Abstract: A conveying apparatus includes a rotator, a driver, a measuring device, and circuitry. The rotator is configured to convey a medium. The driver is configured to apply a driving force to the rotator to rotate the rotator. The measuring device is configured to measure the driving force applied to the rotator by the driver. The circuitry is configured to: determine, according to the driving force measured, whether to change at least one of frequency and items of information to be acquired for prediction of a defective conveyance of the medium caused by the rotator; and acquire information of at least one of the items according to a result of determination, at a frequency according to the result of determination.

Abstract: A conveying apparatus includes a rotator, a driver, a measuring device, and circuitry. The rotator is configured to convey a medium. The driver is configured to apply a driving force to the rotator to rotate the rotator. The measuring device is configured to measure the driving force applied to the rotator by the driver. The circuitry is configured to: determine, according to the driving force measured, whether to change at least one of frequency and items of information to be acquired for prediction of a defective conveyance of the medium caused by the rotator; and acquire information of at least one of the items according to a result of determination, at a frequency according to the result of determination.

Abstract: A management apparatus for managing one or more devices includes circuitry to: acquire information indicating a use history of a device for each predetermined period; calculate, based on the acquired information indicating the use history, a predicted value indicating operation timing at which an operation is performed on the device; and output, based on the predicted value, an output value for the predetermined period. When an output value that is output for an (N?1)-th time is greater than a threshold, the circuitry outputs, as an N-th-time output value, the predicted value that is calculated for an N-th time. When the output value that is output for the (N?1)-th time is less than or equal to the threshold, the circuitry outputs, as the N-th-time output value, a value that is smaller than or equal to the output value that is output for the (N?1)-th time.

Abstract: The invention relates to a coating composition comprising: (a) 10% to 99.9% by weight of resin based on the total weight of the coating composition; and (b) 0.1% to 20% by weight of a formaldehyde scavenger based on the total weight of the coating composition, wherein the formaldehyde scavenger has at least one active methylene hydrogen and is solid at room temperature. The invention relates to use of a coating composition for removing free formaldehyde from the environment, wherein the formaldehyde scavenger has at least one active methylene hydrogen and is solid at room temperature.

Abstract: The invention relates to a coating composition comprising: (a) 10% to 99.9% by weight of resin based on the total weight of the coating composition; and (b) 0.1% to 20% by weight of a formaldehyde scavenger based on the total weight of the coating composition, wherein the formaldehyde scavenger has at least one active methylene hydrogen and is solid at room temperature. The invention relates to use of a coating composition for removing free formaldehyde from the environment, wherein the formaldehyde scavenger has at least one active methylene hydrogen and is solid at room temperature.

Abstract: A process is disclosed for creating semiconductor devices such as RFID assemblies wherein an array of dies mounted to a substrate is spaced apart at a first pitch, and the substrate is removed after the positions of the dies in the array is fixed by a solidifiable substance. The solidifiable substance is then removed without changing the relative positions of the dies in the array. All or a selected portion of the array of dies is then electrically attached to a plurality of straps or interposers arranged in a corresponding array. The spacing, or pitch, between the dies in the die array may be changed before or after the substrate is removed to match the pitch of the straps or interposers in the corresponding array. An RFID device created using the process inventive is also disclosed.

Abstract: A process is disclosed for creating semiconductor devices such as RFID assemblies wherein an array of dies mounted to a substrate is spaced apart at a first pitch, and the substrate is removed after the positions of the dies in the array is fixed by a solidifiable substance. The solidifiable substance is then removed without changing the relative positions of the dies in the array. All or a selected portion of the array of dies is then electrically attached to a plurality of straps or interposers arranged in a corresponding array. The spacing, or pitch, between the dies in the die array may be changed before or after the substrate is removed to match the pitch of the straps or interposers in the corresponding array. An RFID device created using the process inventive is also disclosed.

Abstract: A process is disclosed for creating semiconductor devices such as RFID assemblies wherein an array of dies mounted to a substrate is spaced apart at a first pitch, and the substrate is removed after the positions of the dies in the array is fixed by a solidifiable substance. The solidifiable substance is then removed without changing the relative positions of the dies in the array. All or a selected portion of the array of dies is then electrically attached to a plurality of straps or interposers arranged in a corresponding array. The spacing, or pitch, between the dies in the die array may be changed before or after the substrate is removed to match the pitch of the straps or interposers in the corresponding array. An RFID device created using the process inventive is also disclosed.

Abstract: A process is disclosed for creating semiconductor devices such as RFID assemblies wherein an array of dies mounted to a substrate is spaced apart at a first pitch, and the substrate is removed after the positions of the dies in the array is fixed by a solidifiable substance. The solidifiable substance is then removed without changing the relative positions of the dies in the array. All or a selected portion of the array of dies is then electrically attached to a plurality of straps or interposers arranged in a corresponding array. The spacing, or pitch, between the dies in the die array may be changed before or after the substrate is removed to match the pitch of the straps or interposers in the corresponding array. An RFID device created using the process inventive is also disclosed.