Patents by Inventor Akihisa Murata

Akihisa Murata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11357094
    Abstract: A deflection electromagnet device generates a high magnetic field without increasing the size of a vacuum duct to facilitate control over a beam orbit. Magnetic flux lines from a return pole pass through the vacuum duct of a high-temperature superconductor in a vacuum heat insulation container and the charged particle beam is thus deflected, thereby generating radiation. A three-pole magnetic field is formed on the beam orbit and the charged particle beam is thus deflected by individual magnetic fields, so that radiation can be generated while the charged particle beam returns to a coaxial orbit. Therefore, an increase in size of the vacuum duct can be prevented. A shielding current is dominant and the non-uniformity of the magnetic field in a z-axis direction is prevented by disposing the high-temperature superconductor having a crystal direction c-axis orthogonal to a horizontal plane in which the charged particle beam flows.
    Type: Grant
    Filed: January 22, 2018
    Date of Patent: June 7, 2022
    Assignee: HITACHI, LTD.
    Inventors: Akihisa Miyazoe, Yukihiro Murata
  • Publication number: 20220063012
    Abstract: The present invention enables even a beginner to acquire the technique easily and perform suitable spot welding, and achieves improved workability, improved welding quality, improved productivity, and the like.
    Type: Application
    Filed: December 23, 2019
    Publication date: March 3, 2022
    Applicant: MURATA WELDING LABORATORIES, INCORPORATED
    Inventors: Akihisa MURATA, Tadasuke MURATA, Manabu TANAKA
  • Publication number: 20210179893
    Abstract: A pressure-sensitive adhesive sheet including a pressure-sensitive adhesive layer having an adhesive strength reducible by an adhesive strength-reducing action. For example, the pressure-sensitive adhesive layer is a thermally releasable pressure-sensitive adhesive layer (11), and the adhesive strength-reducing action is heating of the pressure-sensitive adhesive layer (11). This pressure-sensitive adhesive sheet for build stage use is suitable for allowing an object to be formed over a build stage of an additive manufacturing apparatus to be attached to the build stage during building up, and to be readily detached from the build stage after building up. An additive manufacturing apparatus can employ the pressure-sensitive adhesive sheet for build stage use and includes a build stage, and adhesive strength-reducing means for performing an adhesive strength-reducing action to a pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet for build stage use affixed to the stage.
    Type: Application
    Filed: March 7, 2017
    Publication date: June 17, 2021
    Applicant: Nitto Denko Corporation
    Inventors: Yoshiko OGINO, Yutaka TOSAKI, Michiro KAWANISHI, Kiichiro MATSUSHITA, Akiko NONAKA, Akihisa MURATA
  • Publication number: 20200009789
    Abstract: Provided is a build mat to which a 3D print sticks well and from which the 3D print is easily separated. The build mat provided by this invention comprises a substrate and a surface layer provided to the first face of the substrate. The build mat has a peel strength of 1.5 N/18 mm or greater and 10 N/18 mm or less, determined by peeling the mat from polylactic acid (PLA) placed on the surface layer; and it is constituted so that the surface layer remains on the PLA in the peel strength measurement.
    Type: Application
    Filed: February 27, 2018
    Publication date: January 9, 2020
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yoshiko OGINO, Kiichiro MATSUSHITA, Akihisa MURATA, Tsunaki KITAHARA, Akiko NONAKA
  • Patent number: 10219054
    Abstract: A protective member for an acoustic component includes a sound-transmissive sheet composed of an elastomer. The protective member for an acoustic component may further include an adhesive layer disposed on an edge region of the sound-transmissive sheet. The sound-transmissive sheet in the protective member may have waterproofness, and may be used with a waterproof case.
    Type: Grant
    Filed: May 24, 2013
    Date of Patent: February 26, 2019
    Assignee: NITTO DENKO CORPORATION
    Inventors: Yuichi Abe, Akihisa Murata
  • Patent number: 9597745
    Abstract: The constricting nozzle of the present invention includes (i) a cylindrical nozzle body disposed around the forward end of the tungsten electrode rod concentrically with the tungsten electrode rod and defines an annular high-speed gas passage between the nozzle body and the outer peripheral surface of the forward end of the tungsten electrode rod, (ii) a plurality of positioning projections that are protrudently formed on the inner peripheral surface of the nozzle body with predetermined intervals in the circumferential direction and that are arranged along the longitudinal direction of the nozzle body to hold the tungsten electrode rod in the center position of the nozzle body, and (iii) a plurality of gas-flow regulating grooves formed between the positioning projections and that extend in parallel in the longitudinal direction of the nozzle body and regulate the shielding gas (G) flowing through the high-speed gas passage.
