Abstract: The present invention pertains to a powder material used to manufacture a three-dimensional modeled object by selectively radiating laser light to a thin layer of the powder material including powder particles, forming a modeled object layer obtained by melt-binding of the powder particles, and layering the modeled object layer. The powder particles include a core resin and a shell resin for coating the core resin, the temperature at which the storage modulus G? of the material constituting the shell resin is 1×106.5 Pa being higher than the temperature at which the storage modulus G? of the material constituting the core resin is 1×106.5 Pa. The abovementioned powder material, makes it possible to manufacture a three-dimensional modeled object having higher definition.

Abstract: The present invention pertains to a powder material used to manufacture a three-dimensional modeled object by selectively radiating laser light to a thin layer of the powder material including powder particles, forming a modeled object layer obtained by melt-binding of the powder particles, and layering the modeled object layer. The powder particles include a core resin and a shell resin for coating the core resin, the temperature at which the storage modulus G? of the material constituting the shell resin is 1×106.5 Pa being higher than the temperature at which the storage modulus G? of the material constituting the core resin is 1×106.5 Pa. The abovementioned powder material, makes it possible to manufacture a three-dimensional modeled object having higher definition.

Abstract: The purpose of the present invention is to provide: an ink composition for three-dimensional modeling by an inkjet method, which has low viscosity and high ejectability, and which is capable of producing a three-dimensional model having higher tensile strength and higher impact resistance; an ink set which includes this ink composition; and a method for producing a three-dimensional model, which uses this ink composition. This ink composition for three-dimensional modeling contains a photopolymerizable monomer, a polymer and a photopolymerization initiator. The polymer has a weight average molecular weight of from 5,000 to 80,000 (inclusive); the photopolymerizable monomer contains a monomer that is capable of forming a ring structure in the main chain by polymerization; and the difference between the solubility parameter of the photopolymerizable monomer and the solubility parameter of the polymer is from 0.30 (cal/cm3)1/2 to 2.0 (cal/cm3)1/2 (inclusive).

Abstract: A three-dimensional molding apparatus repeatedly discharges a first molding material, which configures the surface layer of a three-dimensional molding and comprises a mechanoluminescent material that emits light upon being subjected to an external force, and a second molding material, which configures internal areas located on the inside of the surface layer of the three-dimensional molding, onto a molding stage to form a molding material layer, and molds the three-dimensional molding by layering multiple molding material layers.

Abstract: An optical member is located between a first optical waveguide and a second optical waveguide, and guides light from the first optical waveguide to the second optical waveguide. The optical member includes a substrate, a lens, and a coating layer. The lens is located on the substrate, and is formed of energy-curable resin having a linear expansion coefficient of 70 ppm or less. The coating layer is formed to cover the lens, and prevents the reflection of light.

Abstract: A multi-core optical fiber connecting member includes a first resin unit and a second resin unit. The first resin unit abuts on first cores on end surfaces of a first multi-core optical fiber and a second multi-core optical fiber. The first resin unit transmits light from the first core of the first multi-core optical fiber to guide the light to the first core of the second multi-core optical fiber. The second resin unit abuts on second cores on the end surfaces of the first multi-core optical fiber and the second multi-core optical fiber. The second resin unit transmits light from the second core of the first multi-core optical fiber to guide the light to the second core of the second multi-core optical fiber. The first and second resin units each have a thickness corresponding to the shape of each end surface of the first and second multi-core optical fibers.

Abstract: Disclosed is an optical element to be subjected to a reflow process at high temperatures, wherein cracks or wrinkles can be prevented from occurring in an antireflection film. A method for producing the optical element, and a method for manufacturing an electronic device using the optical element are also disclosed. Specifically disclosed is a method for producing an optical element comprising a base, wherein at least one optical surface is composed of a resin material, and a coating formed on the optical surface of the base and composed of an inorganic material, the optical element being mounted on a substrate together with an electronic component by a reflow process at a temperature Ta. The method is characterized in that the coating is formed at a film-forming temperature Tb of not less than (Ta?60° C.), and a material having a glass transition temperature of not less than 290° C. or a glass transition temperature of not less than (Tb?50° C.) is used as the resin material.

