Abstract: A first conductive pattern (13) is provided on an upper surface of the submount (7). A GND pattern (9) is provided on a lower surface of the submount (7). A lower surface electrode (21) of a capacitor (3) is bonded to the first conductive pattern (13) with solder (22). An upper surface electrode (23) of the capacitor (3) is connected to a light emitting device (2). A terminating resistor (4) is connected to the first conductive pattern (13). The first conductive pattern (13) has a protruding portion (25) which protrudes outside from the capacitor (3) in planar view. A width of the protruding portion (25) is narrower than a width of the capacitor (3).

Abstract: A first conductive pattern (13) is provided on an upper surface of the submount (7). A GND pattern (9) is provided on a lower surface of the submount (7). A lower surface electrode (21) of a capacitor (3) is bonded to the first conductive pattern (13) with solder (22). An upper surface electrode (23) of the capacitor (3) is connected to a light emitting device (2). A terminating resistor (4) is connected to the first conductive pattern (13). The first conductive pattern (13) has a protruding portion (25) which protrudes outside from the capacitor (3) in planar view. A width of the protruding portion (25) is narrower than a width of the capacitor (3).

Abstract: An optical sensor module comprises a substrate, a photodetector which detects light and is fixed to the substrate and a lens holding member, to which a lens is fixed, which is fixed to the substrate at a position surrounding the photodetector, and the lens is fixed in the state in which an outer circumference of the lens is covered by a material itself of the lens holding member, and a part of an outer edge of the lens is exposed at a side of an outer surface of the lens holding member or at a side of an inner surface of the lens holding member.

Abstract: A semiconductor device according to the present invention includes: a semiconductor element; a first metal body having a die pad to which the semiconductor element is mounted, the semiconductor element being mounted on a die bond surface of the die pad; a second metal body which has a wire bond pad connected to a signal electrode of the semiconductor element via a wire, and is provided on the same side as the die bond surface such that the second metal body is separated from the first metal body and covered by the first metal body, the second metal body forming a transmission line together with the first metal body; and a molding resin holding the first metal body and the second metal body such that a surface of the first metal body opposite to the die bond surface is exposed.

Abstract: A semiconductor device according to the present invention includes: a semiconductor element; a first metal body having a die pad to which the semiconductor element is mounted, the semiconductor element being mounted on a die bond surface of the die pad; a second metal body which has a wire bond pad connected to a signal electrode of the semiconductor element via a wire, and is provided on the same side as the die bond surface such that the second metal body is separated from the first metal body and covered by the first metal body, the second metal body forming a transmission line together with the first metal body; and a molding resin holding the first metal body and the second metal body such that a surface of the first metal body opposite to the die bond surface is exposed.

Abstract: A wavelength-multiplexing optical communication module includes: a substrate; a plurality of light sources on the substrate; a plurality of joint materials separately disposed on the substrate at positions respectively corresponding to the plurality of light sources; and a plurality of optical components fixed on the substrate by means of the plurality of joint materials respectively, wherein the substrate includes a plurality of forming portions which respectively form peripheries of the plurality of joint materials into shapes of circles or regular polygons having an even number of vertices.

Abstract: A wavelength-multiplexing optical communication module includes: a substrate; a plurality of light sources on the substrate; a plurality of joint materials separately disposed on the substrate at positions respectively corresponding to the plurality of light sources; and a plurality of optical components fixed on the substrate by means of the plurality of joint materials respectively, wherein the substrate includes a plurality of forming portions which respectively form peripheries of the plurality of joint materials into shapes of circles or regular polygons having an even number of vertices.

Abstract: A method of manufacturing a wavelength multiplexing optical communication module which includes a plurality of light emitting elements, a plurality of optical lenses adjusting wavefronts of emergent lights from the plurality of light emitting elements, and a multiplexer combining the lights adjusted by the plurality of optical lenses, includes: applying a resin on a carrier so as to have a shape with a curvature symmetric about a rotation axis; and bonding a lower surface of the optical lens to the carrier with the resin, wherein a recess having a curvature is formed at a center of the lower surface of the optical lens.

