Abstract: A method of manufacturing a platform includes the steps of providing an interconnecting line adhering first and second regions of a mold, disposing an optical fiber with its end surface facing the mold, sealing the optical fiber and the interconnecting line with a molding material, and removing the interconnecting line and the molding material together with the optical fiber from the mold.

Abstract: An optical module comprises a platform, an optical element having an optical section and mounted on the platform, an optical fiber attached and positioned with respect to the optical section, and dummy bumps holding an end surface of the optical fiber in a state of non-contact with the optical section.

Abstract: A substrate for a semiconductor apparatus, a semiconductor apparatus and a method of manufacturing thereof and an electronic apparatus are provided that achieve excellent productivity and cost reduction. A semiconductor apparatus is formed from a substrate and a semiconductor device wire-bonded thereto. The substrate includes a substrate main body and pluralities of leads formed on a mounting surface of the substrate on which the semiconductor device is mounted. Conduction sections electrically connected to each of the leads define at least a part of external terminals. The leads have portions located under the semiconductor device, with the remaining portions located outside the semiconductor device depending upon the size of the semiconductor device.

Abstract: A method of manufacturing an optical module includes the steps of mounting an optical device onto a substrate with a surface on which an optical part is formed facing the substrate, and aligning an optical fiber with the optical part through the substrate. An aligning guide is provided at an end portion of the optical fiber except an end surface facing the optical part. The guide is attached to a guide receiving section, the position of which is determined relatively with the optical device.

Abstract: A surface emission laser (14) is disposed so that a side surface (15) of a semiconductor substrate of the surface emission laser (14) faces a plane (13) of a mounting substrate (12). By this means, emitted light (44) from the surface emission laser (14) travels in the direction along the plane (13) of the mounting substrate (12). Therefore, it is possible to dispose the optical fiber (16) so as to be along the plane (13) of the mounting substrate (12). By this means, an optical module (10) can be made thinner.

Abstract: A semiconductor device comprising a substrate including a metal portion and a resin portion and having a plurality of through holes formed in the resin portion, conductive members formed within the through holes, a semiconductor chip attached to one surface of the substrate, and a plurality of solder balls attached to the other surface of the substrate. The semiconductor chip and solder balls are electrically connected through the conductive members.

Abstract: A method of manufacturing a platform includes the steps of providing an interconnecting line adhering first and second regions of a mold, disposing an optical fiber with its end surface facing the mold, sealing the optical fiber and the interconnecting line with a molding material, and removing the interconnecting line and the molding material together with the optical fiber from the mold.

Abstract: An optical device having an optical element, a substrate, and a flexible member. A first portion of the flexible member is disposed spaced apart from the substrate, a second portion surrounding the first portion is adhered to the substrate, and a closed space is formed between the first portion and the substrate. The optical element is mounted on the substrate within the closed space.

Abstract: A semiconductor device comprising a substrate including a metal portion and a resin portion and having a plurality of through holes formed in the resin portion, conductive members formed within the through holes, a semiconductor chip attached to one surface of the substrate, and a plurality of solder balls attached to the other surface of the substrate. The semiconductor chip and solder balls are electrically connected through the conductive members.

Abstract: A semiconductor apparatus and method of manufacturing and an electronic apparatus are provided that achieve excellent productivity and substantially reduced manufacturing costs. The semiconductor apparatus may include a substrate main body having a mounting surface for mounting the semiconductor device, a plurality of leads formed on the mounting surface and a plurality of conduction sections each defining at least a part of an external terminal. The conduction sections may be electrically connected to each of the leads.

Abstract: A method of manufacturing a platform comprising the steps of: providing an interconnecting line adhered to first and second regions of a mold; disposing a pin with a tip facing the mold; sealing the pin and interconnecting line with a molding material; curing the molding material; removing the pin from the molding material to form a through hole; and removing the molding material together with the interconnecting line from the mold.

Abstract: A method of manufacturing a three-dimensional mounted assembly includes steps of disposing a plurality of electronic parts on a mold, providing a plurality of interconnections on the mold by adhering them, sealing the electronic parts and the interconnections with a molding material, processing the surface shape of the molding material by the mold three-dimensionally, curing the molding material, and removing the mold from the molding material.

Abstract: A substrate for a semiconductor apparatus, a semiconductor apparatus and a method of manufacturing thereof and an electronic apparatus are provided that achieve excellent productivity and cost reduction. A semiconductor apparatus is formed from a substrate and a semiconductor device wire-bonded thereto. The substrate includes a substrate main body and pluralities of leads formed on a mounting surface of the substrate on which the semiconductor device is mounted. Conduction sections electrically connected to each of the leads define at least a part of external terminals. The leads have portions located under the semiconductor device, with the remaining portions located outside the semiconductor device depending upon the size of the semiconductor device.

Abstract: A semiconductor apparatus, method of manufacturing the same, and an electronic apparatus are provided that improve the productivity and reduce the manufacturing cost. A plurality of semiconductor devices 16 may be mounted on a substrate 10. The semiconductor devices 16 may be sealed by resin 19. A heat radiation plate 18 may be mounted and the substrate 10 and the heat radiation plate 18 may be cut into pieces corresponding to the respective semiconductor devices 16.

Abstract: A spectroscope comprising an optical fiber placed in a light path to a sample chamber, wherein a light beam outputted from the optical fiber is divided into two using an optical coupler, and wherein the two divided light beams are made incident on a measurement optical fiber and a reference optical fiber, respectively, whereby accuracy of measurement of the spectral characteristics of samples is enhanced because the outgoing light is made incident on the measurement and reference optical fibers concurrently when the light to the sample chamber becomes non-uniform due to environmental changes.