Abstract: A method of depositing a copper interconnection layer on a substrate for use in a flat panel display interconnection system, comprising the steps of: a) coating said substrate with a photoresist layer; b) patterning said photoresist layer to obtain a patterned photoresist substrate comprising at least one trench patterned into said photoresist layer; c) providing a first catalyzation layer onto the patterned photoresist substrate; d) providing an electroless plated layer of an insulation layer deposited onto said first catalyzation layer; e) removing the successively superimposed photoresist layer, catalyzation layer and insulation layer except in the at least one trench, to obtain a pattern of the first catalyzation layer with an insulation layer deposited thereon.

Abstract: A source liquid supply apparatus and method that avoids leaving source liquid-and/or cleaning fluid-derived residues in the vicinity of the connection region between the source liquid feed conduit and the source tank. A flow-switching mechanism is attached to the source tank of a source liquid supply apparatus. This flow-switching mechanism has a first port connected to the discharge port conduit of the source tank, a second port connected to a feed conduit, and a third port connected to an exhaust conduit. The first port can be closed by a valve member on a diaphragm disposed within a common compartment while communication is maintained between the second and third ports. A cleaning fluid source and a purge gas source are connected to the feed conduit. Purge gas and cleaning fluid fed into the feed conduit are discharged from the second and third ports and through the exhaust conduit.

Abstract: Electroless NiWP layers are used for TFT Cu gate process. The NiWP deposition process comprises the following steps. (a) Cleaning of the base surface using for example UV light, ozone solution and/or alkaline mixture solution, (b) micro-etching of the base surface using, e.g. diluted acid, (c) catalyzation of the base surface using, e.g. SnCl<SUB>2</SUB> and PdCl<SUB>2</SUB> solutions, (d) conditioning of the base surface using reducing agent solution, and (e) NiWP deposition. It has been discovered that NiWP layers deposited under certain conditions could provide good adhesion to the glass substrate and to the Cu layer with a good Cu barrier capability. A NiWP layer in useful for adhesion, capping and/or barrier layers for TFT Cu gate process (e.g. for flat screen display panels).

Abstract: Methods and apparatus for producing a copper layer on substrate in a flat panel display manufacturing process, where the copper is electrodelessly deposited on a substrate to form a copper interconnection layer. A copper solution containing: CuSO4 5H2O as a copper source, potassium sodium tartrate or trisodium citrate as a complexing agent, glyoxylate, glyoxilic acid or sodium phosphate as a reducing agent, a sulfur organic compound as a stabilizing agent, and a pH adjusting agent, is used to form the copper interconnection layer on the substrate.

Abstract: (Problem) To provide a source liquid supply apparatus that avoids leaving source liquid- and/or cleaning fluid-derived residues in the vicinity of the joint or connection region between the source liquid feed conduit and the source tank. (Solution) A flow-switching mechanism Vc is attached to the source tank 22 of a source liquid supply apparatus 20. This flow-switching mechanism Vc has a first port 33 that is connected to the discharge port conduit 24 of the source tank 22, a second port 34 that is connected to a feed conduit 16, and a third port 35 that is connected to an exhaust conduit 25. The first port 33 can be closed by a valve member 43 on a diaphragm 42 disposed within a common compartment 38 while communication is maintained between the second and third ports 34 and 35. A cleaning fluid source 55 and a purge gas source 57 are connected to the feed conduit 16.

Abstract: Provided is a copper source liquid useful in MOCVD processes for forming copper thin films on semiconductor wafers. The source liquid comprises water and a source component wherein the source component contains at least 90 weight % Cu(hfac)TMVS and the copper source liquid preferably contains no more than 10 weight % water. The dissolved oxygen concentration in the water is established at no more than 0.5 ppm relative to the water. Decomposition of the Cu(hfac)TMVS is controlled in the present invention by lowering the dissolved oxygen concentration in the water. The resulting copper source liquid allows for improved reproducibility of CVD film quality by raising the capacity to control the amount of water addition to the copper source liquid used in MOCVD processes.

Abstract: Provided is a copper source liquid useful in MOCVD processes for forming copper thin films on semiconductor wafers. The source liquid comprises water and a source component wherein the source component contains at least 90 weight % Cu(hfac)TMVS and the copper source liquid preferably contains no more than 10 weight % water. The dissolved oxygen concentration in the water is established at no more than 0.5 ppm relative to the water. Decomposition of the Cu(hfac)TMVS is controlled in the present invention by lowering the dissolved oxygen concentration in the water. The resulting copper source liquid allows for improved reproducibility of CVD film quality by raising the capacity to control the amount of water addition to the copper source liquid used in MOCVD processes.

Abstract: Provided are an apparatus and method for the distribution of treatment liquids. The apparatus and method enable the continuous monitoring of the level of a treatment liquid by an inexpensive mechanism that has little capacity to contaminate the treatment liquid. The apparatus for the distribution of treatment liquids contains a gastight distribution tank that is connected through a discharge line to designated facilities, and also contains a gastight gas container that is connected through a pressurization line to the distribution tank. A pressure regulator is provided in the pressurization line and the pressurization gas is thereby supplied from the gas container to the distribution tank at a constant and specified supply pressure. This supply of pressurization gas induces the pressure-transport of the treatment liquid from the distribution tank through the discharge line.