    Type: Grant
    Filed: December 31, 2012
    Date of Patent: March 21, 2017
    Assignee: Akihisa Murata
    Inventor: Akihisa Murata
  • Publication number: 20150146905
    Abstract: A protective member (1) of the present invention for an acoustic component includes a sound-transmissive sheet (11) composed of an elastomer. The protective member (1) for an acoustic component may further include an adhesive layer (12) disposed on an edge region of the sound-transmissive sheet (11).
    Type: Application
    Filed: May 24, 2013
    Publication date: May 28, 2015
    Inventors: Yuichi Abe, Akihisa Murata
  • Publication number: 20130330546
    Abstract: A heat-peelable adhesive sheet is provided which includes a thermally expansive pressure-sensitive adhesive layer that contains thermally expansive microspheres and the coloring agent and that is provided on one side or both sides of the substrate, or a thermally expansive pressure-sensitive adhesive layer that contains thermally expansive microspheres and is provided on one side or both sides of the substrate through a colored intermediate layer, and which has a total light transmittance of 50% or more.
    Type: Application
    Filed: March 1, 2012
    Publication date: December 12, 2013
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yoshihito Takami, Daisuke Shimokawa, Akihisa Murata
  • Publication number: 20130277337
    Abstract: The constricting nozzle of the present invention includes (i) a cylindrical nozzle body disposed around the forward end of the tungsten electrode rod concentrically with the tungsten electrode rod and defines an annular high-speed gas passage between the nozzle body and the outer peripheral surface of the forward end of the tungsten electrode rod, (ii) a plurality of positioning projections that are protrudently formed on the inner peripheral surface of the nozzle body with predetermined intervals in the circumferential direction and that are arranged along the longitudinal direction of the nozzle body to hold the tungsten electrode rod in the center position of the nozzle body, and (iii) a plurality of gas-flow regulating grooves formed between the positioning projections and that extend in parallel in the longitudinal direction of the nozzle body and regulate the shielding gas (G) flowing through the high-speed gas passage.
    Type: Application
    Filed: December 31, 2012
    Publication date: October 24, 2013
    Inventor: Akihisa Murata
  • Publication number: 20130260120
    Abstract: There are provided a base material-less double-sided pressure-sensitive adhesive sheet without warping due to shrinkage of a base material after heat treatment, and having good peelability in heat peeling, and a method for manufacturing electronic parts or semiconductors by using the pressure-sensitive adhesive sheet. A heat-peelable pressure-sensitive adhesive sheet which is a base material-less double-sided pressure-sensitive adhesive sheet including a heat-expandable pressure-sensitive adhesive layer containing heat-expandable microspheres and a pressure-sensitive adhesive layer different from the heat-expandable pressure-sensitive adhesive layer and laminated thereon, wherein the pressure-sensitive adhesive layer has a higher elastic modulus than the heat-expandable pressure-sensitive adhesive layer.
    Type: Application
    Filed: March 26, 2013
    Publication date: October 3, 2013
    Applicant: NITTO DENKO CORPORATION
    Inventors: Takamasa HIRAYAMA, Akihisa MURATA, Daisuke SHIMOKAWA
  • Patent number: 8524007
    Abstract: A cleaning sheet including a cleaning layer which has a microasperity shape having an arithmetic average roughness Ra of 0.05 ?m or less and a maximum height Rz of 1.0 ?m or less. Preferably, a substantial surface area of the cleaning layer per a flat surface of 1 mm2 is 150% or more of a substantial surface area of a silicon wafer mirror surface per a flat area of 1 mm2. The cleaning sheet may be provided on at least one surface of a transfer member so that the transfer member has a cleaning function. When the cleaning sheet or the transfer member having a cleaning function is transferred in a substrate processing apparatus in place of a substrate to be processed therein, the cleaning sheet contacts and cleans a site of the substrate processing apparatus.
