Abstract: A wired circuit board for electrically connecting a suspension board with circuit comprising a metal supporting layer, an insulating base layer, a conductive layer, and an insulating cover layer, and an external circuit, includes a first wired circuit board electrically connected with the suspension board with circuit; and a second wired circuit board for electrically connecting with the external circuit. The first wired circuit board and the second wired circuit board are electrically connected through a preamplifier. The first wired circuit board includes a first metal supporting layer; a first insulating base layer; a first conductive layer and a first insulating cover layer.

Abstract: A base material in which a base insulating layer and a metallic layer are laminated is prepared. The metallic layer is processed into a predetermined pattern to form conductor patterns including terminal parts. A hole is formed in a region under a predetermined terminal part where the base insulating layer is formed by directing a laser beam from below. A reinforcing board having a through hole is attached to the lower surface of the base insulating layer by a sheet-like adhesive having a through hole, with the holes being aligned with one another. An opening space formed by the holes is filled with metallic paste by screen printing. In this way, a printed circuit board is fabricated. An electronic component is mounted on this printed circuit board.

Abstract: A wired circuit board for electrically connecting a suspension board with circuit comprising a metal supporting layer, an insulating base layer, a conductive layer, and an insulating cover layer, and an external circuit, includes a first wired circuit board electrically connected with the suspension board with circuit; and a second wired circuit board for electrically connecting with the external circuit. The first wired circuit board and the second wired circuit board are electrically connected through a preamplifier. The first wired circuit board includes a first metal supporting layer; a first insulating base layer; a first conductive layer and a first insulating cover layer.

Abstract: A base material in which a base insulating layer and a metallic layer are laminated is prepared. The metallic layer is processed into a predetermined pattern to form conductor patterns including terminal parts. A hole is formed in a region under a predetermined terminal part where the base insulating layer is formed by directing a laser beam from below. A reinforcing board having a through hole is attached to the lower surface of the base insulating layer by a sheet-like adhesive having a through hole, with the holes being aligned with one another. An opening space formed by the holes is filled with metallic paste by screen printing. In this way, a printed circuit board is fabricated. An electronic component is mounted on this printed circuit board.

Abstract: A flexible wired circuit board having a fine pitch conductor wiring pattern that can be produced with a high yield rate and improved productivity, includes a first and a second flexible wired circuit board which are disposed to be adjacent to each other on a supporting board so that a first and a second connection terminal are connected to a same electronic component. When a defect occurs in the first flexible wired circuit board in the production process in which the first conductor wiring pattern of the first flexible wired circuit board is formed into the fine pitch, only the defective first flexible wired circuit board can be screened out as a defective product. Thus, the first flexible wired circuit board having no defects can be selected for combination with the second flexible wired circuit board. Thus, the flexible wired circuit board can be produced in a high yield rate.

Abstract: An insulating substrate with metal foils on both sides thereof is prepared, and a through hole that passes through the metal foils and insulating substrate is formed. An electroless copper plating layer is formed on an inner surface of the through hole and a surface of each of the metal foils, followed by the formation of an electrolytic copper plating layer on the overall surface of the electroless copper plating layer. After removing the electrolytic copper plating layer except the portions on the inner surface and a peripheral region of the through hole, the metal foils are processed to form conductor patterns.

Abstract: An insulating substrate with metal foils on both sides thereof is prepared, and a through hole that passes through the metal foils and insulating substrate is formed. An electroless copper plating layer is formed on an inner surface of the through hole and a surface of each of the metal foils, followed by the formation of an electrolytic copper plating layer on the overall surface of the electroless copper plating layer. After removing the electrolytic copper plating layer except the portions on the inner surface and a peripheral region of the through hole, the metal foils are processed to form conductor patterns.

Abstract: To provide a flexible wired circuit board having a fine-pitch conductor wiring pattern that can be produced with a high yield rates and improved productivity, a first flexible wired circuit board and a second flexible wired circuit board are disposed to be adjacent to each other on a supporting board so that a first connection terminal and a second connection terminal are connected to a same electronic component. This flexible wired circuit board can provide the result that when a defect incurs in the first flexible wired circuit board in the production process in which the first conductor wiring pattern of the first flexible wired circuit board is formed into the fine pitch, only the first flexible wired circuit board having the defect can be screened out as a defective product, in other words, the first flexible wired circuit board having no defects can be selected for combination with the second flexible wired circuit board.