Abstract: An optical module includes an optical module lens cap. The optical module lens cap is produced by press-molding a lens into a barrel. The barrel includes a cover portion and a cylindrical portion. The cover portion includes lens mounting holes. The cover portion includes a top surface and an undersurface that are mutually opposed. The undersurface faces the inside of the cylindrical portion. The barrel is Kovar. The lens is mounted in the lens mounting hole. A low melting point glass layer is located at a rim of the lens mounting hole in the barrel, filling a gap between the lens and the barrel.

Abstract: A metallic ring is located on a multilayer ceramic substrate. An optical semiconductor laser is located on the multilayer ceramic substrate, inside the metallic ring. A metallic cap with a window is joined to the metallic ring. The metallic cap covers the optical semiconductor laser. An external heat sink is joined to an external side surface of the metallic cap. These features make it possible to improve high-frequency characteristics, producibility, and heat dissipation.

Abstract: An optical module and a manufacturing method improve positioning accuracy between parts. A barrel and a lens holder are prepared, the lens holder is fitted into a cylindrical portion from a collar portion side of the barrel, and the barrel and the lens holder are assembled. In one case, the barrel and the lens holder are assembled with a brazing material. The assembled barrel and lens holder are heated, and the brazing material is melted to braze the barrel and the lens holder. Lens glass is sandwiched between metal dies and a lens is press-molded using a pressing apparatus. In one case, positioning of press molding uses the barrel which has a small linear expansion coefficient.

Abstract: A lens cap for an optical module includes: a barrel of a metal material; and a press lens of glass and held in the barrel. The coefficient of linear expansion of the glass is 6 to 8 ppm/K, and the coefficient of linear expansion of the metal material is at least 10 ppm/K at 150° C. to 800° C. and no more than 8 ppm/K at up to 100° C. or below.

Abstract: A wiring is located on a multilayer ceramic substrate. A ceramic block is located on the multilayer ceramic substrate. Electronic parts, including a semiconductor laser, are located on a surface of the ceramic block. A wiring located on the surface of the ceramic block connects some of the electronic parts to the wiring. A metallic cap with a glass window is located on the multilayer ceramic substrate. This metallic cap covers the ceramic block and the electronic parts, including the semiconductor laser.

Abstract: An optical module includes an optical module lens cap. The optical module lens cap is produced by press-molding a lens into a barrel. The barrel includes a cover portion and a cylindrical portion. The cover portion includes lens mounting holes. The cover portion includes a top surface and an undersurface that are mutually opposed. The undersurface faces the inside of the cylindrical portion. The barrel is Kovar. The lens is mounted in the lens mounting hole. A low melting point glass layer is located at a rim of the lens mounting hole in the barrel, filling a gap between the lens and the barrel.

Abstract: An optical module and a manufacturing method thereof are provided which can improve positioning accuracy between parts. A barrel and a lens holder are prepared, the lens holder is fitted into a cylindrical portion from a collar portion side of the barrel, and the barrel and the lens holder are assembled. In this case, the barrel and the lens holder are assembled with a brazing material inserted therebetween. The assembled barrel and lens holder are heated, and the brazing material is melted to thereby perform brazing. Lens glass is sandwiched between metal dies and a lens is press-molded using a pressing apparatus. In this case, positioning of press molding is performed using the barrel for which a small linear expansion coefficient is set as a reference.

Abstract: A lens cap for an optical module includes: a barrel of a metal material; and a press lens of glass and held in the barrel. The coefficient of linear expansion of the glass is 6 to 8 ppm/K, and the coefficient of linear expansion of the metal material is at least 10 ppm/K at 150° C. to 800° C. and no more than 8 ppm/K at up to 100° C. or below.

Abstract: A wiring is located on a multilayer ceramic substrate. A ceramic block is located on the multilayer ceramic substrate. Electronic parts, including a semiconductor laser, are located on a surface of the ceramic block. A wiring located on the surface of the ceramic block connects some of the electronic parts to the wiring. A metallic cap with a glass window is located on the multilayer ceramic substrate. This metallic cap covers the ceramic block and the electronic parts, including the semiconductor laser.

Abstract: A metallic ring is located on a multilayer ceramic substrate. An optical semiconductor laser is located on the multilayer ceramic substrate, inside the metallic ring. A metallic cap with a window is joined to the metallic ring. The metallic cap covers the optical semiconductor laser. An external heat sink is joined to an external side surface of the metallic cap. These features make it possible to improve high-frequency characteristics, producibility, and heat dissipation.