    Type: Grant
    Filed: December 23, 2010
    Date of Patent: September 3, 2013
    Assignee: Nitto Denko Corporation
    Inventors: Daisuke Uenda, Yukio Arimitsu, Yoshio Terada, Yasuhiro Amano, Akihisa Murata
  • Patent number: 8475600
    Abstract: A cleaning sheet including a cleaning layer which has a microasperity shape having an arithmetic average roughness Ra of 0.05 ?m or less and a maximum height Rz of 1.0 ?m or less. Preferably, a substantial surface area of the cleaning layer per a flat surface of 1 mm2 is 150% or more of a substantial surface area of a silicon wafer mirror surface per a flat area of 1 mm2. The cleaning sheet may be provided on at least one surface of a transfer member so that the transfer member has a cleaning function. When the cleaning sheet or the transfer member having a cleaning function is transferred in a substrate processing apparatus in place of a substrate to be processed therein, the cleaning sheet contacts and cleans a site of the substrate processing apparatus.
    Type: Grant
    Filed: October 12, 2006
    Date of Patent: July 2, 2013
    Assignee: Nitto Denko Corporation
    Inventors: Daisuke Uenda, Yukio Arimitsu, Yoshio Terada, Yasuhiro Amano, Akihisa Murata
  • Patent number: 8436481
    Abstract: The present invention is intended to solve the following problems with a method for fabricating a substrateless semiconductor package using an adhesive sheet as a temporary fixing supporter. A chip can be displaced from a specified position by pressure during resin encapsulation because the chip is not properly held by the adhesive sheet. If such displacement occurs, the relative positional relationship between the chip and an interconnect to be connected to a specified position in a subsequent wiring step also changes by the displacement of the chip from the specified position. Another problem is that if adhesive deposits occur during peeling of the adhesive sheet and the surface of a package is contaminated with the adhesive deposits, adhesive components left on the surface of the chip can inhibit connection between the interconnect and the chip in a subsequent wiring step.
    Type: Grant
    Filed: December 21, 2010
    Date of Patent: May 7, 2013
    Assignee: Nitto Denko Corporation
    Inventors: Shinji Hoshino, Yukio Arimitsu, Kazuyuki Kiuchi, Akihisa Murata
  • Patent number: 8409884
    Abstract: The process for producing an organic EL panel according to the present invention is a process for producing an organic electroluminescent panel by forming an organic electroluminescent element on an ultrathin glass plate by vacuum deposition method, including forming electrodes on the ultrathin glass plate, by temporarily fixing the ultrathin glass plate to a supporting plate via a double-sided adhesive tape having a thermal release adhesive layer formed at least on one face of the base material layer, containing heat-expandable microspheres that start expansion and/or foaming at temperature higher than the vacuum deposition temperature.
    Type: Grant
    Filed: June 30, 2009
    Date of Patent: April 2, 2013
    Assignee: Nitto Denko Corporation
    Inventors: Takamasa Hirayama, Akihisa Murata, Yukio Arimitsu, Takashi Yamaoka, Masaaki Sato
  • Publication number: 20110151625
    Abstract: The present invention is intended to solve the following problems with a method for fabricating a substrateless semiconductor package using an adhesive sheet as a temporary fixing supporter. A chip can be displaced from a specified position by pressure during resin encapsulation because the chip is not properly held by the adhesive sheet. If such displacement occurs, the relative positional relationship between the chip and an interconnect to be connected to a specified position in a subsequent wiring step also changes by the displacement of the chip from the specified position. Another problem is that if adhesive deposits occur during peeling of the adhesive sheet and the surface of a package is contaminated with the adhesive deposits, adhesive components left on the surface of the chip can inhibit connection between the interconnect and the chip in a subsequent wiring step.
    Type: Application
    Filed: December 21, 2010
    Publication date: June 23, 2011
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shinji HOSHINO, Yukio ARIMITSU, Kazuyuki KIUCHI, Akihisa MURATA
  • Publication number: 20110124136
    Abstract: Provided is a process for producing an organic EL panel by using an ultrathin glass plate, in which the ultrathin glass plate is not “fractured” or “cut” in the production process, the organic EL element is formed reliably when formed by vacuum deposition, and recovered without damage after the production process, and there is no need for installing an additional step of cleaning the rear face of the ultrathin glass plate.
