Abstract: This steel sheet for hot-stamping includes: a base steel sheet having a predetermined chemical composition; and a galvanized layer formed on a surface of the base steel sheet, in which a microstructure at a position at ¼ depth which is in a range of ? to ? of a sheet thickness in a sheet thickness direction from the surface of the base steel sheet contains, in volume fraction, ferrite: 20% to 95% and pearlite: 5% to 80%, the remaining structure including bainite, the galvanized layer has a coating amount of 90 g/m2 or more, and when the maximum value of the B content in the galvanized layer is Bps and the B content at the position at ¼ depth of the base steel sheet is Bqs, Bps is 1.2 times or more Bqs.

Abstract: A ship steering device includes a handle which is mechanically separated from a rudder mechanism, a steering angle detecting unit that detects a steering angle of the handle, a reaction force motor that generates reaction force torque to be applied to the handle, and a reaction force controller that controls, based on a steering characteristics map, the reaction force motor in such a way that the reaction force torque in accordance with the steering angle is obtained. The steering characteristics map has characteristics in such a way that the amount of change in an aiming steering torque relative to the steering angle is smaller in a second steering range where the steering angle is larger than that in a first steering range than the first steering region where the steering angle is set in advance from zero.

Abstract: The purpose of the present invention is to provide a niobium-aluminum precursor wire having properties such as expression of flexibility and ensuring a large single-wire length, as well as a twisted wire, a superconducting wire, and a superconducting twisted wire formed of the niobium-aluminum precursor wire. The present invention provides a niobium-aluminum precursor wire and a twisted wire using the same, the niobium-aluminum precursor wire including: a rod-like winding core (5) formed of a stabilized copper, or a stabilized copper and an unstabilized copper; a laminated body (3) that is wound around the winding core (5) and that is formed of an aluminum foil and a niobium foil laminated one on the other; and a covering body (1) that covers the circumference of the laminated body and that is formed of a stabilized copper, or a stabilized copper and an unstabilized copper. The volume ratio of the stabilized copper with respect to the unstabilized copper contained in the precursor wire is 0.5-2.

Abstract: Provided is a polymerizable composition comprising a norbornene-based monomer, rare earth element-containing particles having a number-based modal size of 0.05 ?m or more and less than 1.5 ?m, and a metathesis polymerization catalyst.

Abstract: The problem addressed by the present invention is to provide a copper-coated aluminum wire material with a reduced weight and excellent adhesiveness, and a production method therefor. This copper-coated aluminum wire material is provided with an aluminum wire material comprising aluminum or an aluminum alloy and a thin copper film covering the aluminum wire material. The space factor of the thin copper film is in the range of 0.2% to 4% and the adhesiveness between the aluminum wire material and the thin copper film based on a scratch test compliant with JIS R 3255 is at least 10 mN.

Abstract: An electronic apparatus includes a substrate and an electrical element mounted on the substrate. The electrical element includes a base material including a first principal surface and a second principal surface that are deformable and flat or substantially flat surfaces and a conductor pattern included on the base material. The electrical element further includes a first connection portion and a second connection portion that connect to a circuit included on the substrate and a transmission line portion located in a position different from positions of the first connection portion and the second connection portion that electrically connects the first connection portion and the second connection portion. The conductor pattern includes a conductor pattern of the first connection portion, a conductor pattern of the second connection portion, a conductor pattern of the transmission line portion, and an electrical-element-side bonding pattern arranged in the transmission line portion.

Abstract: In a power converter including: a first DC-DC converter, an inverter, and a control circuit, a second DC-DC converter that controls an input and an output of a power storage unit is connectable to a DC bus. The control circuit deactivates a reverse power flow suppression function for suppressing a reverse power flow from the inverter to a power system when the second DC-DC converter is not connected to the DC bus and activates the reverse power flow suppression function when the second DC-DC converter is connected to the DC bus.

Abstract: In a power converter, a DC bus is supplied with a DC power from a voltage conversion circuit for regulating a voltage of a power output from a DC power supply, a voltage of the DC power being regulated by the voltage conversion circuit. An inverter converts a DC power on the DC bus into an AC power and supplies the AC power as converted to a power system. A controller controls the inverter. When it is necessary to suppress an output, the controller suppresses the AC power supplied by the inverter to increase a voltage on the DC bus.

Abstract: An electronic apparatus includes a substrate and an electrical element mounted on the substrate. The electrical element includes a base material including a first principal surface and a second principal surface that are deformable and flat or substantially flat surfaces and a conductor pattern included on the base material. The electrical element further includes a first connection portion and a second connection portion that connect to a circuit included on the substrate and a transmission line portion located in a position different from positions of the first connection portion and the second connection portion that electrically connects the first connection portion and the second connection portion. The conductor pattern includes a conductor pattern of the first connection portion, a conductor pattern of the second connection portion, a conductor pattern of the transmission line portion, and an electrical-element-side bonding pattern arranged in the transmission line portion.

Abstract: In a multi-storage node system including a plurality of storage nodes, a plurality of storage nodes include a plurality of drives that store data and a control unit that controls writing of data to the drives. The control unit divides storage areas of the plurality of drives into a plurality of physical chunks, allocates the divided physical chunks to logical chunks, and stores data. A plurality of storage nodes are divided into fault sets affected by a single failure and manage the multi-storage node system. The control unit of one primary node that manages the multi-storage node system among a plurality of storage nodes includes a database for managing allocation of the physical chunks of a plurality of storage nodes to the logical chunks for each drive, each storage node, or for each fault set.

