Abstract: An information processing device includes a processor configured to acquire a document image illustrating a document, acquire a related character string associated with a target character string included in the document image, and extract target information corresponding to the target character string from a region set with reference to a position of the related character string in the document image.

Abstract: In a lead frame, a die-pad portion is defined for a semiconductor element to be mounted, a plurality of wire bonding portions are arranged along a periphery of the die-pad portion within a region to be finally divided as a semiconductor device for the die-pad portion, and a plurality of land-like external terminal portions are arranged in a region outside the wire bonding portions. Furthermore, a plurality of linear connection lead portions are formed to integrally join the wire bonding portions to the respective corresponding external terminal portions. The die-pad portion, the wire bonding portions, the external terminal portions and the connection lead portions are supported by an adhesive tape.

Abstract: A lead frame includes a frame portion and a plurality of land-like conductor portions arranged in a lattice pattern in a region within the frame portion. The frame portion and the land-like conductor portions are supported by an adhesive tape. Each of the land-like conductor portions is formed of part of each of a plurality of leads at a portion where each lead intersects each other, the plurality of leads being discontinuously arranged so as to be orthogonal to each other. Each portion where the leads intersect each other is formed to be larger than a width of the corresponding lead.

Abstract: In a lead frame which comprises lead portions extended from a frame portion toward an inside like a teeth of a comb and each having a top end portion, a center portion, and a base portion connected to the frame portion, the top end portion and the center portion are connected via a first constriction portion, and the center portion and the base portion are connected via a second constriction portion, and thickness of both side surface portions of the center portion and the top end portion of each lead portion are set thinner than thickness of remaining portions of each lead portion.

Abstract: In a lead frame which comprises lead portions extended from a frame portion toward an inside like a teeth of a comb and each having a top end portion, a center portion, and a base portion connected to the frame portion, the top end portion and the center portion are connected via a first constriction portion, and the center portion and the base portion are connected via a second constriction portion, and thickness of both side surface portions of the center portion and the top end portion of each lead portion are set thinner than thickness of remaining portions of each lead portion.

Abstract: A leadframe includes a die-pad portion disposed in a center of an opening defined by a frame portion, and a lead portion disposed around the die-pad portion. The frame portion, the die-pad portion and the lead portion are supported by an adhesive tape, and the lead portion is constituted to have a form in which a plurality of external connection terminals severally consisting of part of leads are arranged in the shape of a grid in a region between the die-pad portion and the frame portion.