Abstract: A circuit part that provides high heat dissipation is provided. A three-dimensional circuit part includes: a metal member; a first resin layer provided on top of the metal member; first circuit wiring including plating film provided on a wiring region of the surface of the first resin layer; and a first mounted component mounted on a mount region of the surface of the first resin layer to electrically connect to the first circuit wiring. In the surface of the first resin layer, the wiring region and the mount region overlap in an overlap region, and the surface roughness Rz of the overlap region is 10 ?m to 120 ?m; and the minimum distance between the first circuit wiring and the face of the first resin layer facing the metal member within the overlap region is 10 ?m to 100 ?m.

Abstract: A three-dimensional molded circuit component, includes: a base member which includes a metal part and a resin part; a circuit pattern which is formed on the resin part; and a mounted component which is mounted on the base member, and is electrically connected to the circuit pattern. The resin part includes a resin thin film as a portion thereof, which includes a thermoplastic resin, of which a thickness is in the range of 0.01 mm to 0.5 mm, and which is formed on the metal part. The mounted component is arranged on the metal part via the resin thin film.

Abstract: A circuit part is provided that provides both high heat dissipation and high adhesion of its circuit wiring. A circuit part includes: a metal member; an insulating resin layer located on the metal member; circuit wiring including a plating film located on the insulating resin layer; and a mounted component mounted on the circuit wiring and electrically connected to the circuit wiring, wherein a plurality of non-penetrating holes are provided in a wiring region, the non-penetrating holes being filled with the plating film, the wiring region being a portion of the resin-layer surface on which the circuit wiring is located, and the ratio of the depth d of the non-penetrating holes to the width D of the non-penetrating holes, d/D, is 0.5 to 5.

Abstract: A three-dimensional molded circuit component, includes: a base member which includes a metal part and a resin part; a circuit pattern which is formed on the resin part; and a mounted component which is mounted on the base member, and is electrically connected to the circuit pattern. The resin part includes a resin thin film as a portion thereof, which includes a thermoplastic resin, of which a thickness is in the range of 0.01 mm to 0.5 mm, and which is formed on the metal part. The mounted component is arranged on the metal part via the resin thin film.

Abstract: A method for producing a plated part, includes: forming, on a surface of a base member, a catalyst activity inhibiting layer containing a polymer which has at least one of an amide group and an amino group; irradiating with light or heating a part of the surface of the base member on which the catalyst activity inhibiting layer is formed; applying an electroless plating catalyst to the surface of the base member heated or irradiated with the light; and bringing an electroless plating solution into contact with the surface of the base member to which the electroless plating catalyst is applied, to form an electroless plating film at a light-irradiated portion or a heated portion of the surface.

Abstract: A three-dimensional molded circuit component, includes: a base member which includes a metal part and a resin part; a circuit pattern which is formed on the resin part; and a mounted component which is mounted on the base member, and is electrically connected to the circuit pattern. The resin part includes a resin thin film as a portion thereof, which includes a thermoplastic resin, of which a thickness is in the range of 0.01 mm to 0.5 mm, and which is formed on the metal part. The mounted component is arranged on the metal part via the resin thin film.

Abstract: There is provided a hyper-branched polymer represented by the following formula (1) and having a weight-average molecular weight in a range of 1,000 to 1,000,000. In the formula (1), A1 is a group containing an aromatic ring, A2 is a group containing an amide group, A3 is a group containing sulfur, R0 is hydrogen or a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms, ml is in a range of 0.5 to 11, and n1 is in a range of 5 to 100.

Abstract: A method for producing a plated part, includes: forming, on a surface of a base member, a catalyst activity inhibiting layer containing a polymer which has at least one of an amide group and an amino group; irradiating with light or heating a part of the surface of the base member on which the catalyst activity inhibiting layer is formed; applying an electroless plating catalyst to the surface of the base member heated or irradiated with the light; and bringing an electroless plating solution into contact with the surface of the base member to which the electroless plating catalyst is applied, to form an electroless plating film at a light-irradiated portion or a heated portion of the surface.

Abstract: A method for producing a plated part, includes: forming, on a surface of a base member, a catalyst activity inhibiting layer containing a polymer which has at least one of an amide group and an amino group; irradiating with light or heating a part of the surface of the base member on which the catalyst activity inhibiting layer is formed; applying an electroless plating catalyst to the surface of the base member heated or irradiated with the light; and bringing an electroless plating solution into contact with the surface of the base member to which the electroless plating catalyst is applied, to form an electroless plating film at a light-irradiated portion or a heated portion of the surface.

Abstract: There is provided a hyper-branched polymer represented by the following formula (1) and having a weight-average molecular weight in a range of 1,000 to 1,000,000. In the formula (1), A1 is a group containing an aromatic ring, A2 is a group containing an amide group, A3 is a group containing sulfur, R0 is hydrogen or a substituted or unsubstituted hydrocarbon group having 1 to 10 carbon atoms, ml is in a range of 0.5 to 11, and n1 is in a range of 5 to 100.

Abstract: A three-dimensional molded circuit component, includes: a base member which includes a metal part and a resin part; a circuit pattern which is formed on the resin part; and a mounted component which is mounted on the base member, and is electrically connected to the circuit pattern. The resin part includes a resin thin film as a portion thereof, which includes a thermoplastic resin, of which a thickness is in the range of 0.01 mm to 0.5 mm, and which is formed on the metal part. The mounted component is arranged on the metal part via the resin thin film.

Abstract: A method for producing a plated part, includes: forming, on a surface of a base member, a catalyst activity inhibiting layer containing a polymer which has at least one of an amide group and an amino group; irradiating with light or heating a part of the surface of the base member on which the catalyst activity inhibiting layer is formed; applying an electroless plating catalyst to the surface of the base member heated or irradiated with the light; and bringing an electroless plating solution into contact with the surface of the base member to which the electroless plating catalyst is applied, to form an electroless plating film at a light-irradiated portion or a heated portion of the surface.

Abstract: A method for producing a plated part, includes: applying a catalyst inactivator to a surface of a base member; irradiating with light or heating a part of the surface of the base member to which the catalyst inactivator is applied; applying an electroless plating catalyst to the surface of the base member; and bringing an electroless plating solution into contact with the surface of the base member applied with the electroless plating catalyst to form an electroless plating film at a light-irradiated portion or a heated portion of the surface.