Abstract: In a PDP, an end of a first partition (124) is provided with a partition end 126 whose height dimension and width dimension are smaller than those of the first partition (124). With this arrangement, when a nozzle is moved from a portion between the partition ends (126) on a first side to a portion between the partition ends (126) on a second side in a phosphor layer forming step for forming a phosphor layer, a phosphor paste can be uniformly applied to recessed portions (123A), thereby easily providing the PDP that includes the phosphor layer with which good images can be realized.

Abstract: A PDP includes a guide partition (127) that extends substantially along a center line F between a pair of first partitions (125) at a position spaced apart from an end of the nearest first partition (125) by a distance H. In a phosphor forming step, a phosphor paste is initially applied on the guide partition (127) by a nozzle (200), which has been located above the guide partition (127). Then, the nozzle (200) is moved to provide a phosphor layer whose end is formed on the guide partition (127).

Abstract: A manufacturing method of a PDP includes: a partition forming step to form a first partition (124) and a second partition (125) substantially perpendicular to the first partition (124) on an address-electrode dielectric layer (122) of a rear substrate (120); a base layer forming step to form a base layer after the partition forming step by moving a base-forming-agent applying nozzle (200) along a second groove formed between the second partitions (125) and applying a base forming agent (201) thereto; and a phosphor layer forming step to form a phosphor layer after the base layer forming step by moving a phosphor applying nozzle along a first groove formed between the first partitions (124) and applying a phosphor paste thereto.

Abstract: A PDP includes a guide partition (127) that extends substantially along a center line F between a pair of first partitions (125) at a position spaced apart from an end of the nearest first partition (125) by a distance H. In a phosphor forming step, a phosphor paste is initially applied on the guide partition (127) by a nozzle (200), which has been located above the guide partition (127). Then, the nozzle (200) is moved to provide a phosphor layer whose end is formed on the guide partition (127).

Abstract: A manufacturing method of a PDP includes: a partition forming step to form a first partition (124) and a second partition (125) substantially perpendicular to the first partition (124) on an address-electrode dielectric layer (122) of a rear substrate (120); a base layer forming step to form a base layer after the partition forming step by moving a base-forming-agent applying nozzle (200) along a second groove formed between the second partitions (125) and applying a base forming agent (201) thereto; and a phosphor layer forming step to form a phosphor layer after the base layer forming step by moving a phosphor applying nozzle along a first groove formed between the first partitions (124) and applying a phosphor paste thereto.

Abstract: In a PDP, an end of a first partition (124) is provided with a partition end 126 whose height dimension and width dimension are smaller than those of the first partition (124). With this arrangement, when a nozzle is moved from a portion between the partition ends (126) on a first side to a portion between the partition ends (126) on a second side in a phosphor layer forming step for forming a phosphor layer, a phosphor paste can be uniformly applied to recessed portions (123A), thereby easily providing the PDP that includes the phosphor layer with which good images can be realized.

Abstract: A work table is provided for mounting a PCB substrate. A cutting tool for cutting the PCB substrates a pin dispenser for inserting a pin into a hole formed in the PCB substrate, and a solder applicator for applying solder on the PCB substrate are attached on a work head. X, Y and Z axes driving means are provided for moving the work head in a horizontal direction and in a vertical direction. A control unit responds to data signals for operating the cutting tool, pin dispenser and solder applicator for controlling operations of the X, Y and Z axes driving means, cutting tool, pin dispenser, and solder applicator. Thus, the PCB substrate is made into a printed circuit board.