. The advancing of the storage tape, the picking up of the electronic component and the mounting of the electronic component are repeated, and the component pickup position is adjusted when the second portion of the storage tape is advanced to the component pickup position.

Abstract: In a lower-face electrode type solid electrolytic multilayer capacitor and a mounting member having the same according to the present invention, fillet forming portions are formed by forming an electrode substrate cutting portion at a predetermined portion of an edge face in longer direction or in shorter direction of an electrode substrate, and a covering resin cutting portion on an edge face of a covering resin in a staircase pattern so that the electrode substrate cutting portion is surrounded by the covering resin cutting portion. According to the present invention, it is possible to provide the lower-face electrode type solid electrolytic multilayer capacitor and the mounting member having the same, in which the productivity is excellent, the volume efficiency can be improved to achieve the high capacitance, and the stable fillet can be formed on mounting.

Abstract: The invention is directed to an unfailing pickup operation of an electronic component from a component storage portion at a seam of storage tapes connected even using a connection tape and prevention of reduction in a pickup rate of an electronic component. A CPU sends a feeding command to a component feeding unit to perform a component feeding operation or the like. Then, when the CPU judges that a connection tape reaches a pickup position, the CPU drives an X axis drive motor and a Y axis drive motor to move a board recognition camera to the pickup position of the feeding unit, the camera takes an image of a storage portion of a storage tape, and a recognition processing device performs recognition processing. A correction value based on a result of this recognition processing is stored in a RAM, and a suction nozzle is moved taking this correction value into account and lowers to pick up an electronic component.

Abstract: The invention is directed to an unfailing pickup operation of an electronic component from a component storage portion at a seam of storage tapes connected even using a connection tape and prevention of reduction in a pickup rate of an electronic component. A CPU sends a feeding command to a component feeding unit to perform a component feeding operation or the like. Then, when the CPU judges that a connection tape reaches a pickup position, the CPU drives an X axis drive motor and a Y axis drive motor to move a board recognition camera to the pickup position of the feeding unit, the camera takes an image of a storage portion of a storage tape, and a recognition processing device performs recognition processing. A correction value based on a result of this recognition processing is stored in a RAM, and a suction nozzle is moved taking this correction value into account and lowers to pick up an electronic component.

Abstract: This invention provides an electronic component mounting apparatus which can detects an electronic component held by a suction nozzle without fail after a mounting operation of electronic components on a printed board and perform various processes in a case where the electronic component is held by the suction nozzle.

Abstract: This invention is directed to prevention of reduction of a pickup rate of an electronic component when a component feeding unit is dismounted from a feeder base and mounted back thereon. A CPU sends a feeding command to a component feeding unit feeding an electronic component belonging to a first step number, and drives a servomotor and a drive motor of the feeding unit to perform a component feeding operation and so on. After then, when the CPU judges that the feeding unit is dismounted from the feeder base and mounted back thereon, the CPU drives a X axis drive motor and a Y axis drive motor to move a board recognition camera to the pickup position of the feeding unit, the camera takes an image of a storage portion of a storage tape, and a recognition processing device performs recognition processing to the image.

Abstract: A surface-mounting thin type capacitor includes a capacitor element having a shape of and two end portions which form a side surface of the capacitor element. Two anode terminals are disposed on lower surfaces of the end portions along the side surface to form a mounting surface substantially perpendicular to the side surface. A cathode terminal is disposed at a middle part of the capacitor element to form the mounting surface together with the anode terminals. The cathode terminal is not between the anode terminals spatially and thereby manufacturing process of the capacitor is simplified and it is easy to change the intended use of the capacitor.

Abstract: In a solid electrolytic capacitor, a second dielectric layer made of an oxide of valve action metal is formed on first side, second side, and third side surfaces of an anode portion of an anode member. Between the second dielectric layer and a conductive polymer layer of the cathode layer, an electrical insulating resin layer is formed.

Abstract: A surface-mount capacitor includes a multilayer capacitor structure formed by laminating plate-like capacitor elements each having anode lead portions at opposite ends thereof and a cathode portion at the center, an anode terminal connected to each anode lead portion via a strip-like plate, and a cathode terminal connected to the cathode portion. The anode and the cathode terminals and have a flat shape and are formed on a common plane as a substrate-mounted surface. A mold resin case has a bottom portion filling a gap between the anode and the cathode terminals and mechanically connecting the anode and the cathode terminals and sidewalls substantially perpendicular to the substrate-mounted surface. The anode and the cathode terminals have upper surfaces exposed on an inner bottom surface of the mold resin case to be connected to the anode lead portions and the cathode portion.

Abstract: An electronic component mounting apparatus enables a reliable decision of abnormal suction of a component even when the difference between the width and the height of the component is small. When the difference between the thickness of the electronic component detected by a sensor and the data on the thickness stored in the RAM is within the tolerance, a CPU judges that the component is held by a suction nozzle in a normal posture and executes a normal processing control. Then an image of the electronic component is captured by a recognition camera, and a recognition processing is made by an image processing unit to measure the geometry of the component. The CPU, then, judges whether the size of the component is within tolerance or not.

Abstract: A surface-mount capacitor includes a multilayer capacitor structure formed by laminating plate-like capacitor elements each having anode lead portions at opposite ends thereof and a cathode portion at the center, an anode terminal connected to each anode lead portion via a strip-like plate, and a cathode terminal connected to the cathode portion. The anode and the cathode terminals and have a flat shape and are formed on a common plane as a substrate-mounted surface. A mold resin case has a bottom portion filling a gap between the anode and the cathode terminals and mechanically connecting the anode and the cathode terminals and sidewalls substantially perpendicular to the substrate-mounted surface. The anode and the cathode terminals have upper surfaces exposed on an inner bottom surface of the mold resin case to be connected to the anode lead portions and the cathode portion.

Abstract: The invention is directed to an unfailing pickup operation of an electronic component from a component storage portion at a seam of storage tapes connected even using a connection tape and prevention of reduction in a pickup rate of an electronic component. A CPU sends a feeding command to a component feeding unit to perform a component feeding operation or the like. Then, when the CPU judges that a connection tape reaches a pickup position, the CPU drives an X axis drive motor and a Y axis drive motor to move a board recognition camera to the pickup position of the feeding unit, the camera takes an image of a storage portion of a storage tape, and a recognition processing device performs recognition processing. A correction value based on a result of this recognition processing is stored in a RAM, and a suction nozzle is moved taking this correction value into account and lowers to pick up an electronic component.

Abstract: A surface-mount capacitor includes a multilayer capacitor structure formed by laminating plate-like capacitor elements each having anode lead portions 11 at opposite ends thereof and a cathode portion 12 at the center, an anode terminal 18 connected to each anode lead portion 11 via a strip-like plate 14, and a cathode terminal 19 connected to the cathode portion 12. The anode and the cathode terminals 18 and 19 have a flat shape and are formed on a common plane as a substrate-mounted surface. A mold resin case 20 has a bottom portion filling a gap between the anode and the cathode terminals 18 and 19 and mechanically connecting the anode and the cathode terminals 18 and 19, and side walls substantially perpendicular to the substrate-mounted surface. The anode and the cathode terminals 18 and 19 have upper surfaces exposed on an inner bottom surface of the mold resin case 20 to be connected to the anode lead portions 11 and the cathode portion 12.

Abstract: In a solid electrolytic capacitor, a second dielectric layer made of an oxide of valve action metal is formed on first side, second side, and third side surfaces of an anode portion of an anode member. Between the second dielectric layer and a conductive polymer layer of the cathode layer, an electrical insulating resin layer is formed.