Patents by Inventor Akiko FUJIMAKI

Akiko FUJIMAKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device with improved heat dissipation
    Patent number: 11004837
    Abstract: A semiconductor device includes a substrate, a semiconductor device module, and a heat conductor. The semiconductor device module is on the substrate. The semiconductor device module includes an interposer substrate, one or more semiconductor device chips, a covering resin, and a metal film. The one or more semiconductor device chips are on a first surface of the interposer substrate. The covering resin is in contact with the first surface of the interposer substrate and the one or more semiconductor device chips and encloses the one or more semiconductor device chips. The metal film is in contact with the covering resin and covers the covering resin. The heat conductor is in thermal contact with the substrate and the metal film, and has a higher thermal conductivity than the covering resin.
    Type: Grant
    Filed: February 27, 2019
    Date of Patent: May 11, 2021
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventor: Akiko Fujimaki
  • SEMICONDUCTOR DEVICE WITH IMPROVED HEAT DISSIPATION
    Publication number: 20200091129
    Abstract: A semiconductor device includes a substrate, a semiconductor device module, and a heat conductor. The semiconductor device module is on the substrate. The semiconductor device module includes an interposer substrate, one or more semiconductor device chips, a covering resin, and a metal film. The one or more semiconductor device chips are on a first surface of the interposer substrate. The covering resin is in contact with the first surface of the interposer substrate and the one or more semiconductor device chips and encloses the one or more semiconductor device chips. The metal film is in contact with the covering resin and covers the covering resin. The heat conductor is in thermal contact with the substrate and the metal film, and has a higher thermal conductivity than the covering resin.
    Type: Application
    Filed: February 27, 2019
    Publication date: March 19, 2020
    Inventor: Akiko FUJIMAKI