Patents by Inventor Akihiro Kemmotsu

Akihiro Kemmotsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wiring board provided with a heat bypass layer
    Patent number: 5285016
    Abstract: Disclosed herein are high density wiring boards useful in computers, communication equipment and the like. They include a layer for bypassing heat to be generated. Heat generated at a conductor and/or a resistor in each wiring board is allowed to spread out evenly via the heat bypass layer.
    Type: Grant
    Filed: November 27, 1990
    Date of Patent: February 8, 1994
    Assignee: Hitachi, Ltd.
    Inventors: Yasunori Narizuka, Akihiro Kemmotsu, Masakazu Ishino, Eiji Matsuzaki