Patents by Inventor Akinobu Katayama

Akinobu Katayama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Disk bonding apparatus and disk bonding method
    Patent number: 6793748
    Abstract: It is an object to provide an optical recording medium (disk) bonding apparatus which eliminates the warpage of a disk during bonding and has high precision in the bonding. There are provided means for bonding two substrates and then irradiating radioactive rays from both sides of the substrates when carrying out radiation curing, and a mechanism for shifting the irradiation starts of both radioactive rays to control an amount of warpage of each substrate after the curing.
    Type: Grant
    Filed: May 21, 2002
    Date of Patent: September 21, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Toshiyuki Fujioka, Akinobu Katayama, Toshikazu Kozono, Kiyoshi Mayahara
  • Disk bonding apparatus and disk bonding method
    Publication number: 20030006004
    Abstract: It is an object to provide an optical recording medium (disk) bonding apparatus which eliminates the warpage of a disk during bonding and has high precision in the bonding. There are provided means for bonding two substrates and then irradiating radioactive rays from both sides of the substrates when carrying out radiation curing, and a mechanism for shifting the irradiation starts of both radioactive rays to control an amount of warpage of each substrate after the curing.
    Type: Application
    Filed: May 21, 2002
    Publication date: January 9, 2003
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Toshiyuki Fujioka, Akinobu Katayama, Toshikazu Kozono, Kiyoshi Mayahara
  • Molding apparatus and molding method for light-permeable articles
    Patent number: 5961898
    Abstract: A molding apparatus for light-permeable articles which includes a nozzle that is movable up and down. A suction path and a suction device connected to the suction path are provided so as to suck a gas at a contact face of a sprue bush and its vicinity during the up/down movement of the nozzle. Accordingly, foreign substances, invading the mold can be sucked up before the apparatus performs a molding operation. Therefore, foreign substances are prevented from being mixed into the molded product. The molded product is accordingly improved in quality and yield.
    Type: Grant
    Filed: October 2, 1997
    Date of Patent: October 5, 1999
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takaaki Higashida, Shinji Kadoriku, Tokiharu Nakagawa, Akinobu Katayama, Hiroshi Yutani, Yoshio Maruyama