Abstract: A mounting apparatus includes a lifting and lowering device that lifts and lowers a holding member holding a component with respect to a substrate, a contact detection section that detects contact between the holding member or a component held by the holding member and the substrate, and a control section that sets a mounting height of the component in accordance with a height of the substrate, causes the holding member holding the component to be lowered to the mounting height by the lifting and lowering device, and releases holding of the component to mount the component when the contact is detected, in which the control section acquires a height of the holding member when the holding member is lowered by the lifting and lowering device and the contact is detected, and measures the height of the substrate based on the height of the holding member.

Abstract: Solder supply device includes solder cup that is tubular and open at one end, nozzle section for ejecting solder from the solder cup, flange section that is fixedly provided on an outer circumferential section of the nozzle section and that is engaged inside of the solder cup, and inner tube an end of which holds the nozzle section and the other end of which extends from the opening of the solder cup; the flange section is formed from material that is elastically deformable and the flange section is engaged inside the cup with an outer edge section of the flange section in an elastically deformed state. The elastic force arising between the outer edge section of the flange section and the solder cup is smaller than the holding force of the nozzle section by the inner tube.

Abstract: A solder supply device provided with a solder cup housing liquid solder that is tubular and open at one end; a nozzle section, for ejecting solder from the solder container, that is inserted into the solder container; a flange section that is provided on an outer circumferential section of the nozzle section and that is engaged inside of the solder cup; and an outer tube that demarcates an air chamber with the bottom surface of the solder cup. Solder is supplied from the tip of the nozzle section by the solder cup and the flange section being relatively moved by supplying air to the air chamber. Solder is supplied from the solder container without using an air cylinder, electromagnetic motor, or the like.

Abstract: A solder supply device provided with solder cup 70 housing liquid solder that is cylindrical and open at one end, and supply nozzle 74 that is inserted into the solder cup, that supplies solder from inside the solder cup by moving the solder cup by supplying air to space 86, wherein a fixed amount of air is supplied in a case in which the solder cup movement distance is less than a specified distance, and a greater amount of air than the above specified amount is supplied in a case in which the solder cup movement distance is the set movement distance or greater. That is, when supplying solder, in a case in which the volume of the space to which air is supplied is a specified volume or greater, a greater amount of air is supplied than the air supply amount for when the volume of the space is a specified volume or less.

Abstract: A solder supply device provided with a solder cup housing liquid solder that is cylindrical and open at one end, and a supply nozzle that is inserted into the solder cup, that supplies solder from inside the solder cup by moving the solder cup by supplying air to a space, wherein a fixed amount of air is supplied in a case in which the solder cup movement distance is less than a specified distance, and a greater amount of air than the above specified amount is supplied in a case in which the solder cup movement distance is the set movement distance or greater.

Abstract: A solder supply device provided with a solder cup housing liquid solder that is tubular and open at one end; a nozzle section, for ejecting solder from the solder container, that is inserted into the solder container; a flange section that is provided on an outer circumferential section of the nozzle section and that is engaged inside of the solder cup; and an outer tube that demarcates an air chamber with the bottom surface of the solder cup. Solder is supplied from the tip of the nozzle section by the solder cup and the flange section being relatively moved by supplying air to the air chamber. Solder is supplied from the solder container without using an air cylinder, electromagnetic motor, or the like.

Abstract: Solder supply device includes solder cup that is tubular and open at one end, nozzle section for ejecting solder from the solder cup, flange section that is fixedly provided on an outer circumferential section of the nozzle section and that is engaged inside of the solder cup, and inner tube an end of which holds the nozzle section and the other end of which extends from the opening of the solder cup; the flange section is formed from material that is elastically deformable and the flange section is engaged inside the cup with an outer edge section of the flange section in an elastically deformed state.

Abstract: A squeegee device includes a squeegee that has a sliding contact portion in sliding contact with a screen mask, and that prints a solder on a circuit board through the screen mask, wherein an attack angle of the squeegee is adjustable. In the squeegee device, when adjusting the attack angle during a tooling change in which the type of circuit board is changed, positions of the sliding contact portion before and after adjustment substantially match.

Abstract: A squeegee device includes a squeegee that has a sliding contact portion in sliding contact with a screen mask, and that prints a solder on a circuit board through the screen mask, wherein an attack angle of the squeegee is adjustable. In the squeegee device, when adjusting the attack angle during a tooling change in which the type of circuit board is changed, positions of the sliding contact portion before and after adjustment substantially match.