Patents by Inventor Akiko Iwano

Akiko Iwano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6402013
    Abstract: A soldering flux suitable for soldering of small electronic components comprises 0.1-50 mass percent of an organic acid, 5-40 mass percent of a solvent, and 10-95 mass percent of a thermosetting resin (including a curing agent), which is preferably a bisphenol A epoxy resin and an acid anhydride or amine curing agent. This flux can be used to prepare a solder paste by mixing with solder powder. This soldering flux can secure an electronic component simultaneously by soldering and by the resin, simply by a soldering operation at a soldering temperature of at least 150° C., and cleaning after soldering is no longer necessary.
    Type: Grant
    Filed: December 1, 2000
    Date of Patent: June 11, 2002
    Assignees: Senju Metal Industry Co., LTD, TDK Corporation
    Inventors: Hisayuki Abe, Toshihiko Taguchi, Yuji Kawamata, Akiko Iwano
  • Publication number: 20010019075
    Abstract: A soldering flux suitable for soldering of small electronic components comprises 0.1-50 mass percent of an organic acid, 5-40 mass percent of a solvent, and 10-95 mass percent of a thermosetting resin (including a curing agent), which is preferably a bisphenol A epoxy resin and an acid anhydride or amine curing agent. This flux can be used to prepare a solder paste by mixing with solder powder. This soldering flux can secure an electronic component simultaneously by soldering and by the resin, simply by a soldering operation at a soldering temperature of at least 150° C., and cleaning after soldering is no longer necessary.
    Type: Application
    Filed: April 13, 2001
    Publication date: September 6, 2001
    Inventors: Hisayuki Abe, Toshihiko Taguchi, Yuji Kawamata, Akiko Iwano