Patents by Inventor Akihiro SUZAKI
Akihiro SUZAKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230402432Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a substrate, a mounting layer, switching elements, a moisture-resistant layer and a sealing resin. The substrate has a front surface facing in a thickness direction. The mounting layer is electrically conductive and disposed on the front surface. Each switching element includes an element front surface facing in the same direction in which the front surface faces along the thickness direction, a back surface facing in the opposite direction of the element front surface, and a side surface connected to the element front surface and the back surface. The switching elements are electrically bonded to the mounting layer with their back surfaces facing the front surface. The moisture-resistant layer covers at least one side surface. The sealing resin covers the switching elements and the moisture-resistant layer.Type: ApplicationFiled: August 25, 2023Publication date: December 14, 2023Inventors: Kenji HAYASHI, Akihiro SUZAKI, Masaaki MATSUO, Ryuta WATANABE, Makoto IKENAGA
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Patent number: 11776936Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a substrate, amounting layer, switching elements, a moisture-resistant layer and a sealing resin. The substrate has a front surface facing in a thickness direction. The mounting layer is electrically conductive and disposed on the front surface. Each switching element includes an element front surface facing in the same direction in which the front surface faces along the thickness direction, a back surface facing in the opposite direction of the element front surface, and a side surface connected to the element front surface and the back surface. The switching elements are electrically bonded to the mounting layer with their back surfaces facing the front surface. The moisture-resistant layer covers at least one side surface. The sealing resin covers the switching elements and the moisture-resistant layer.Type: GrantFiled: December 15, 2021Date of Patent: October 3, 2023Assignee: ROHM CO., LTD.Inventors: Kenji Hayashi, Akihiro Suzaki, Masaaki Matsuo, Ryuta Watanabe, Makoto Ikenaga
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Publication number: 20220108977Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a substrate, amounting layer, switching elements, a moisture-resistant layer and a sealing resin. The substrate has a front surface facing in a thickness direction. The mounting layer is electrically conductive and disposed on the front surface. Each switching element includes an element front surface facing in the same direction in which the front surface faces along the thickness direction, a back surface facing in the opposite direction of the element front surface, and a side surface connected to the element front surface and the back surface. The switching elements are electrically bonded to the mounting layer with their back surfaces facing the front surface. The moisture-resistant layer covers at least one side surface. The sealing resin covers the switching elements and the moisture-resistant layer.Type: ApplicationFiled: December 15, 2021Publication date: April 7, 2022Inventors: Kenji HAYASHI, Akihiro SUZAKI, Masaaki MATSUO, Ryuta WATANABE, Makoto IKENAGA
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Patent number: 11233037Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a substrate, amounting layer, switching elements, a moisture-resistant layer and a sealing resin. The substrate has a front surface facing in a thickness direction. The mounting layer is electrically conductive and disposed on the front surface. Each switching element includes an element front surface facing in the same direction in which the front surface faces along the thickness direction, a back surface facing in the opposite direction of the element front surface, and a side surface connected to the element front surface and the back surface. The switching elements are electrically bonded to the mounting layer with their back surfaces facing the front surface. The moisture-resistant layer covers at least one side surface. The sealing resin covers the switching elements and the moisture-resistant layer.Type: GrantFiled: April 18, 2018Date of Patent: January 25, 2022Assignee: ROHM CO., LTD.Inventors: Kenji Hayashi, Akihiro Suzaki, Masaaki Matsuo, Ryuta Watanabe, Makoto Ikenaga
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Patent number: 11127662Abstract: The disclosure provides a semiconductor device. The device includes first and second substrates, first mounting layers, second mounting layers, power supply terminals, an output terminal, electroconductive coupling members and switching elements. The first substrate has first obverse and reverse surfaces facing in a thickness direction. The second substrate has a second obverse surface facing as the first obverse surface faces in the thickness direction and a second reverse surface facing away from the second obverse surface. The second substrate is spaced from the first substrate in a first direction crossing the thickness direction. The first mounting layers are electrically conductive and disposed on the first obverse surface. The second mounting layers are electrically conductive and disposed on the second obverse surface. The power supply terminals are electrically connected to the first mounting layers. The output terminal is connected to one of the second mounting layers.Type: GrantFiled: March 14, 2018Date of Patent: September 21, 2021Assignee: ROHM CO., LTD.Inventors: Masaaki Matsuo, Kenji Hayashi, Akihiro Suzaki, Soichiro Takahashi, Masashi Hayashiguchi, Yoshihisa Tsukamoto
