Patents by Inventor Akihiro Miyake

Akihiro Miyake has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9803315
    Abstract: A cationizing agent for cationizing a cloth prior to the firm fixing of water-insoluble particles onto the cloth, said cationizing agent comprising a polymer having a constituent unit (a1) derived from a vinylamine monomer represented by formula (1). (In the formula, R1 represents a hydrogen atom or a methyl group.
    Type: Grant
    Filed: March 18, 2014
    Date of Patent: October 31, 2017
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Takayuki Kobayashi, Hideaki Oonishi, Akihiro Miyake
  • Publication number: 20160017538
    Abstract: A cationizing agent for cationizing a cloth prior to the firm fixing of water-insoluble particles onto the cloth, said cationizing agent comprising a polymer having a constituent unit (a1) derived from a vinylamine monomer represented by formula (1). (In the formula, R1 represents a hydrogen atom or a methyl group.
    Type: Application
    Filed: March 18, 2014
    Publication date: January 21, 2016
    Applicant: Mitsubishi Rayon Co., Ltd.
    Inventors: Takayuki KOBAYASHI, Hideaki OONISHI, Akihiro MIYAKE
  • Patent number: 5246564
    Abstract: A method of manufacturing a copper-polyimide substrate, includes hydrophilicating the surface(s) of a polyimide film, applying a catalyst thereto, subjecting the film to electroless plating, heat-treating it in an inert atmosphere, and subjecting it to electroless copper plating or to electroless copper plating followed by electrolytic copper plating. The hydrophilication of the surface(s) of the polyimide film is effected with an aqueous solution containing a hydrazine hydrate and an alkali metal hydroxide or with an aqueous solution containing a permanganate and/or a hypochlorite, then a catalyst is applied to the surface(s) by an ordinary way, then the surface(s) is/are subjected to electroless plating with any one of nickel, cobalt nickel alloys or cobalt alloys to form a plated layer thereon having a thickness of from 0.01 to 0.1 .mu.
    Type: Grant
    Filed: October 20, 1992
    Date of Patent: September 21, 1993
    Assignee: Sumitomo Metal Mining Company, Limited
    Inventors: Yukihiro Tamiya, Noriyuki Saeki, Akihiro Miyake, Yoshiyasu Takenaka