Abstract: The present invention focuses on a material constituting a contact pin and a processing technique of the material, and is directed to manufacturing a conductive member by using a material and a processing technique which are different from those in the related art. The conductive member is obtained by applying etching treatment to a copper-silver alloy including copper and silver while using at least copper alloy etching liquid, but silver etching liquid may also be selectively added to the copper alloy etching liquid.

Abstract: An electronic apparatus includes a substrate and an electrical element mounted on the substrate. The electrical element includes a base material including a first principal surface and a second principal surface that are deformable and flat or substantially flat surfaces and a conductor pattern included on the base material. The electrical element further includes a first connection portion and a second connection portion that connect to a circuit included on the substrate and a transmission line portion located in a position different from positions of the first connection portion and the second connection portion that electrically connects the first connection portion and the second connection portion. The conductor pattern includes a conductor pattern of the first connection portion, a conductor pattern of the second connection portion, a conductor pattern of the transmission line portion, and an electrical-element-side bonding pattern arranged in the transmission line portion.

Abstract: In a multi-storage node system including a plurality of storage nodes, a plurality of storage nodes include a plurality of drives that store data and a control unit that controls writing of data to the drives. The control unit divides storage areas of the plurality of drives into a plurality of physical chunks, allocates the divided physical chunks to logical chunks, and stores data. A plurality of storage nodes are divided into fault sets affected by a single failure and manage the multi-storage node system. The control unit of one primary node that manages the multi-storage node system among a plurality of storage nodes includes a database for managing allocation of the physical chunks of a plurality of storage nodes to the logical chunks for each drive, each storage node, or for each fault set.

Abstract: An electronic apparatus includes a substrate and an electrical element mounted on the substrate. The electrical element includes a base material including a first principal surface and a second principal surface that are deformable and flat or substantially flat surfaces and a conductor pattern included on the base material. The electrical element further includes a first connection portion and a second connection portion that connect to a circuit included on the substrate and a transmission line portion located in a position different from positions of the first connection portion and the second connection portion that electrically connects the first connection portion and the second connection portion. The conductor pattern includes a conductor pattern of the first connection portion, a conductor pattern of the second connection portion, a conductor pattern of the transmission line portion, and an electrical-element-side bonding pattern arranged in the transmission line portion.

Abstract: Provided is a method of manufacturing a semiconductor device with which a trench shape having vertical, flat, and smooth side wall surfaces can be formed even at room temperature. A semiconductor substrate is placed on a sample stage which is kept at room temperature in a reaction container. A trench is formed in the semiconductor substrate by plasma etching that uses etching gas including oxygen and sulfur hexafluoride, while controlling the gas ratio of oxygen to sulfur hexafluoride so that the gas ratio is from 70% to 100%.

Abstract: An electronic apparatus includes a substrate and an electrical element mounted on the substrate. The electrical element includes a base material including a first principal surface and a second principal surface that are deformable and flat or substantially flat surfaces and a conductor pattern included on the base material. The electrical element further includes a first connection portion and a second connection portion that connect to a circuit included on the substrate and a transmission line portion located in a position different from positions of the first connection portion and the second connection portion that electrically connects the first connection portion and the second connection portion. The conductor pattern includes a conductor pattern of the first connection portion, a conductor pattern of the second connection portion, a conductor pattern of the transmission line portion, and an electrical-element-side bonding pattern arranged in the transmission line portion.

Abstract: In a power converter including: a first DC-DC converter, an inverter, and a control circuit, a second DC-DC converter that controls an input and an output of a power storage unit is connectable to a DC bus. The control circuit deactivates a reverse power flow suppression function for suppressing a reverse power flow from the inverter to a power system when the second DC-DC converter is not connected to the DC bus and activates the reverse power flow suppression function when the second DC-DC converter is connected to the DC bus.

Abstract: An electronic apparatus includes a substrate and an electrical element mounted on the substrate. The electrical element includes a base material including a first principal surface and a second principal surface that are deformable and flat or substantially flat surfaces and a conductor pattern included on the base material. The electrical element further includes a first connection portion and a second connection portion that connect to a circuit included on the substrate and a transmission line portion located in a position different from positions of the first connection portion and the second connection portion that electrically connects the first connection portion and the second connection portion. The conductor pattern includes a conductor pattern of the first connection portion, a conductor pattern of the second connection portion, a conductor pattern of the transmission line portion, and an electrical-element-side bonding pattern arranged in the transmission line portion.

Abstract: In a power converter, a DC bus is supplied with a DC power from a voltage conversion circuit for regulating a voltage of a power output from a DC power supply, a voltage of the DC power being regulated by the voltage conversion circuit. An inverter converts a DC power on the DC bus into an AC power and supplies the AC power as converted to a power system. A controller controls the inverter. When it is necessary to suppress an output, the controller suppresses the AC power supplied by the inverter to increase a voltage on the DC bus.

Abstract: An electronic apparatus includes a substrate and an electrical element mounted on the substrate. The electrical element includes a base material including a first principal surface and a second principal surface that are deformable and flat or substantially flat surfaces and a conductor pattern included on the base material. The electrical element further includes a first connection portion and a second connection portion that connect to a circuit included on the substrate and a transmission line portion located in a position different from positions of the first connection portion and the second connection portion that electrically connects the first connection portion and the second connection portion. The conductor pattern includes a conductor pattern of the first connection portion, a conductor pattern of the second connection portion, a conductor pattern of the transmission line portion, and an electrical-element-side bonding pattern arranged in the transmission line portion.