Abstract: A wiring circuit board includes an insulating layer having a via penetrating in a thickness direction, a first conductive layer disposed on a one-side surface in the thickness direction of the insulating layer, a second conductive layer disposed on the other-side surface in the thickness direction of the insulating layer, and a conductive portion disposed on an inner peripheral surface of the via and electrically connecting the first and second conductive layers. Length L of 1 ?m-10 ?m inclusive, is measured by: drawing a segment joining first and second connection points from respectively, the one-side surface to the other-side surface in the thickness direction of the insulating layer and the inner peripheral surface in the cross-sectional view; identifying an outermost position farthest outward from the segment on the inner peripheral surface in the cross-sectional view; and measuring the length as the shortest distance from the segment to the outermost position.

Abstract: A low-dielectric board material includes a metal layer and a porous resin layer disposed on a one-side surface of the metal layer in the thickness direction. The porous resin layer includes a first region, a second region, a third region, and a fourth region that are located in sequence toward a direction away from the metal layer when the porous resin layer is equally divided into four in the thickness direction. The first region has a plurality of closed cells that are separate from each other in a resin matrix. The average of the aspect ratios AR of the plurality of closed cells in the first region is 0.80 or more and 1.20 or less. The average of the aspect ratios AR is a ratio (L1/L2) of a length L1 of a closed cell in a direction orthogonal to the thickness direction to a length L2 of the closed cell in the thickness direction in a cross-sectional view.

Abstract: A porous liquid crystal polymer sheet and a wiring circuit board have excellent handleability and excellent low repulsive properties. The porous liquid crystal polymer sheet 1 has a porosity P of 20% or more and 90% or less. The porous liquid crystal polymer sheet 1 has a thickness T of 1 ?m or more and 240 ?m or less.

Abstract: A wiring circuit board includes an insulating layer having a via penetrating in a thickness direction, a first conductive layer disposed on a one-side surface in the thickness direction of the insulating layer, a second conductive layer disposed on the other-side surface in the thickness direction of the insulating layer, and a conductive portion disposed on an inner peripheral surface of the via and electrically connecting the first and second conductive layers. Length L of 1 µm-10 µm inclusive, is measured by: drawing a segment joining first and second connection points from respectively, the one-side surface to the other-side surface in the thickness direction of the insulating layer and the inner peripheral surface in the cross-sectional view; identifying an outermost position farthest outward from the segment on the inner peripheral surface in the cross-sectional view; and measuring the length as the shortest distance from the segment to the outermost position.

Abstract: A wiring circuit board includes a porous insulating layer, and a first conductive layer sequentially toward one side in the thickness direction. The first conductive layer includes a first signal wire and first ground wires. Each of the first ground wires is thicker than the first signal wire.

Abstract: A film for a metal layer laminate board and a metal layer laminate board have excellent stiffness, while capable of suppressing fluctuation of a dielectric constant before and after pressing. The film for a metal layer laminate board includes a porous resin layer having a tensile elastic modulus at 25° C. of 800 MPa or more and 2000 MPa or less.

Abstract: A porous liquid crystal polymer sheet and a wiring circuit board have excellent handleability and excellent low repulsive properties. The porous liquid crystal polymer sheet 1 has a porosity P of 20% or more and 90% or less. The porous liquid crystal polymer sheet 1 has a thickness T of 1 ?m or more and 240 ?m or less.

Abstract: A wiring circuit board includes an insulating base layer, a conductive layer disposed on a one-side surface in a thickness direction of the insulating base layer, a cover insulating layer disposed on the one-side surface in the thickness direction of the insulating base layer to cover the conductive layer, and a shield layer disposed on the other-side surface in the thickness direction of the insulating base layer and both side surfaces in the width direction of the insulating base layer and on a one-side surface in the thickness direction of the cover insulating layer and both side surfaces in the width direction of the cover insulating layer. At least one of the insulating base layer and the cover insulating layer has a porous resin layer.