Abstract: A wafer lens member producing method includes post-curing lens portions made of a light-curing resin formed on at least one face of a substrate so as to promote curing of the light-curing resin. The post-curing includes first post-curing and second post-curing. The first post-curing performs heating at a first post-curing temperature, which is a glass transition temperature of the light-curing resin to the glass transition temperature+100° C., for 30 minutes to two hours. The second post-curing performs heating at a second post-curing temperature, which is lower than the glass transition temperature, and lower than the first post-curing temperature by 25° C. or more, for three hours to six hours.

Abstract: Provided is a method of manufacturing a wafer lens in which the surface configuration of the lens section can be transferred with high precision. The method possesses a step of preparing a molding die having plural molding surfaces corresponding to an optical surface configuration of the optical member; a filling step of filling the photo-curable resin in between the surface of the substrate and the molding surface of the molding die; a photo-curing step of exposing the photo-curable resin to light to accelerate curing; a heating step of conducting a heat treatment for the photo-curable resin having been cured in the photo-curing step; and a releasing step of releasing the molding die from the photo-curable resin after conducting the heating step, and further comprises a step of conducting a post-cure treatment for the optical member.

Abstract: Disclosed is an optical element to be subjected to a reflow process at high temperatures, wherein cracks or wrinkles can be prevented from occurring in an antireflection film. A method for producing the optical element, and a method for manufacturing an electronic device using the optical element are also disclosed. Specifically disclosed is a method for producing an optical element comprising a base, wherein at least one optical surface is composed of a resin material, and a coating formed on the optical surface of the base and composed of an inorganic material, the optical element being mounted on a substrate together with an electronic component by a reflow process at a temperature Ta. The method is characterized in that the coating is formed at a film-forming temperature Tb of not less than (Ta?60° C.), and a material having no glass transition temperature or a glass transition temperature of not less than (Tb?50° C.) is used as the resin material.

Abstract: Provided is a method for producing a wafer lens easily, while reducing production cost and exhibiting good mold releasability.

Abstract: A method for producing a hybrid optical element grouping, wherein a molding die excellent in durability and mold releasing property is used to produce high quality plastic lenses having no strain. This method for producing a hybrid optical element grouping is a method for producing a hybrid optical element grouping comprising a flat glass plate and, disposed thereon, plural optical members formed from an actinic radiation curable resin. The method is characterized by applying the actinic radiation curable resin to a plastic molding die having plural cavities having shapes corresponding to the optical members to fill the cavities with the resin, disposing the flat glass plate on the resin, and irradiating the resin with light from at least one of the molding die side and the flat-glass-plate side to cure the actinic radiation curable resin packed in the molding die.

Abstract: A method and system is presented for introducing functional polynucleotides into a target polynucleotide using transposons.

Abstract: Disclosed is a method for manufacturing an optical device, which enables to suppress deformation during annealing or deformation due to environmental changes over time after annealing. This method for manufacturing an optical device enables to suppress deterioration of a film when the film is formed on the surface of the device. Specifically disclosed is a method for manufacturing an optical device, which is characterized by comprising a step for molding an organic-inorganic composite material containing a thermosetting resin and inorganic particles, a step for annealing the molded article of the organic-inorganic composite material, and a step for forming a film over the molded article of the organic-inorganic composite material.

Abstract: This invention provides an image pick-up device with a lens body which can cope with a reflow process and can suppress deterioration in optical properties even upon exposure to the reflow process. The image pick-up device comprises a substrate (1) with an image sensor (11) with an image receiving part mounted thereon, lens (16) for imaging light reflected from a subject on the image receiving part, and a lens holder (15) for holding the lens (16). The lens (16) is formed of an organic-inorganic composite material comprising inorganic microparticles having a particle diameter of not more than 50 nm and a thermosetting resin having a siloxane bond having Si—O—Si as a back bone. A module (6) comprises the lens (6) and the lens holder (15) uses an image pick-up device fixed on the image sensor (11) in the substrate (1) by the reflow process.