Patents by Inventor Akihisa Fukumoto
Akihisa Fukumoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230395470Abstract: A power module includes: a resin mold; and a lead frame in which a first region is drawn out from a first surface of the resin mold, and a second region extending from the first region in a direction perpendicular to the first surface is sealed inside the resin mold. The first region is bent toward a second surface of the resin mold along the first surface, and the first surface has a shape in which a bending angle is larger than 90 degrees, in which the bending angle is an angle formed by two regions, in the lead frame, adjacent to each other with a bent portion formed by bending the first region interposed in between.Type: ApplicationFiled: May 17, 2021Publication date: December 7, 2023Applicant: Mitsubishi Electric CorporationInventors: Akihisa FUKUMOTO, Masaki GOTO
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Patent number: 10978364Abstract: A semiconductor module is obtained in which breakage of the semiconductor module can be detected in advance while suppressing increase in manufacturing cost. A semiconductor module includes a semiconductor element, a circuit board, a resistor, a first wiring member, and a detector. The circuit board includes a circuit pattern. The resistor is connected to a surface of the circuit pattern. The first wiring member directly connects the resistor to the semiconductor element. In the first wiring member, at least part of current flowing from the semiconductor element to the circuit pattern flows. The detector is configured to detect at least one of a change of a voltage drop value in the resistor and a change of a current value in the resistor.Type: GrantFiled: May 23, 2018Date of Patent: April 13, 2021Assignee: MITSUBISHI ELECTRIC CORPORATIONInventors: Akihisa Fukumoto, Yasushi Nakayama, Hiroshi Kobayashi
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Publication number: 20200273760Abstract: A semiconductor module is obtained in which breakage of the semiconductor module can be detected in advance while suppressing increase in manufacturing cost. A semiconductor module includes a semiconductor element, a circuit board, a resistor, a first wiring member, and a detector. The circuit board includes a circuit pattern. The resistor is connected to a surface of the circuit pattern. The first wiring member directly connects the resistor to the semiconductor element. In the first wiring member, at least part of current flowing from the semiconductor element to the circuit pattern flows. The detector is configured to detect at least one of a change of a voltage drop value in the resistor and a change of a current value in the resistor.Type: ApplicationFiled: May 23, 2018Publication date: August 27, 2020Applicant: Mitsubishi Electric CorporationInventors: Akihisa FUKUMOTO, Yasushi NAKAYAMA, Hiroshi KOBAYASHI
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Patent number: 10418295Abstract: A power module includes an insulated circuit board, a semiconductor element, a first buffer plate, and first and second joining materials. The semiconductor element is disposed on a side of one main surface of the insulated circuit board. The first buffer plate is disposed between the insulated circuit board and the semiconductor element. The first joining material is divided into a plurality of portions in a plan view. The first buffer plate is higher in coefficient of linear expansion than the semiconductor element and lower in coefficient of linear expansion than the insulated circuit board. The first buffer plate is lower in Young's modulus than the semiconductor element.Type: GrantFiled: November 4, 2016Date of Patent: September 17, 2019Assignee: Mitsubishi Electric CorporationInventors: Yoshinori Yokoyama, Shinnosuke Soda, Narihito Ota, Kazuyasu Nishikawa, Akihisa Fukumoto
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Patent number: 10181445Abstract: A power module includes a power semiconductor element, an interconnection material, a circuit board, an external terminal, a joining material, and a sealing resin. A clearance portion is continuously formed between the sealing resin and each of an end surface of the joining material and a surface of the interconnection material so as to extend from the end surface of the joining material to the surface of the interconnection material, the end surface of the joining material being located between the power semiconductor element and the interconnection material, the surface of the interconnection material being located between the end surface and a predetermined position of the interconnection material separated by a distance from the end surface.Type: GrantFiled: September 29, 2015Date of Patent: January 15, 2019Assignee: Mitsubishi Electric CorporationInventors: Akihisa Fukumoto, Tetsu Negishi, Kei Yamamoto, Toshiaki Shinohara, Kazuyasu Nishikawa
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Publication number: 20180366383Abstract: A power module includes an insulated circuit board, a semiconductor element, a first buffer plate, and first and second joining materials. The semiconductor element is disposed on a side of one main surface of the insulated circuit board. The first buffer plate is disposed between the insulated circuit board and the semiconductor element. The first joining material is divided into a plurality of portions in a plan view. The first buffer plate is higher in coefficient of linear expansion than the semiconductor element and lower in coefficient of linear expansion than the insulated circuit board. The first buffer plate is lower in Young's modulus than the semiconductor element.Type: ApplicationFiled: November 4, 2016Publication date: December 20, 2018Applicant: Mitsubishi Electric CorporationInventors: Yoshinori YOKOYAMA, Shinnosuke SODA, Narihito OTA, Kazuyasu NISHIKAWA, Akihisa FUKUMOTO
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Publication number: 20170352629Abstract: A power module includes a power semiconductor element, an interconnection material, a circuit board, an external terminal, a joining material, and a sealing resin. A clearance portion is continuously formed between the sealing resin and each of an end surface of the joining material and a surface of the interconnection material so as to extend from the end surface of the joining material to the surface of the interconnection material, the end surface of the joining material being located between the power semiconductor element and the interconnection material, the surface of the interconnection material being located between the end surface and a predetermined position of the interconnection material separated by a distance from the end surface.Type: ApplicationFiled: September 29, 2015Publication date: December 7, 2017Applicant: Mitsubishi Electric CorporationInventors: Akihisa FUKUMOTO, Tetsu NEGISHI, Kei YAMAMOTO, Toshiaki SHINOHARA, Kazuyasu NISHIKAWA
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Publication number: 20050076545Abstract: The deposit conveyance mechanism is capable of effectively conveying deposits. The mechanism comprises: a conveying tube 10 having a suction port 12, a vertical tube part 13, a horizontal tube part 14 horizontally extending sideward, the horizontal tube part 14 being held in the water so as to locate below a hydraulic gradient line and vertically moved so as to move the suction port 12 close to and away from the bottom face of the water storing place, by an elevating unit 38, in a prescribed cycle; a cup-shaped member 60 provided to the suction port 12 of the conveying tube 10, the cup-shaped member having a lower part in which the suction port 12 is capable of moving upward and downward; a steam supplying section 73 supplying steam into the cup-shaped member 60; and a compressed gas supplying section 74 supplying a compressed gas into the cup-shaped member 60.Type: ApplicationFiled: June 12, 2003Publication date: April 14, 2005Inventors: Yoshiaki Tsuchiya, Motoharu Yokomori, Tsutomu Sugiyama, Akihisa Fukumoto, Masato Urakami, Mitsukuni Yoshikawa, Yorikuni Shibuya