Abstract: Soft magnetic particle powder is soft magnetic particle powder composed of flat soft magnetic particles, and the soft magnetic particle powder has a particle size D10 and a particle size D50 measured with a laser diffraction particle size distribution analyzer satisfying formula below: D10/D50>0.30.

Abstract: Soft magnetic particle powder is soft magnetic particle powder composed of flat soft magnetic particles, and the soft magnetic particle powder has a particle size D10 and a particle size D50 measured with a laser diffraction particle size distribution analyzer satisfying formula below: D10/D50>0.30.

Abstract: A soft magnetic resin composition contains flat soft magnetic particles, a resin component, and a rheology control agent.

Abstract: A first coil portion is formed in a first coil region of an upper surface of an insulating layer, and a second coil portion is formed on a lower surface of the insulating layer. A second terminal is formed at a position outside the first coil region. One or more intersection regions, in which a path, extending from an inner end of the first coil portion to the second terminal, intersects the first coil portion, are provided on the upper surface. The first coil portion is parted in each intersection region. A second lead portion passes between one portion and another portion of the first coil portion parted in said each intersection region and extends from the inner end of the first coil portion to the second terminal. The first coil portion and the second coil portion are connected together in parallel via through holes formed in the insulating layer.

Abstract: The soft magnetic resin composition contains soft magnetic particles, epoxy resin, phenol resin, and acrylic resin. The soft magnetic particle content relative to the soft magnetic resin composition is 60 vol % or more. The soft magnetic resin composition after curing has a linear expansion coefficient of 22.0 ppm/° C. or less.

Abstract: A soft magnetic resin composition contains flat soft magnetic particles, a resin component, and a rheology control agent.

Abstract: A soft magnetic resin composition contains flat soft magnetic particles and a resin component, and the soft magnetic particles have a tap density of 1.1 g/cm3 or less.

Abstract: Soft magnetic particle powder is soft magnetic particle powder composed of flat soft magnetic particles, and the soft magnetic particle powder has a particle size D10 and a particle size D50 measured with a laser diffraction particle size distribution analyzer satisfying formula below: D10/D50>0.30.

Abstract: A first coil portion is formed on a first coil region of an upper surface, and a second coil portion is formed on a lower surface, of an insulating layer. A second terminal is formed at a position outside of the first coil region. One or plurality of intersection regions in which a path extending from an inner end of the first coil portion to the second terminal intersects with the first coil portion are provided on the upper surface. The first coil portion is parted in each intersection region. A second lead portion passes between one and the other portions of the first coil portion parted in each intersection region and extends from the inner end of the first coil portion to the second terminal. The first and second coil portions are connected in parallel to each other via a plurality of through holes formed in the insulating layer.

Abstract: An opto-electric hybrid board includes an electric circuit board, an optical waveguide, and a metal layer. The electric circuit board includes an insulative layer having front and back surfaces, and electrical interconnect lines formed on the front surface of the insulative layer. The optical waveguide includes a first cladding layer and cores, and the optical waveguide is formed on the back surface of the insulative layer of the electric circuit board. The metal layer is formed between the first cladding layer of the optical waveguide and the back surface of the insulative layer of the electric circuit board. Part of the opto-electric hybrid board is formed as a to-be-bent portion. The metal layer is partially removed in a portion corresponding to the to-be-bent portion. A first cladding layer of the optical waveguide fills a site where the metal layer is removed.

Abstract: An opto-electric hybrid board includes an electric circuit board, an optical waveguide, and a metal layer. The electric circuit board includes an insulative layer having front and back surfaces, and electrical interconnect lines formed on the front surface of the insulative layer. The optical waveguide includes a first cladding layer and cores, and the optical waveguide is formed on the back surface of the insulative layer of the electric circuit board. The metal layer is formed between the first cladding layer of the optical waveguide and the back surface of the insulative layer of the electric circuit board. Part of the opto-electric hybrid board is formed as a to-be-bent portion. The metal layer is partially removed in a portion corresponding to the to-be-bent portion. A first cladding layer of the optical waveguide fills a site where the metal layer is removed.