Abstract: In a semiconductor device including a semiconductor wafer having a first main surface where a circuit element is formed, electrode pads are formed at an upper portion of the first main surface of the semiconductor wafer electrically connected with the circuit element. Index marks are formed on a second main surface of the semiconductor wafer that is opposite the first main surface. The index marks consist of line segments and indicate a direction along which the semiconductor device is to be mounted.

Abstract: In a semiconductor device including a semiconductor wafer having a first main surface where a circuit element is formed, electrode pads are formed at an upper portion of the first main surface of the semiconductor wafer electrically connected with the circuit element. Index marks are formed on a second main surface of the semiconductor wafer that is opposite the first main surface. The index marks consist of line segments and indicate a direction along which the semiconductor device is to be mounted.

Abstract: In a semiconductor device including a semiconductor wafer having a main surface where a circuit element is formed, electrode pads are formed at an upper portion of the main surface of the semiconductor wafer as electrically connected with the circuit element. A sealing resin seals the upper portion of the main surface of the semiconductor wafer, and external connection terminals are formed at the upper portion of the main surface so as to project out from the surface of the sealing resin and are arrayed in a substantially regular pattern over specific intervals from one another. At least one of the external connection terminals has a shape different from the shape of the other external connection terminals. The shape of the external connection terminal is used as an index mark, so that the index mark forming process is simplified and the index mark does not come off.

Abstract: A semiconductor device manufacturing method and a mold die that make it possible to expose the upper portions of external terminals with ease without having to implement a polishing process, are provided. The semiconductor device manufacturing method comprises a step in which external terminals are formed as bumps on a semiconductor element substrate, a step in which the semiconductor element substrate is mounted on the upper surface of a lower die of a mold die comprising an upper die and the lower die that is used to seal the semiconductor element substrate in resin, a step in which a tape is placed over the area of the upper surface of the lower die where the semiconductor element substrate is mounted and a step in which the upper die is placed in close contact with the external terminals. By employing this manufacturing method, it is possible to control the clamping force of the mold die.

Abstract: In a semiconductor device comprising a semiconductor wafer 1 that includes a main surface where a circuit element is formed, a plurality of electrode pads formed at an upper portion of the main surface of the semiconductor wafer electrically connected with the circuit element, a sealing resin 3 that seals the upper portion of the main surface of the semiconductor wafer and a plurality of external connection terminals formed at the upper portion of the main surface so as to project out from the surface of the sealing resin and arrayed in a substantially regular pattern over specific intervals from one another, at least one external connection terminal among the plurality of external connection terminals is formed in a shape different from the shape of the other external connection terminals. Since the shape of the external connection terminal itself can be used as an index mark, the index mark forming process can be simplified and such an index mark does not come off the semiconductor wafer, either.

Abstract: A push-back circuit board frame on which a semiconductor device is mounted, including a circuit board, the board being detached from the frame and being returned to an original position in the frame, a cavity formed at an edge of the circuit board in the frame, a semiconductor chip mounted on the circuit board, a resin sealing the semiconductor chip on the circuit board, and a support base made of the same material as the resin, formed in the cavity, where all of the resin is formed simultaneously, and connected each other.