Abstract: A semiconductor memory device includes a substrate, a plurality of memory chips, a controller, a plurality of terminals, a sealing member, and a sheet. The substrate has a first plane and a second plane positioned on an opposite side of the first plane. The plurality of memory chips are mounted on the first plane of the substrate. The controller is mounted on the first plane of the substrate to control the plurality of memory chips. The plurality of terminals provided on the second plane of the substrate and including a plurality of test terminals. The sealing member seals the first plane of the substrate, the plurality of memory chips, and the controller. The sheet covers the plurality of test terminals among the plurality of terminal. The sheet is an insulator and has a thermal conductivity of from 1.0 W/(m·K) to 8.0 W/(m·K).

Abstract: A semiconductor device includes a substrate having a first surface, a height adjuster mounted on the first surface of the substrate via a first adhesive layer, a semiconductor chip mounted on the height adjuster via a second adhesive layer, an electronic component mounted on the first surface of the substrate via a third adhesive layer, a bonding wire, and a sealing member. The length of the electronic component in a first direction corresponding to the thickness direction of the substrate is larger than the length of the semiconductor chip in the first direction, and the sum of the lengths of the height adjuster, the second adhesive layer, and the semiconductor chip in the first direction is larger than the length of the electronic component in the first direction.

Abstract: A semiconductor device includes a substrate having a first surface, a height adjuster mounted on the first surface of the substrate via a first adhesive layer, a semiconductor chip mounted on the height adjuster via a second adhesive layer, an electronic component mounted on the first surface of the substrate via a third adhesive layer, a bonding wire, and a sealing member. The length of the electronic component in a first direction corresponding to the thickness direction of the substrate is larger than the length of the semiconductor chip in the first direction, and the sum of the lengths of the height adjuster, the second adhesive layer, and the semiconductor chip in the first direction is larger than the length of the electronic component in the first direction.

Abstract: A lead frame has a plurality of first inner leads having distal end portions and parallel to each other, and a plurality of second inner leads having distal end portions opposing the distal end portions of the first inner leads, longer than the first inner leads, and parallel to each other. The semiconductor chip has a plurality of bonding pads arranged along one side of an element formation surface, and is mounted on the surfaces of the plurality of second inner leads using an insulating adhesive. The plurality of bonding wires include first bonding wires which electrically connect the distal end portions of the plurality of first inner leads to some of the plurality of bonding pads, and a plurality of second bonding wires which electrically connect the distal end portions of the plurality of second inner leads to the rest of the plurality of bonding pads.

Abstract: A lead frame has a plurality of first inner leads having distal end portions and parallel to each other, and a plurality of second inner leads having distal end portions opposing the distal end portions of the first inner leads, longer than the first inner leads, and parallel to each other. The semiconductor chip has a plurality of bonding pads arranged along one side of an element formation surface, and is mounted on the surfaces of the plurality of second inner leads using an insulating adhesive. The plurality of bonding wires include first bonding wires which electrically connect the distal end portions of the plurality of first inner leads to some of the plurality of bonding pads, and a plurality of second bonding wires which electrically connect the distal end portions of the plurality of second inner leads to the rest of the plurality of bonding pads.