Abstract: A manufacturing method for a flat panel display module includes forming a display section having a transparent substrate with a wiring line terminal section adjacent at least one edge. A light emitting section is a center section, with a sealing cap covering the light emitting section. The sealing cap is dimensioned such that an edge of said sealing cap nearest the wiring line terminal section lies inside the wiring line terminal section. A flexible printed circuit board is provided with a semiconductor device mounted thereon. The flexible printed circuit board is connected to the wiring line terminal section of the transparent substrate, and a frame is fixed around the transparent substrate.

Abstract: A polyethylene composition prepared by polymerizing ethylene and an optional olefin with ≧3 carbon atoms in the presence of a macromonomer, is provided. The macromonomer is a vinyl-terminated ethylene polymer prepared by polymerizing ethylene and an optional olefin with ≧3 carbon atoms, and the macromonomer has (A) Mn≧5,000, and Mw/Mn=2-5. The polyethylene composition comprises (C) branched polyethylene prepared by copolymerizing ethylene, the macromonomer and an optional olefin with ≧3 carbon atoms, and the macromonomer. The polyethylene composition has (D) a density of 0.890-0.980 g/cm3, (E) Mw=30,000-10,000,000, (F) Mw/Mn=2-30, (G) a long chain branch frequency of 0.01-3 per 1,000 C atoms, and (H) a shrinking factor (g′ value) of 0.1-0.9 as measured by GPC/intrinsic-viscosity. The polyethylene composition can be finely divided particles having (P) a powder bulk density of 0.15-0.50 g/cm3.

Abstract: An organic electroluminescent display (EL) device includes a substrate, an organic light emitting portion formed such that a positive electrode formed in a predetermined pattern, an organic layer formed on the positive electrode, and a negative electrode having a predetermined pattern in a direction orthogonal with the positive electrode are sequentially stacked, an encapsulation cap which encapsulates the organic light emitting portion, first and second groups of electrodes which are drawn out from at least one edge of the encapsulation cap and connected to the positive and negative electrodes to drive the organic light emitting portion, and first and second dummy electrodes formed at one side of the substrate.

Abstract: A flat panel display module includes a transparent substrate, a light emitting section, a sealing cap, a flexible printed circuit board and a semiconductor device. The transparent substrate with a wiring line terminal section is formed on one of surfaces of the transparent substrate in at least one of opposing ends of the transparent substrate. The light emitting section is provided in a display region in a center section on the surface on which the wiring line terminal section of the transparent substrate is formed. The sealing cap is provided for a sealing region to cover the light emitting section such that ends of the sealing cap does not reach the ends of the transparent substrate or the wiring line terminal section of the transparent substrate. The flexible printed circuit board is connected to the wiring line terminal section and extending along the sealing cap of the transparent substrate. The semiconductor device is mounted on the flexible printed circuit board for the light emitting section.

Abstract: A handy scanner equipped with rollers in a lower surface of a bottom plate thereof includes a bank portion protruding downward from the lower surface of the bottom plate and provided to surround a periphery of an FAP protruding downward from the same lower surface such that the FAP does not contact with a surface of an original. Downward protruding distances of the bank portion and rollers are determined such that at least a portion of the bank portion and the rollers can contact with a surface of an original simultaneously and, preferably, a difference in vertical level between lower ends of the bank portion and the FAP is set such that CTF of the handy scanner becomes 30% or more.

Abstract: A process for production of an olefin polymer is provided which comprises polymerization of ethylene and/or &agr;-olefin of three of more carbons at a polymerization temperature of not lower than 120° C. with a catalyst comprising a specific metallocene compound having a substituted fluorenyl group, and a compound which reacts with the metallocene compound to form a cationic metallocene compound. The olefin polymer or copolymer produced by the process has narrow composition distribution, narrow molecular weight distribution, and a high molecular weight.

Abstract: An organic electroluminescent display (EL) device includes a substrate, an organic light emitting portion formed such that a positive electrode formed in a predetermined pattern, an organic layer formed on the positive electrode, and a negative electrode having a predetermined pattern in a direction orthogonal with the positive electrode are sequentially stacked, an encapsulation cap which encapsulates the organic light emitting portion, first and second groups of electrodes which are drawn out from at least one edge of the encapsulation cap and connected to the positive and negative electrodes to drive the organic light emitting portion, and first and second dummy electrodes formed at one side of the substrate.

Abstract: A flat panel display module includes a transparent substrate, a light emitting section, a sealing cap, a flexible printed circuit board and a semiconductor device. The transparent substrate with a wiring line terminal section is formed on one of surfaces of the transparent substrate in at least one of opposing ends of the transparent substrate. The light emitting section is provided in a display region in a center section on the surface on which the wiring line terminal section of the transparent substrate is formed. The sealing cap is provided for a sealing region to cover the light emitting section such that ends of the sealing cap does not reach the ends of the transparent substrate or the wiring line terminal section of the transparent substrate. The flexible printed circuit board is connected to the wiring line terminal section and extending along the sealing cap of the transparent substrate. The semiconductor device is mounted on the flexible printed circuit board for the light emitting section.

Abstract: A process for production of an olefin polymer is provided which comprises polymerization of ethylene and/or &agr;-olefin of three of more carbons at a polymerization temperature of not lower than 120° C. with a catalyst comprising a specific metallocene compound having a substituted fluorenyl group, and a compound which reacts with the metallocene compound to form a cationic metallocene compound. The olefin polymer or copolymer produced by the process has narrow composition distribution, narrow molecular weight distribution, and a high molecular weight.

