Abstract: An IC card is disclosed which comprises a card-shaped main substrate having a surface on which recess portions are formed and an edge portion having a connector layer with an external connector terminal pattern formed thereon, circuit modules embedded in the recess portions in main substrate, each module having electronic components including IC chips, a chip capacitor and a thin D.C. battery unit, and a double-layered wiring structure for providing electric connection between the electronic components and the connector terminal pattern. The double-layered wiring structure comprises a first wiring layer formed on the main substrate to cover the circuit modules and a second wiring layer formed insulatively above the former wiring layer. The first wiring layer has a first wiring pattern that extends in a first direction of the main substrate to be coupled to the electronic components.