Abstract: [Object] To provide a resin composition with excellent mold releasability and blocking resistance. [Solution] A resin composition containing a 4-methyl-1-pentene polymer includes 0.01 to 10 parts by mass of a 4-methyl-1-pentene polymer (B) per 100 parts by mass of at least one resin (A) selected from the group consisting of thermoplastic resins and thermosetting resins, wherein the 4-methyl-1-pentene polymer (B) has (B1) an intrinsic viscosity [?] of 0.01 or more but less than 0.50 dl/g measured at 135° C. in a decalin solvent.

Abstract: A composition for a protection layer of a thermal recording material includes emulsion (A) and non-crosslinkable urea compound (B), and emulsion (A) has a pH of 6 or more, and contains copolymer resin (a) produced by copolymerizing reactive monomer component (a?) containing at least a vinyl monomer component having a carboxyl group and a vinyl monomer component that is copolymerizable with the vinyl monomer component having a carboxyl group.

Abstract: The aqueous paste for an electrochemical cell of the present invention comprises an aqueous dispersion for an electrochemical cell that comprises an olefin copolymer (a); an active material; and a conductive assistant, wherein the olefin copolymer (a) has a weight average molecular weight of not less than 50,000 and is at least one kind selected from a random propylene copolymer (a-1) containing 50% by weight to less than 85% by weight of a structural unit derived from propylene; an acid-modified random propylene copolymer (a-2) obtained by modifying the copolymer (a-1) with an acid; and an ethylene-(meth)acrylic acid copolymer (a-3) containing 5% by weight to less than 25% by weight of a structural unit derived from (meth)acrylic acid.

Abstract: A composition for a protection layer of a thermal recording material includes emulsion (A) and non-crosslinkable urea compound (B), and emulsion (A) has a pH of 6 or more, and contains copolymer resin (a) produced by copolymerizing reactive monomer component (a?) containing at least a vinyl monomer component having a carboxyl group and a vinyl monomer component that is copolymerizable with the vinyl monomer component having a carboxyl group.

Abstract: [Object] To provide a resin composition with excellent mold releasability and blocking resistance. [Solution] A resin composition containing a 4-methyl-1-pentene polymer includes 0.01 to 10 parts by mass of a 4-methyl-1-pentene polymer (B) per 100 parts by mass of at least one resin (A) selected from the group consisting of thermoplastic resins and thermosetting resins, wherein the 4-methyl-1-pentene polymer (B) has (B1) an intrinsic viscosity [?] of 0.01 or more but less than 0.50 dl/g measured at 135° C. in a decalin solvent.

Abstract: [Object] To provide a resin composition with excellent mold releasability and blocking resistance. [Solution] A resin composition containing a 4-methyl-1-pentene polymer includes 0.01 to 10 parts by mass of a 4-methyl-1-pentene polymer (B) per 100 parts by mass of at least one resin (A) selected from the group consisting of thermoplastic resins and thermosetting resins, wherein the 4-methyl-1-pentene polymer (B) has (B1) an intrinsic viscosity [?] of 0.01 or more but less than 0.50 dl/g measured at 135° C. in a decalin solvent.

Abstract: Disclosed is a polishing slurry which enables to suppress damages to an under layer while securing an adequate polishing rate. The polishing slurry contains a resin (A) having an amide group and an organic resin (B).

Abstract: The present invention provides a material that is less likely to cause flex cracking, has high scratch resistance, and is suitable for a protective layer for a thermosensitive material. A thermosensitive recording material according to the present invention includes a base, a thermosensitive recording layer formed on the base, and a protective layer formed on the thermosensitive recording layer, wherein the protective layer is formed from a mixture that contains an emulsion (a) containing particles formed of a hydrophobic polymer (1) and a hydrophilic polymer (2); and a non-crosslinking urea compound (b). Preferably, the hydrophobic polymer (1) contains an acrylonitrile-derived constitutional unit. Preferably, the non-crosslinking urea compound (b) is urea or a urea derivative.

Abstract: Resin compositions of the invention contain an olefin polymer wax having higher heat resistance than achieved heretofore, high compatibility with resins and excellent mold-releasing properties. A resin composition (X) of the invention is obtained by blending a resin (A) having a melting point Tm of not less than 200° C. and an olefin polymer wax component (B), the olefin polymer wax component (B) including a cyclic olefin polymer wax (B-1) having structural units (a) and (b) described below, the cyclic olefin polymer wax (B-1) containing the structural units (b) at 0.05 to 50 mol % based on all the structural units in the polymer; (a) units derived from ethylene (b) units derived from a cyclic olefin.