    Type: Application
    Filed: June 30, 2009
    Publication date: May 26, 2011
    Applicant: NITTO DENKO CORPORATION
    Inventors: Takamasa Hirayama, Akihisa Murata, Yukio Arimitsu, Takashi Yamaoka, Masaaki Sato
  • Publication number: 20110088721
    Abstract: A cleaning sheet including a cleaning layer which has a microasperity shape having an arithmetic average roughness Ra of 0.05 ?m or less and a maximum height Rz of 1.0 ?m or less. Preferably, a substantial surface area of the cleaning layer per a flat surface of 1 mm2 is 150% or more of a substantial surface area of a silicon wafer mirror surface per a flat area of 1 mm2. The cleaning sheet may be provided on at least one surface of a transfer member so that the transfer member has a cleaning function. When the cleaning sheet or the transfer member having a cleaning function is transferred in a substrate processing apparatus in place of a substrate to be processed therein, the cleaning sheet contacts and cleans a site of the substrate processing apparatus.
    Type: Application
    Filed: December 23, 2010
    Publication date: April 21, 2011
    Applicant: NITTO DENKO CORPORATION
    Inventors: Daisuke Uenda, Yukio Arimitsu, Yoshio Terada, Yasuhiro Amano, Akihisa Murata
  • Patent number: 7811647
    Abstract: Disclosed is a heat-peelable pressure-sensitive adhesive sheet that can prevent the deformation of a pressure-sensitive adhesive layer due to pressurization in a pressing process and can be easily peeled off from the processed article. The heat-peelable pressure-sensitive adhesive sheet includes a substrate, and a heat-expandable pressure-sensitive adhesive layer arranged on or above at least one side of the substrate and containing a foaming agent, in which the heat-expandable pressure-sensitive adhesive layer has a shear modulus (23° C.) in an unfoamed state of 7×106 Pa or more. The heat-expandable pressure-sensitive adhesive layer preferably has a shear modulus (95° C.) in an unfoamed state of less than 7×106 Pa. The foaming agent in the heat-expandable pressure-sensitive adhesive layer preferably has a foam initiating temperature higher than 80° C.
    Type: Grant
    Filed: February 18, 2005
    Date of Patent: October 12, 2010
    Assignee: Nitto Denko Corporation
    Inventors: Yukio Arimitsu, Akihisa Murata, Tomoko Kishimoto
  • Patent number: 7718257
    Abstract: A heat-peelable pressure-sensitive adhesive sheet comprises: a base material; and a thermo-expandable pressure-sensitive adhesive layer containing thermo-expandable microspheres, the thermo-expandable pressure-sensitive adhesive layer having a surface to be adhered to an adherend, wherein the surface of the thermo-expandable pressure-sensitive adhesive layer before subjecting to heating has a centerline average roughness of greater than 0.4 ?m, and has a convex portion resulting from the thermo-expandable microspheres.
    Type: Grant
    Filed: November 7, 2001
    Date of Patent: May 18, 2010
    Assignee: Nitto Denko Corporation
    Inventors: Akihisa Murata, Toshiyuki Oshima, Yukio Arimitsu, Kazuyuki Kiuchi
  • Publication number: 20090263153
    Abstract: There are provided a transfer member provided with a cleaning function, which have excellent foreign matter removing performance and transfer performance, and which can remove foreign matters having a predetermined particle diameter with especially high efficiency. The transfer member provided with a cleaning function includes a transfer member and the cleaning layer provided on at least one surface of the transfer member. The cleaning layer has a microasperity shape having an arithmetic average roughness Ra of 0.05 ?m or less and a maximum height Rz of 1.0 ?m or less. Preferably, a substantial surface area of the cleaning layer per a flat surface of 1 mm2 is 150% or more of a substantial surface area of a silicon wafer mirror surface per a flat area of 1 mm2.
    Type: Application
    Filed: October 12, 2006
    Publication date: October 22, 2009
    Applicant: NITTO DENKO CORPORATION
    Inventors: Daisuke Uenda, Yukio Arimitsu, Yoshio Terada, Yasuhiro Amano, Akihisa Murata