Abstract: A novel catalyst for olefin polymerization is provided which comprises [A] a metallocene compound containing a transition metal selected from Groups 3, 4, 5, and 6 of Periodic Table, [B] a reaction product of topotactic reduction by electron transfer, and [C] an organoaluminum compound. The catalyst may contain additionally [D] an organoalkaline earth metal compound or an organozinc compound. This catalyst has high catalytic activity for olefin polymerization without employing an expensive catalyst component.

Abstract: A flat panel display module includes a transparent substrate, a light emitting section, a sealing cap, a flexible printed circuit board and a semiconductor device. The transparent substrate with a wiring line terminal section is formed on one of surfaces of the transparent substrate in at least one of opposing ends of the transparent substrate. The light emitting section is provided in a display region in a center section on the surface on which the wiring line terminal section of the transparent substrate is formed. The sealing cap is provided for a sealing region to cover the light emitting section such that ends of the sealing cap does not reach the ends of the transparent substrate or the wiring line terminal section of the transparent substrate. The flexible printed circuit board is connected to the wiring line terminal section and extending along the sealing cap of the transparent substrate. The semiconductor device is mounted on the flexible printed circuit board for the light emitting section.

Abstract: A polyolefin of a high molecular weight is produced by using a catalyst comprising a transition metal compound represented by General Formula (1):

Abstract: A process for producing an ethylene/&agr;-olefin copolymer is provided in which ethylene is copolymerized with an &agr;-olefin having three or more carbons by use of an olefin polymerization catalyst at a polymerization temperature of not lower than 120° C. The olefin polymerization catalyst comprises, as constitutional components, a) a metallocene compound comprising hafnium, b) an ionizing ionic compound, and c) an organoaluminum compound, the ionizing ionic compound (b) being a compound which is capable of changing the metallocene compound (a) into a cationic form and does not further react the cationic form of the metallocene compound.

Abstract: An ethylene/&agr;-olefin copolymer of a weight-average molecular weight of not less than 40000 is produced by copolymerization of ethylene with an &agr;-olefin having three or more carbons by use of an olefin polymerization catalyst at a polymerization temperature of not lower than 120° C., the olefin polymerization catalyst comprising, as constitutional components, a) a metallocene compound, b) an ionizing ionic compound, and c) an organoaluminum compound, the ionizing ionic compound (b) being a compound which is capable of changing the metallocene compound (a) into a cationic form and does not further react the cationic form of the metallocene compound. This process produces an ethylene/&agr;-olefin copolymer of high molecular weight in high efficiency.

Abstract: A ceramic substrate for mounting a field emission cathode is secured on the lower surface of a metal flange for assembly of an electron lens of a cathode ray tube, and the mounting position of the field emission cathode on the ceramic substrate is determined with reference to the metal flange.

Abstract: A catalyst for polymerization of an olefin is provided which comprises a metallocene compound having a specified substituted fluorenyl group, and a compound capable of reacting the metallocene compound to form a cationic metallocene compound. With this compound, a high-molecular olefin polymer having narrow composition distribution and narrow molecular-weight distribution can be obtained at a polymerization temperature of not lower than 120.degree. C.

Abstract: Catalysts for olefin polymerization which consist essentially of a transition metal compound, a modified clay compound and an organic aluminum compound, wherein the modified clay compound comprises a reaction product of a clay mineral and a proton acid salt of a specific amine compound, as well as a method of polymerizing olefins using such catalysts. It is possible thereby to obtain olefin polymers with high productivity and low ash content.

Abstract: There is provided a field emission electron source including (a) a substrate at least a surface of which is electrically conductive, (b) at least one conically shaped, electrically conductive emitter, the emitter being formed on the substrate, (c) an electrically insulating layer formed on the substrate for electrically insulating the substrate from a gate electrode, (d) a gate electrode formed on the electrically insulating layer, the gate electrode and the electrically insulating layer being formed with an opening in which the emitter is disposed, (e) a bonding pad formed on the electrically insulating layer and in electrical communication with the gate electrode, (f) a first metal layer formed on the bonding pad, and (g) a second metal layer formed on the first metal layer, the second metal layer having a higher melting point than that of the first metal layer.

Abstract: A novel catalyst for polymerization of olefin is provided which comprises a modified clay compound (a) having an average particle diameter of less than 10 .mu.m, a transition metal compound (b), and an organoaluminum compound (c). This catalyst exhibits improved initial polymerization behavior, and produces an olefin polymer of less ash content at a high productivity.

Abstract: A method of mounting a semiconductor device first forms a barrier layer on one surface of an semiconductor substrate made of Si. Then, a first Au layer is formed on the barrier layer. Accordingly, a semiconductor device is provided. The barrier layer is formed of metal for preventing mutual diffusion of Si in the Si semiconductor substrate with Au in the first Au layer at a high temperature of 600.degree. C. or higher. A step of acquiring a package substrate forms a metal coated layer on a base first and then forms a second Au layer on the surface of the metal coated layer. Then, the semiconductor device is placed on the package substrate with the first and second Au layers contacting with each other, and the semiconductor device and the package substrate are scrubbed against each other. Consequently, the first and second Au layers form Au--Au eutectic layer, thereby connect the semiconductor device to the package substrate.