Patents by Inventor Akihiro Yoshino

Akihiro Yoshino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11974040
    Abstract: An endoscope processor includes a processor that can be connected to an endoscope including a moving mechanism of a focusing lens included in an objective optical system and an image pickup apparatus. The processor is configured to determine whether or not a transition has been made from a screening state to a proximity state based on positional information of the focusing lens and an image in a proximity determination mode when a variation in an image height in an effective image range with control of the moving mechanism is 1% or less, and when it is determined that a transition has been made to the proximity state, the processor is configured to end the proximity determination mode and control the moving mechanism in an autofocus mode.
    Type: Grant
    Filed: September 15, 2022
    Date of Patent: April 30, 2024
    Assignee: OLYMPUS MEDICAL SYSTEMS CORP.
    Inventors: Akihiro Miyata, Toshiaki Mikami, Koichiro Yoshino
  • Patent number: 7588659
    Abstract: It is a joining auxiliary agent for a polyamide resin with which a predetermined joining face of a polyamide resin molded article is coated to ensure the joining strength between the predetermined joining face and another polyamide resin when they are joined together, and has a composition containing a compound (1), which cleaves a hydrogen bond in the polyamide resin molded article while assisting the dissolution of the polyamide resin, in an organic solvent capable of dissolving the polyamide resin.
    Type: Grant
    Filed: December 18, 2003
    Date of Patent: September 15, 2009
    Assignee: Kabushiki Kaisha Katazen
    Inventors: Akihiro Yoshino, Kumeo Kondo, Koji Tomoda
  • Publication number: 20060084788
    Abstract: It is a joining auxiliary agent for a polyamide resin with which a predetermined joining face of a polyamide resin molded article is coated to ensure the joining strength between the predetermined joining face and another polyamide resin when they are joined together, and has a composition containing a compound (1), which cleaves a hydrogen bond in the polyamide resin molded article while assisting the dissolution of the polyamide resin, in an organic solvent capable of dissolving the polyamide resin.
    Type: Application
    Filed: December 18, 2003
    Publication date: April 20, 2006
    Inventors: Akihiro Yoshino, Kumeo Kondo, Koji Tomoda