Patents by Inventor Akihisa Sakamoto

Akihisa Sakamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230299110
    Abstract: There are provided a sensor device and an electronic apparatus that are capable of reducing the occurrence of defects. The sensor device includes: a first substrate; a second substrate provided on a side of one surface of the first substrate; an insulating first film that is provided on the side of the one surface and covers the second substrate; and a second film that is formed of a material different from that of the first film and provided at a position facing the first substrate across the first film. The second substrate and the first film are intermixed in a first layer and the first film and the second film are intermixed in a second layer. The second film is present outside the second substrate in plan view from a direction normal to the one surface.
    Type: Application
    Filed: August 11, 2021
    Publication date: September 21, 2023
    Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventor: Akihisa SAKAMOTO
  • Publication number: 20220041756
    Abstract: By replacing the antigen-binding domain, the present inventors discovered novel polypeptide complexes that retain BiTE's strong anti-tumor activity and excellent safety properties, as well as have long half-life in blood and can damage various different target cells.
    Type: Application
    Filed: July 6, 2021
    Publication date: February 10, 2022
    Inventors: Junichi Nezu, Takahiro Ishiguro, Atsushi Narita, Akihisa Sakamoto, Yumiko Kawai, Tomoyuki Igawa, Taichi Kuramochi
  • Patent number: 11066483
    Abstract: By replacing the antigen-binding domain, the present inventors discovered novel polypeptide complexes that retain BiTE's strong anti-tumor activity and excellent safety properties, as well as have long half-life in blood and can damage various different target cells.
    Type: Grant
    Filed: November 30, 2011
    Date of Patent: July 20, 2021
    Assignee: Chugai Seiyaku Kabushiki Kaisha
    Inventors: Junichi Nezu, Takahiro Ishiguro, Atsushi Narita, Akihisa Sakamoto, Yumiko Kawai, Tomoyuki Igawa, Taichi Kuramochi
  • Publication number: 20140112914
    Abstract: By replacing the antigen-binding domain, the present inventors discovered novel polypeptide complexes that retain BiTE's strong anti-tumor activity and excellent safety properties, as well as have long half-life in blood and can damage various different target cells.
    Type: Application
    Filed: November 30, 2011
    Publication date: April 24, 2014
    Applicant: CHUGAI SEIYAKU KABUSHIKI KAISHA
    Inventors: Junichi Nezu, Takahiro Ishiguro, Atsushi Narita, Akihisa Sakamoto, Yumiko Kawai, Tomoyuki Igawa, Taichi Kuramochi
  • Publication number: 20120268073
    Abstract: A nonaqueous electrolyte battery provided with a rolled electrode assembly, in which a positive electrode including a positive electrode active material layer disposed on a positive electrode collector formed from metal foil and a negative electrode including a negative electrode active material layer disposed on a negative electrode collector formed from metal foil are stacked with a separator therebetween and are rolled, and an electrolyte, wherein at least one of the positive electrode collector and the negative electrode collector has a compressed pattern portion which is disposed as a part of the metal foil and which has a thickness smaller than that of the other portion through compression, and the compressed pattern portion from one end parallel to the rolling direction of the metal foil to the other end opposite to the one end is not disposed continuously in the direction orthogonal to the rolling direction of the metal foil.
    Type: Application
    Filed: April 5, 2012
    Publication date: October 25, 2012
    Applicant: SONY CORPORATION
    Inventors: Tokuhiro Morioka, Hitoshi Watanabe, Kaoru Abe, Akihisa Sakamoto, Takakazu Hirose, Kenichi Kawase
  • Patent number: 7001887
    Abstract: A compound of Formula (1): ? wherein R1 represents an amidinophenyl group, etc.; R2 represents a hydrogen atom, etc.; R3 represents a carbamoylalkyl group, etc.; R4 represents a hydrogen atom, etc.; R5 represents a benzyl group, etc.; R6 represents a hydrogen atom, etc.; and R7 represents an alkylsulfonyl group, etc. A crystal of a complex between factor VIIa/human soluble tissue factor and a low-molecular weight reversible factor VIIa inhibitor. A medium carrying a part or all of structure coordinate data of a complex between human factor VIIa/human soluble tissue factor and a low-molecular weight reversible factor VIIa inhibitor, obtainable by X-ray crystal structure analysis of the crystal. A method for computationally designing a low-molecular weight reversible factor VIIa inhibitor using the coordinate data.
    Type: Grant
    Filed: February 4, 2002
    Date of Patent: February 21, 2006
    Assignee: Chugai Seiyaku Kabushiki Kaisha
    Inventors: Takuya Shiraishi, Shojiro Kadono, Masayuki Haramura, Haruhiko Sato, Toshiro Kozono, Takaki Koga, Akihisa Sakamoto
  • Publication number: 20040087511
    Abstract: A compound of Formula (1): 1
    Type: Application
    Filed: August 1, 2003
    Publication date: May 6, 2004
    Inventors: Takuya Shiraishi, Shojiro Kadono, Masayuki Haramura, Haruhiko Sato, Toshiro Kozono, Takaki Koga, Akihisa Sakamoto
  • Publication number: 20030119322
    Abstract: Provided is a method of manufacturing a semiconductor device in which various kinds of processing conditions such as the polishing time in a CMP step can be always provided most appropriate against a wafer of a product lot even if there is an error in the film thickness or the like generated in a CVD step performed prior to the CMP step. The processing conditions in the CMP step are provided based on the film thickness formed in the prior CVD step. Thereby, even if there is an error in the film thickness generated in the CVD step, the processing conditions in the CMP step are provided most appropriate with the consideration of the error. In detail, based on the CVD film thickness and the target value, a processing condition calculator performs calculation of the actual amount of polishing of the present lot. Then, the processing condition calculator performs calculation based on the data, and the searched polishing rate or the searched updated value. Thereby, the polishing time is calculated.
    Type: Application
    Filed: October 3, 2002
    Publication date: June 26, 2003
    Inventors: Toshiya Hirai, Noboru Yokoo, Masahiro Makita, Hideaki Hayakawa, Yasuaki Yamamichi, Akihisa Sakamoto