Abstract: A semiconductor storage device 100 includes a controller package 110 having a BGA terminal on a bottom surface thereof; and one or a plurality of memory packages 120 each including a plurality of semiconductor storage elements and mounted on the controller package. The controller package includes a bottom substrate having the BGA terminal on a bottom surface thereof; a power supply IC, mounted on the bottom substrate, for supplying a plurality of power supplies; and a controller mounted on the bottom substrate and operable by the plurality of power supplies supplied from the power supply IC. The controller provides an interface with an external system via the BGA terminal and controls a read operation from the semiconductor storage elements and a write operation to the semiconductor storage elements.

Abstract: A semiconductor storage device 100 includes a controller package 110 having a BGA terminal on a bottom surface thereof; and one or a plurality of memory packages 120 each including a plurality of semiconductor storage elements and mounted on the controller package. The controller package includes a bottom substrate having the BGA terminal on a bottom surface thereof; a power supply IC, mounted on the bottom substrate, for supplying a plurality of power supplies; and a controller mounted on the bottom substrate and operable by the plurality of power supplies supplied from the power supply IC. The controller provides an interface with an external system via the BGA terminal and controls a read operation from the semiconductor storage elements and a write operation to the semiconductor storage elements.

Abstract: In the semiconductor module comprising a package substrate, a first semiconductor package, and a semiconductor bare chip, such problems as the occurrence of a wire short caused by warpage of the first semiconductor package and non-filling and the like at the time of resin sealing can be solved. A semiconductor module 10, having: a semiconductor package 6, which is obtained by mounting and resin-sealing a semiconductor bare chip on a first package substrate; a semiconductor bare chip 2; and a second package substrate 12, the semiconductor module being characterized in that the semiconductor package 6 is mounted on the second package substrate 12 and the semiconductor bare chip 2 is mounted on the semiconductor package 6.