Abstract: An LED module includes an electrical insulation material including a first surface having a total reflectivity of not less than 80% with respect to light with a wavelength of 450 nm, a via hole penetrating through the electrical insulation material, a wiring pattern on a second surface of the electrical insulation material, a metal filler formed in the via hole and electrically connected to the wiring pattern, and an LED chip bonded to a surface of the metal filler on the first surface of the electrical insulation material, and sealed with a resin.

Abstract: A semiconductor device has a semiconductor element; an interposer substrate having a wiring pattern electrically connected to the semiconductor element and an insulating substrate formed with the wiring pattern; a connection layer for adhering between the semiconductor element and the interposer substrate; and a solder ball external terminal arranged on the interposer substrate. The insulating substrate is folded in a portion mounted with the external terminal arranged on an outer side to the semiconductor element, and the unfolded and folded portions of the insulating substrate are opposite each other to form a gap therebetween.

Abstract: A multilayer semiconductor device has plural semiconductor devices, each having a circuit board for a ball grid array and a semiconductor chip provided on the board. The semiconductor boards are bonded together by a reflow mounting process to use a solder ball for interlayer connection so as to form a multilayer structure. The plural semiconductor devices each have a projection for restricting inclination of the circuit board, and the projection is provided between neighboring two of the circuit boards.

Abstract: A semiconductor device has a semiconductor element; an interposer substrate having a wiring pattern electrically connected to the semiconductor element and an insulating substrate formed with the wiring pattern; a connection layer for adhering between the semiconductor element and the interposer substrate; and a solder ball external terminal arranged on the interposer substrate. The insulating substrate is folded in a portion mounted with the external terminal arranged on an outer side to the semiconductor element, and the unfolded and folded portions of the insulating substrate are opposite each other to form a gap therebetween.

Abstract: A technology is provided that can seal the opening in a wiring board using a transfer mold insulating resin from the opening. A mold die is used which includes a first die having a recess in a predetermined form and a second flat die. The first die is disposed on a surface of a wiring board which has a plurality of openings and on which a semiconductor chip is mounted via an elastic material. The second die is disposed on a back surface of the wiring board opposite the surface on which the semiconductor chip is mounted. The mold is used for sealing with an insulating resin the periphery of the semiconductor chip and at least one of the openings of the wiring board, wherein the above-described second die has a protrusion around an area overlapping the opening to be sealed with the insulating resin.

Abstract: A multilayer semiconductor device has plural semiconductor devices, each having a circuit board for a ball grid array and a semiconductor chip provided on the board. The semiconductor boards are bonded together by a reflow mounting process to use a solder ball for interlayer connection so as to form a multilayer structure. The plural semiconductor devices each have a projection for restricting inclination of the circuit board, and the projection is provided between neighboring two of the circuit boards.

Abstract: The amount of time required to manufacture double-sided printed circuit boards that contain conductor bridges can be reduced. A method is provided which includes the steps of forming holes which pass through an insulating board and a first conductor layer formed on a first main side of the insulating board, bonding a second conductor layer to a second main side of the insulating board having the holes, forming a third conductor layer on the whole first main side of the insulating board after bonding the second conductor layer, masking preset holes with a plating resist, plating the first conductor and holes in the insulating board, patterning the first conductor layer to form a first conductor pattern, patterning said second conductor layer to form a second conductor pattern, and removing the plating resist and the third conductor layer from an area which is covered with the plating resist.

Abstract: In a semiconductor device comprising: a wiring board comprising a conductor wiring having a predetermined pattern provided on the surface of an insulating substrate; an elastomer provided on the wiring board; a semiconductor chip bonded onto the wiring board through the elastomer; and an insulator for sealing the periphery of the semiconductor chip and the elastomer, the semiconductor chip in its external terminal being electrically connected to the conductor wiring, a part of the elastomer is exposed onto the surface of the insulator. By virtue of the above construction, a lowering in device reliability can be prevented.

Abstract: An object of the present invention is to provide a technology that can seal the opening of the interposer by transfer mold with the leak of the insulating resin from the above-described opening prevented.

Abstract: This invention reduces the amount of time required to manufacture double-sided printed circuit boards that contain conductor bridges.

Abstract: In a semiconductor device comprising: a wiring board comprising a conductor wiring having a predetermined pattern provided on the surface of an insulating substrate; an elastomer provided on the wiring board; a semiconductor chip bonded onto the wiring board through the elastomer; and an insulator for sealing the periphery of the semiconductor chip and the elastomer, the semiconductor chip in its external terminal being electrically connected to the conductor wiring, a part of the elastomer is exposed onto the surface of the insulator. By virtue of the above construction, a lowering in device reliability can be prevented.

Abstract: A method of receiving wavelength multiplex signals is designed to receive together, at an end of an optical fiber transmission path, optical information signals transmitted in multiple wavelengths, which correspond to multiple kinds of information, from a plurality of information sources distributed at a virtually constant interval along the transmission path in response to an optical trigger signal. Each of the optical information signals is sampled at a time interval that is in inverse proportion to the light velocity which depends on the wavelength of the signal, so that the content, kind and source of information are identified at the signal reception.