Patents by Inventor Akiko Moriyama

Akiko Moriyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sheet-framed IC carrier, method for producing the same, and IC carrier case
    Patent number: 6776347
    Abstract: A sheet-framed IC carrier has a sheet frame having an aperature, and a backing film with a pressure-sensitive adhesive layer on one surface thereof which is adhered to the back surface of the sheet frame. An IC carrier having an IC module is secured in the aperature of the sheet frame with the adhesive layer on the backing film. When the IC carrier is removed from the sheet-framed IC carrier, no excessive load is exerted on the IC module and no projection remains on the peripheral edge of the carrier base.
    Type: Grant
    Filed: January 2, 2002
    Date of Patent: August 17, 2004
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Seiichi Nishikawa, Hiroshi Harima, Kazuyoshi Irisawa, Jun Takahashi, Akiko Moriyama, Mayumi Inada, Yoshikazu Fukushima, Masaki Wakamatsu
  • Sheet-framed IC carrier, method for producing the same, and IC carrier case
    Patent number: 6398114
    Abstract: A sheet-framed IC carrier has a sheet frame having an aperture, and a backing film with a pressure-sensitive adhesive layer on one surface thereof which is adhered to the back surface of the sheet frame. An IC carrier having an IC module is secured in the aperture of the sheet frame with the adhesive layer on the backing film. When the IC carrier is removed from the sheet-framed IC carrier, no excessive load is exerted on the IC module and no projection remains on the peripheral edge of the carrier base.
    Type: Grant
    Filed: October 30, 1997
    Date of Patent: June 4, 2002
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Seiichi Nishikawa, Hiroshi Harima, Kazuyoshi Irisawa, Jun Takahashi, Akiko Moriyama, Mayumi Inada, Yoshikazu Fukushima, Masaki Wakamatsu
  • Sheet-framed IC carrier, method for producing the same, and IC carrier case
    Publication number: 20020050527
    Abstract: A sheet-framed IC carrier has a sheet frame having an aperture, and a backing film with a pressure-sensitive adhesive layer on one surface thereof which is stuck on the back surface of the sheet frame. An IC carrier having an IC module is secured in the aperture of sheet frame with the adhesive layer on the backing film. When the IC carrier is removed from the sheet-framed IC carrier, no excessive load is exerted on the IC module and no projection remains on the peripheral edge of the carrier base.
    Type: Application
    Filed: January 2, 2002
    Publication date: May 2, 2002
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Seiichi Nishikawa, Hiroshi Harima, Kazuyoshi Irisawa, Jun Takahashi, Akiko Moriyama, Mayumi Inada, Yoshikazu Fukushima, Masaki Wakamatsu
  • Sheet-framed IC carrier, method for producing the same, and IC carrier case
    Patent number: 5757116
    Abstract: A sheet-framed IC carrier has a sheet frame having an aperture, and a backing film with a pressure-sensitive adhesive layer on one surface thereof which is adhered to the back surface of the sheet frame. An IC carrier having an IC module is secured in the aperture of the sheet frame with the adhesive layer on the backing film. When the IC carrier is removed from the sheet-framed IC carrier, no excessive load is exerted on the IC module and no projection remains on the peripheral edge of the carrier base.
    Type: Grant
    Filed: August 19, 1996
    Date of Patent: May 26, 1998
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Seiichi Nishikawa, Hiroshi Harima, Kazuyoshi Irisawa, Jun Takahashi, Akiko Moriyama, Mayumi Inada, Yoshikazu Fukushima, Masaki Wakamatsu
  • Sheet-framed IC carrier, method for producing the same, and IC carrier case
    Patent number: 5581065
    Abstract: A sheet-framed IC carrier has a sheet frame having an aperture, and a backing film with a pressure-sensitive adhesive layer on one surface thereof which is adhered to the back surface of the sheet frame. An IC carrier having an IC module is secured in the aperture of the sheet frame with the adhesive layer on the backing film. When the IC carrier is removed from the sheet-framed IC carrier, no excessive load is exerted on the IC module and no projection remains on the peripheral edge of the carrier base.
    Type: Grant
    Filed: July 28, 1994
    Date of Patent: December 3, 1996
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Seiichi Nishikawa, Hiroshi Harima, Kazuyoshi Irisawa, Jun Takahashi, Akiko Moriyama, Mayumi Inada, Yoshikazu Fukushima, Masaki Wakamatsu