Abstract: A wiring substrate is provided with a substrate, a conductive circuit formed on a surface of the substrate, and an insulating layer which covers the conductive circuit. In a fitting portion of the wiring substrate, the insulating layer is formed with an opening portion through which a portion of the conductive circuit is exposed or displayed as an exposed surface. On the exposed surface of the conductive circuit, an electrode layer is formed which is made of a conductive member. A bottom surface of the electrode layer is connected to the conductive circuit. An upper surface of the electrode layer is extended in the widthwise direction W of wirings of the conductive circuit so as to cover even a part of the insulating layer.

Abstract: A manufacturing method for an electronic device, the method including forming a transparent conductive film, including conductive polymers, on a base material, and irradiating ultraviolet light onto a part of the transparent conductive film such that first regions of the transparent conductive film are not irradiated and second regions, adjacent to the first regions, are irradiated, thus forming irradiated portions and non-irradiated portions. The irradiated portions having an electrical resistance value higher than that of the non-irradiated portions. The ultraviolet light includes a wavelength that exhibits an absorbance in an absorption spectrum of the conductive polymers, of the transparent conductive film, two or more times higher than that of a background.

Abstract: A manufacturing method for an electronic device, the method including forming a transparent conductive film, including conductive polymers, on a base material, and irradiating ultraviolet light onto a part of the transparent conductive film such that first regions of the transparent conductive film are not irradiated and second regions, adjacent to the first regions, are irradiated, thus forming irradiated portions and non-irradiated portions. The irradiated portions having an electrical resistance value higher than that of the non-irradiated portions. The ultraviolet light includes a wavelength that exhibits an absorbance in an absorption spectrum of the conductive polymers, of the transparent conductive film, two or more times higher than that of a background.

Abstract: A conductive composition capable of producing a conductive coating with excellent flexibility and a high conductivity comparable to that of metallic silver, without using high temperatures as film forming conditions. The conductive composition includes a particulate silver compound and a binder, and optionally a reducing agent and a binder. Silver oxide, silver carbonate and silver acetate and the like are used as the particulate silver compound. Ethylene glycol, diethylene glycol, and ethylene glycol diacetate and the like are used as the reducing agent, and a fine powder of a thermosetting resin such as a polyvalent phenol compound, phenol resin, alkyd resin or polyester resin, or a thermoplastic resin such as a styrene resin or polyethylene terephthalate, with an average particle diameter from 20 nm to 5 ?m is used as the binder. Furthermore, the average particle diameter of the particulate silver compound may be from 0.01 to 10 ?m.

Abstract: A manufacturing method for an electronic device, the method including forming a transparent conductive film, including conductive polymers, on a base material, and irradiating ultraviolet light onto a part of the transparent conductive film such that first regions of the transparent conductive film are not irradiated and second regions, adjacent to the first regions, are irradiated, thus forming irradiated portions and non-irradiated portions. The irradiated portions having an electrical resistance value higher than that of the non-irradiated portions. The ultraviolet light includes a wavelength that exhibits an absorbance in an absorption spectrum of the conductive polymers, of the transparent conductive film, two or more times higher than that of a background.

Abstract: A wiring substrate is provided with a substrate, a conductive circuit formed on a surface of the substrate, and an insulating layer which covers the conductive circuit. In a fitting portion of the wiring substrate, the insulating layer is formed with an opening portion through which a portion of the conductive circuit is exposed or displayed as an exposed surface. On the exposed surface of the conductive circuit, an electrode layer is formed which is made of a conductive member. A bottom surface of the electrode layer is connected to the conductive circuit. An upper surface of the electrode layer is extended in the widthwise direction W of wirings of the conductive circuit so as to cover even a part of the insulating layer.

Abstract: A manufacturing method for an electronic device, the method including forming a transparent conductive film, including conductive polymers, on a base material, and irradiating ultraviolet light onto a part of the transparent conductive film such that first regions of the transparent conductive film are not irradiated and second regions, adjacent to the first regions, are irradiated, thus forming irradiated portions and non-irradiated portions. The irradiated portions having an electrical resistance value higher than that of the non-irradiated portions. The ultraviolet light includes a wavelength that exhibits an absorbance in an absorption spectrum of the conductive polymers, of the transparent conductive film, two or more times higher than that of a background.

Abstract: A conductive composition capable of producing a conductive paint with excellent flexibility and a high conductivity comparable to that of metallic silver, without using high temperatures as film forming conditions. The conductive composition includes a particulate silver compound and a binder, and optionally a reducing agent and a binder. Silver oxide, silver carbonate and silver acetate and the like are used as the particulate silver compound. Ethylene glycol, diethylene glycol, and ethylene glycol diacetate and the like are used as the reducing agent, and a fine powder of a thermosetting resin such as a polyvalent phenol compound, phenol resin, alkyd resin or polyester resin, or a thermoplastic resin such as a styrene resin or polyethylene terephthalate, with an average particle diameter from 20 nm to 5 ?m is used as the binder. Furthermore, the average particle diameter of the particulate silver compound is preferably from 0.01 to 10 ?m.

Abstract: An electrically conductive composition can be obtained that provides an electrically conductive coating having low volume resistivity and high electrical conductivity comparable to that of metallic silver independent of high-temperature film deposition conditions, while also enabling the line width of an electrical circuit to be sufficiently narrow without having to increase thickness in the case of forming an electrical circuit of a flexible circuit board and so forth.

Abstract: An apparatus for continuously sterilizes and fills food and medicines containing solids. In this apparatus, a filler nozzle is disposed downstream of a back-pressure tank, and a control valve is interposed between the back-pressure tank and the filler nozzle for controlling the flow rate of the products which are delivered from the sterilizer to the back-pressure tank. The control valve avoids a remarkable pressure loss which might otherwise be invited in the series passages of the apparatus. The outflow of air from the back pressure tank to the filler nozzle is minimized so that the back pressure can be applied to the sterilizer as stably as possible. At the same time, the sterilized products are continuously fed to the filler nozzle so that they can be packed simultaneously with their upstream sterilization.

Abstract: A sterilization apparatus suitable for sterilizing food and medicines containing solid particles, which comprises a forcing device, a sterilizer, a backpressure tank and a backpressure device. The sterilization apparatus is sterilized beforehand under application of a backpressure by employing the forcing device and the backpressure device. The products are sterilized in the sterilizer under pressure by the forcing device and the backpressure tank, and then the sterilized products are collected in the backpressure tank.