Patents by Inventor Akina ICHIOKA

Akina ICHIOKA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230346275
    Abstract: A sensibility measuring method includes measuring, based on a measurement item which corresponds to each of evaluation objects (50), a set of biological information (20), the set each derived from a subject (60) while using each of the evaluation objects (50) on a trial basis, and acquiring an evaluation result (80) for each of the evaluation objects (50), the evaluation result (80) including identification information that enables identification of a rank order in which the evaluation objects (50) are compared with each other, based on the measured set of biological information (20).
    Type: Application
    Filed: May 28, 2021
    Publication date: November 2, 2023
    Inventors: Toru MIZUMOTO, Akina ICHIOKA, Masafumi FURUTA, Koichi MURATA
  • Publication number: 20170067142
    Abstract: Provided is a structure configured such that even when resin, such as methacryl resin, exhibiting a low adhesion to a metal thin film is used, the resin and the metal thin film are firmly stacked in close contact with each other, and a film formation method capable of manufacturing a structure in which a metal thin film is, with a high adhesion, formed on a resin work exhibiting a low adhesion to the metal thin film, wherein the structure is configured such that an Al thin film 102 is, by sputtering, formed on a work W made of methacryl resin to form a stack of the work W and the Al thin film 102, and has a mixed region 101 of Al, Si, O, and C between the work W and the Al thin film 102. In the mixed region 101, Al is covalently bound to any one of Si, O, and C, or Al, Si, O, and C form a diffusion mixed layer.
    Type: Application
    Filed: January 20, 2015
    Publication date: March 9, 2017
    Inventors: Akina ICHIOKA, Toshinori YOSHIMUTA, Satoshi TOKUDA, Daisuke IMAI, Satoru OZAKI, Yuu TOKUTAKE
  • Publication number: 20170058394
    Abstract: A film formation device for forming a metal thin film on a polycarbonate work molded by a resin molding machine, comprises: a film former including a chamber configured to house the work, and a sputtering electrode including a target material and disposed in the chamber; and a carrier configured to carry the work molded by the resin molding machine from the resin molding machine to the chamber within such a short time period that no moisture adheres to a surface of the work.
    Type: Application
    Filed: July 14, 2016
    Publication date: March 2, 2017
    Inventors: Akina ICHIOKA, Toshinori YOSHIMUTA, Satoshi TOKUDA, Naoki YOSHIOKA, Satoko UENO, Satoru OZAKI