Patents by Inventor Akinobu Hojo

Akinobu Hojo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead frame and method of manufacturing the same, and semiconductor device
    Patent number: 7838972
    Abstract: A lead frame includes a lead frame main body having a plurality of die pad portions each having a chip mounting surface on which a semiconductor chip is mounted, a plurality of lead portions provided to surround the plurality of die pad portions respectively, and a frame portion for supporting the plurality of die pad portions and the plurality of lead portions, an adhesive film pasted on a lower surface of the lead frame main body by pressing, and a first metal film provided on surfaces of the plurality of lead portions and connected electrically to the semiconductor chip respectively, wherein second metal films whose thickness is substantially equal to a thickness of the first metal film are provided to the chip mounting surface of the plurality of die pad portions respectively.
    Type: Grant
    Filed: December 26, 2007
    Date of Patent: November 23, 2010
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventor: Akinobu Hojo
  • LEAD FRAME AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE
    Publication number: 20080157309
    Abstract: A lead frame includes a lead frame main body having a plurality of die pad portions each having a chip mounting surface on which a semiconductor chip is mounted, a plurality of lead portions provided to surround the plurality of die pad portions respectively, and a frame portion for supporting the plurality of die pad portions and the plurality of lead portions, an adhesive film pasted on a lower surface of the lead frame main body by pressing, and a first metal film provided on surfaces of the plurality of lead portions and connected electrically to the semiconductor chip respectively, wherein second metal films whose thickness is substantially equal to a thickness of the first metal film are provided to the chip mounting surface of the plurality of die pad portions respectively.
    Type: Application
    Filed: December 26, 2007
    Publication date: July 3, 2008
    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Akinobu Hojo