Abstract: To improve efficiency when manufacturing a light emitting device formed using a mask to form regions corresponding to pixels on a substrate, provided is a method including, after forming a pattern on a substrate with a first light emitting material that emits light of a first spectrum, through a first opening and one or more second openings of a mask, moving the mask in a longitudinal direction of the first opening by a distance that is less than the width of the first opening in the longitudinal direction of the first opening and greater than or equal to the width of the one or more second openings in the longitudinal direction of the first opening, and then forming a pattern with a second light emitting material that emits light of a second spectrum, through the first opening and the one or more second openings of the mask.

Abstract: To improve efficiency when manufacturing a light emitting device formed using a mask to form regions corresponding to pixels on a substrate, provided is a method including, after forming a pattern on a substrate with a first light emitting material that emits light of a first spectrum, through a first opening and one or more second openings of a mask, moving the mask in a longitudinal direction of the first opening by a distance that is less than the width of the first opening in the longitudinal direction of the first opening and greater than or equal to the width of the one or more second openings in the longitudinal direction of the first opening, and then forming a pattern with a second light emitting material that emits light of a second spectrum, through the first opening and the one or more second openings of the mask.

Abstract: A plurality of solder bumps are arranged in a row at regular pitch in a lead wire soldering region of a solar battery. A soldering apparatus for soldering a lead wire to the lead wire soldering region via the solder bumps comprises a lead wire feeding section for feeding out the lead wire. An end of the lead wire in the lead wire feeding section is chucked and the lead wire is laid over all length of the row of solder bumps. The soldering apparatus further comprises a soldering unit for soldering the lead wire onto the solder bump. The soldering unit has a lead wire holding member for holding the lead wire on a solder bump and a soldering iron. The soldering apparatus repeats an operation for welding the lead wire to the solder bump by means of the soldering iron, while the lead wire is held by the lead wire holding member.

Abstract: A photovoltaic module comprises a substrate, a semiconductor layer arranged on one of the principal surfaces of the substrate, divided into a plurality of sections and sealed by a encapsulation material, in that the encapsulation material is arranged on the principal surface of the substrate without its end face projecting outwardly beyond the end face of the substrate.

Abstract: A semiconductor light beam position sensor element comprises a semiconductor layer of successively formed p-, i- and n-type semiconductor layers and an electrically conductive layer on either side of the semiconductive layer. At least one of the conductive layers is made of a transparent material, and at least the other conductive layer and the semiconductor layer are provided with a plurality of common apertures extending in the thickness direction. At least one of the conductor layers is provided with one or two pairs of electrodes of opposite polarity and positioned in its marginal regions. The sensor element is light transparent. A feedback circuit is provided to insure that the incident light is constant.

Abstract: In an X ray detecting device comprising XL converting unit for converting the X rays into visible light corresponding to the intensity of the X rays and a LE converting unit for converting the visible light into an electrical signal corresponding to the intensity of the visible light, the base layer of the LE converting unit is formed of a material such that the base layer does not substantially absorb the X rays so that the image of the LE converting unit does not appear on the picture of the object.

Abstract: A transparent semiconductor light beam position sensor element comprises a semiconductor layer consisting of p-, i- and n-type semiconductor layers successively bonded in junction and an electrically conductive layer disposed on either side of the semiconductive layer, at least one of the conductive layers being material transparent material, at least the other conductive layer and the semiconductor layer being provided with a multiplicity of common apertures running in the thickness direction and at least one conductive layer being provided with one pair or two pairs of electrodes of opposite polarities as disposed in its marginal regions.