Abstract: A heat-sensitive recording material includes a heat-sensitive recording layer on a support which layer produces a color upon heating, and a protective layer on the heat-sensitive recording layer. The protective layer is obtained from a composition (A) based on an emulsion of a copolymer resin (a). The copolymer resin (a) includes a vinyl monomer component having a carboxyl group, and a vinyl monomer component copolymerizable with the vinyl monomer component. The copolymer resin (a) contains 1 to 10 parts by weight of the vinyl monomer component having a carboxyl group. The copolymer resin has a SP value (solubility parameter) of not less than 9.5 (cal/cm3)1/2 and a glass transition temperature (Tg) of 20 to 130° C. The emulsion of the copolymer resin (a) has a minimum film-forming temperature (MFT) of more than 5° C.

Abstract: The aqueous paste for an electrochemical cell of the present invention comprises an aqueous dispersion for an electrochemical cell that comprises an olefin copolymer (a); an active material; and a conductive assistant, wherein the olefin copolymer (a) has a weight average molecular weight of not less than 50,000 and is at least one kind selected from a random propylene copolymer (a-1) containing 50% by weight to less than 85% by weight of a structural unit derived from propylene; an acid-modified random propylene copolymer (a-2) obtained by modifying the copolymer (a-1) with an acid; and an ethylene-(meth) acrylic acid copolymer (a-3) containing 5% by weight to less than 25% by weight of a structural unit derived from (meth) acrylic acid.

Abstract: Disclosed is a polishing composition containing not less than 1 wt % of a water-soluble resin, which is obtained by polymerizing a vinyl monomer containing an amino group and/or an amide group, based on the total weight of the polishing composition.

Abstract: [Object] To provide a resin composition with excellent mold releasability and blocking resistance. [Solution] A resin composition containing a 4-methyl-1-pentene polymer includes 0.01 to 10 parts by mass of a 4-methyl-1-pentene polymer (B) per 100 parts by mass of at least one resin (A) selected from the group consisting of thermoplastic resins and thermosetting resins, wherein the 4-methyl-1-pentene polymer (B) has (B1) an intrinsic viscosity [?] of 0.01 or more but less than 0.50 dl/g measured at 135° C. in a decalin solvent.

Abstract: The present invention provides a material that is less likely to cause flex cracking, has high scratch resistance, and is suitable for a protective layer for a thermosensitive material. A thermosensitive recording material according to the present invention includes a base, a thermosensitive recording layer formed on the base, and a protective layer formed on the thermosensitive recording layer, wherein the protective layer is formed from a mixture that contains an emulsion (a) containing particles formed of a hydrophobic polymer (1) and a hydrophilic polymer (2); and a non-crosslinking urea compound (b). Preferably, the hydrophobic polymer (1) contains an acrylonitrile-derived constitutional unit. Preferably, the non-crosslinking urea compound (b) is urea or a urea derivative.

Abstract: Disclosed is a polishing composition containing not less than 1 wt % of a water-soluble resin, which is obtained by polymerizing a vinyl monomer containing an amino group and/or an amide group, based on the total weight of the polishing composition.

Abstract: A heat-sensitive recording material includes a heat-sensitive recording layer on a support which layer produces a color upon heating, and a protective layer on the heat-sensitive recording layer. The protective layer is obtained from a composition (A) based on an emulsion of a copolymer resin (a). The copolymer resin (a) includes a vinyl monomer component having a carboxyl group, and a vinyl monomer component copolymerizable with the vinyl monomer component. The copolymer resin (a) contains 1 to 10 parts by weight of the vinyl monomer component having a carboxyl group. The copolymer resin has a SP value (solubility parameter) of not less than 9.5 (cal/cm3)1/2 and a glass transition temperature (Tg) of 20 to 130° C. The emulsion of the copolymer resin (a) has a minimum film-forming temperature (MFT) of more than 5° C.

Abstract: Disclosed is a polishing slurry which enables to suppress damages to an under layer while securing an adequate polishing rate. The polishing slurry contains a resin (A) having an amide group and an organic resin (B).

Abstract: The present invention provides a polishing slurry which remarkably inhibits the occurrence of scratch, dishing or erosion.

Abstract: A protective material for a heat sensitive paper, which is an emulsion including water, a water soluble polymer (A), and a hydrophobic polymer (B), at least one of (A) and (B) containing a structural unit derived from a monomer (C) having a sulfonic acid group or a salt thereof. The protective material can provide a higher level of durability (e.g., water resistance, plasticizer resistance, alcohol resistance) against various materials, and can ensure good running stability, as compared with the conventional protective material.