Patents by Inventor Akihiro Mase

Akihiro Mase has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device of multichip module-type
    Patent number: 5401688
    Abstract: A semiconductor chip is packaged within film carriers which serve as the enclosure of the semiconductor chip. The finished semiconductor device is flexible, bendable, and very thin. In manufacturing this semiconductor device, the process of laminating film carriers, the process of electrically connecting the semiconductor chip and film carriers, and the process of sealing the semiconductor chip, can be performed at the same time, shortening the manufacturing time and reducing manufacturing cost.
    Type: Grant
    Filed: September 9, 1993
    Date of Patent: March 28, 1995
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yasuhiro Yamaji, Yoichi Hiruta, Tsutomu Nakazawa, Katsuto Katoh, Yoshihiro Atsumi, Naohiko Hirano, Akihiro Mase