Patents by Inventor Akikazu MATSUDA

Akikazu MATSUDA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Mercaptoethylglycol uril compound and utilization thereof
    Patent number: 10550131
    Abstract: The present invention provides a novel mercaptoethylglycoluril compound. The present invention also provides a curing agent for an epoxy resin using the substance, an epoxy resin composition using the curing agent for an epoxy resin, and an adhesive and a sealing agent each using the epoxy resin composition.
    Type: Grant
    Filed: March 10, 2016
    Date of Patent: February 4, 2020
    Assignees: SHIKOKU CHEMICALS CORPORATION, NAMICS CORPORATION
    Inventors: Akikazu Matsuda, Naoto Okumura, Takeshi Kumano
  • Resin composition
    Patent number: 10246550
    Abstract: There is provided a resin composition which can be thermoset at a temperature of approximately 80° C., and has excellent PCT resistance and a long pot life. This resin composition is suitable as a one-component adhesive agent to be used during the manufacture of image sensor modules or electronic components. The resin composition according to the present invention is a resin composition having the following characteristics. The resin composition includes (A) a compound represented by formula (1) below, an oligomer having as its basic skeleton a structure represented by formula (2) below, (C) an epoxy resin, and (D) a curing accelerator. The mass ratio ((B)/(A)) between the compound of the (A) component and the oligomer of the (B) component is 5 to 25%. Furthermore, the total content of the compound of the (A) component and the oligomer of the (B) component is 0.5 equivalents to 2.
    Type: Grant
    Filed: March 10, 2016
    Date of Patent: April 2, 2019
    Assignee: NAMICS CORPORATION
    Inventors: Kazuki Iwaya, Fuminori Arai, Akikazu Matsuda, Naoto Okumura, Takeshi Kumano
  • RESIN COMPOSITION
    Publication number: 20180051128
    Abstract: There is provided a resin composition which can be thermoset at a temperature of approximately 80° C., and has excellent PCT resistance and a long pot life. This resin composition is suitable as a one-component adhesive agent to be used during the manufacture of image sensor modules or electronic components. The resin composition according to the present invention is a resin composition having the following characteristics. The resin composition includes (A) a compound represented by formula (1) below, an oligomer having as its basic skeleton a structure represented by formula (2) below, (C) an epoxy resin, and (D) a curing accelerator. The mass ratio ((B)/(A)) between the compound of the (A) component and the oligomer of the (B) component is 5 to 25%. Furthermore, the total content of the compound of the (A) component and the oligomer of the (B) component is 0.5 equivalents to 2.
    Type: Application
    Filed: March 10, 2016
    Publication date: February 22, 2018
    Inventors: Kazuki IWAYA, Fuminori ARAI, Akikazu MATSUDA, Naoto OKUMURA, Takeshi KUMANO
  • MERCAPTOETHYLGLYCOL URIL COMPOUND AND UTILIZATION THEREOF
    Publication number: 20180051038
    Abstract: The present invention provides a novel mercaptoethylglycoluril compound. The present invention also provides a curing agent for an epoxy resin using the substance, an epoxy resin composition using the curing agent for an epoxy resin, and an adhesive and a sealing agent each using the epoxy resin composition.
    Type: Application
    Filed: March 10, 2016
    Publication date: February 22, 2018
    Applicant: SHIKOKU CHEMICALS CORPORATION
    Inventors: Akikazu MATSUDA, Naoto OKUMURA, Takeshi KUMANO