Patents by Inventor Akihiro Kukita

Akihiro Kukita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer holding member
    Patent number: 5677253
    Abstract: Disclosure relates to the method for improving the heat absorption characteristic of a wafer holding member made of aluminum nitride during indirect heating and the method for preventing electrostatic adhesion. To establish the former method, the wafer holding member comprises an aluminum nitride based sintered body containing Er.sub.2 O.sub.3 as a sintering aid and silicon in the range of more than 200 ppm to 500 ppm or less and having a thermal conductivity of 150 W/m.k or more, and further comprises a holding base body made of an aluminum nitride based sintered body.
    Type: Grant
    Filed: February 13, 1996
    Date of Patent: October 14, 1997
    Assignee: Kyocera Corporation
    Inventors: Hironori Inoue, Kazuhiro Kuchimachi, Yasunori Kawanabe, Saburo Nagano, Akihiro Kukita