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Publication number: 20210134762Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a substrate, amounting layer, switching elements, a moisture-resistant layer and a sealing resin. The substrate has a front surface facing in a thickness direction. The mounting layer is electrically conductive and disposed on the front surface. Each switching element includes an element front surface facing in the same direction in which the front surface faces along the thickness direction, a back surface facing in the opposite direction of the element front surface, and a side surface connected to the element front surface and the back surface. The switching elements are electrically bonded to the mounting layer with their back surfaces facing the front surface. The moisture-resistant layer covers at least one side surface. The sealing resin covers the switching elements and the moisture-resistant layer.Type: ApplicationFiled: April 18, 2018Publication date: May 6, 2021Inventors: Kenji HAYASHI, Akihiro SUZAKI, Masaaki MATSUO, Ryuta WATANABE, Makoto IKENAGA
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Patent number: 10777542Abstract: A semiconductor device according to the present invention incudes a semiconductor chip, a conductive member for supporting the semiconductor chip, a joint material provided between the conductive member and the semiconductor chip, and a release groove formed on the surface of the conductive member and arranged away from the semiconductor chip with the one end and the other end of the release groove connected to the peripheral edges of the conductive member, respectively.Type: GrantFiled: June 4, 2018Date of Patent: September 15, 2020Assignee: ROHM CO., LTD.Inventors: Kenji Hayashi, Akihiro Suzaki
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Publication number: 20200013703Abstract: The disclosure provides a semiconductor device. The device includes first and second substrates, first mounting layers, second mounting layers, power supply terminals, an output terminal, electroconductive coupling members and switching elements. The first substrate has first obverse and reverse surfaces facing in a thickness direction. The second substrate has a second obverse surface facing as the first obverse surface faces in the thickness direction and a second reverse surface facing away from the second obverse surface. The second substrate is spaced from the first substrate in a first direction crossing the thickness direction. The first mounting layers are electrically conductive and disposed on the first obverse surface. The second mounting layers are electrically conductive and disposed on the second obverse surface. The power supply terminals are electrically connected to the first mounting layers. The output terminal is connected to one of the second mounting layers.Type: ApplicationFiled: March 14, 2018Publication date: January 9, 2020Inventors: Masaaki MATSUO, Kenji HAYASHI, Akihiro SUZAKI, Soichiro TAKAHASHI, Masashi HAYASHIGUCHI, Yoshihisa TSUKAMOTO
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Publication number: 20180286845Abstract: A semiconductor device according to the present invention incudes a semiconductor chip, a conductive member for supporting the semiconductor chip, a joint material provided between the conductive member and the semiconductor chip, and a release groove formed on the surface of the conductive member and arranged away from the semiconductor chip with the one end and the other end of the release groove connected to the peripheral edges of the conductive member, respectively.Type: ApplicationFiled: June 4, 2018Publication date: October 4, 2018Inventors: Kenji HAYASHI, Akihiro SUZAKI
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Patent number: 10014284Abstract: A semiconductor device according to the present invention includes a semiconductor chip, a conductive member for supporting the semiconductor chip, a joint material provided between the conductive member and the semiconductor chip, and a release groove formed on the surface of the conductive member and arranged away from the semiconductor chip with the one end and the other end of the release groove connected to the peripheral edges of the conductive member, respectively.Type: GrantFiled: March 4, 2015Date of Patent: July 3, 2018Assignee: ROHM CO., LTD.Inventors: Kenji Hayashi, Akihiro Suzaki
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Publication number: 20170069613Abstract: A semiconductor device according to the present invention includes a semiconductor chip, a conductive member for supporting the semiconductor chip, a joint material provided between the conductive member and the semiconductor chip, and a release groove formed on the surface of the conductive member and arranged away from the semiconductor chip with the one end and the other end of the release groove connected to the peripheral edges of the conductive member, respectively.Type: ApplicationFiled: March 4, 2015Publication date: March 9, 2017Inventors: Kenji HAYASHI, Akihiro SUZAKI